IPC's Study of Quality Benchmarks for Electronics Assembly 2018 is now available. The global study provides valuable benchmarking data to electronics assembly companies interested in comparing their quality measurements to those of the industry worldwide.
IPC announced today the July 2021 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.29.
IPC announced today the July 2021 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.42.
IPC's Validation Services Program has awarded an IPC J-STD-001, IPC-A-610 and IPC/WHMA-A-620 Qualified Manufacturers Listing (QML) Class 3, to the Lockheed Martin Rotary and Mission Systems (RMS) business area. Following an initial audit by IPC, Lockheed Martin RMS becomes one of the OEM trusted sources and suppliers meeting the stringent requirements of the Qualified Manufacturing Listing (QML) based on three of IPC's foremost standards: IPC J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies, IPC-A-610, Acceptability of Electronic Assemblies and IPC/WHMA-A-620, Requirements and Acceptance for Cable and Wire Harness Assemblies.
Economic recovery continues along a bumpy path. In this month’s economic outlook report, IPC’s Chief Economist Shawn DuBravac offers five key observations.
IPC's Validation Services Program announces that STI Electronics, Inc., a multifaceted technical organization supporting the electronics manufacturing industry, has been requalified, at the Class 3 level, to IPC J-STD-001 and IPC-A-610, and IPC J-STD-001 Space & Military Addendum Qualified Manufacturers Listing (QML).
Attendees, exhibitors, speakers, instructors, staff and all convention center contractors attending/working at IPC APEX EXPO 2022, to be held in-person January 22-27 at the San Diego Convention Center in San Diego, California, will be required to present either proof of full vaccination or a negative COVID-19 test (NCT) within 72 hours of arrival to enter the event.
IPC-2581C, Generic Requirement for Printed Board Assembly Product Manufacturing Description Data and Transfer Methodology is the eagerly anticipated update of IPC’s widely adopted global standard for PCB design through manufacturing data flow.
In a win for U.S. taxpayers, defense readiness, and the electronics industry supply chain, the U.S. House and Senate are poised this week to approve a defense spending bill that includes $5 million for research and development on the issues surrounding lead-free electronics in mission-critical applications.
Statement from John Mitchell, IPC president and CEO on final passage of National Defense Authorization Act (NDAA).