IPC has developed an annual international networking forum in India RegionIntegrated Electronics Manufacturing & Interconnections (IEMI). The two-day, two-city event will bring together designers, manufacturers, traders, suppliers, service providers, and technical experts to explore new business partnerships, gain technical knowledge, and source products & services
IPC has developed an annual international networking forum in India Region Integrated Electronics Manufacturing & Interconnections (IEMI). Event will bring together designers, manufacturers, traders, suppliers, service providers, and technical experts to explore new business partnerships, gain technical knowledge, and source products & services
Electronics manufacturers aim to minimize the amount of flux residues. Solder flux residues constitute a significant source of ionic contamination on the manufactured PCBAs, and the activator type in the flux determines their corrosiveness. The risk occurs on low standoff components, such as the QFN, due to blocked flux outgassing channels. The second risk is the number of soldering process steps used to build the assembly. Selective soldering, wave soldering, manual, and rework soldering can spread flux residues across the assembly. Pockets of active residue can be present when the flux is not fully heat-activated. For high reliability, the best practice is to clean the assembly.
This webinar will teach best practices for qualifying and validating acceptable electrical hardware performance. The methods taught during this presentation can be used to meet the requirements of IPC J-STD-001H ~ Section 8: Cleanliness.
Skilled soldering experts will be competing for 60 minutes on a complex circuit board assembly to win the 2024 National title, and earn a cash prize and a chance to compete at the IPC Hand Soldering World Championship.
Implementation of a new process, machine, or material triggers a qualification event for that change under the new H revision of IPC J-STD-001.
When a change in specific materials is being considered, one must determine and provide objective evidence that the improvement does not increase the quality or functionality risk of the product. In order to quantify the risk, the CM and/or OEM are required to acquire quantitative data before implementing the process change. The methodology developed in this webinar is designed to assist the user in incorporating specific tools and analytical measurements to ensure the product’s reliability via objective evidence and controls. This webinar illustrates the challenges of a real-life implementation of a new material change and the subsequent qualification.
IPC CEMAC (China Electronics Manufacturing Annual Conference) aims to create an open, friendly, and international platform for members to communicate and learn from each other.
High reliability is critical when electronics assemblies are working in harsh environments where there are high temperature differences and vibration.
High reliability is critical when electronics assemblies are working in harsh environments where there are high temperature differences and vibration.
To meet the needs of China's electronics industry, IPC Asia and Pudong New Area Association For Quality And Technology Shanghai, will jointly organize a comprehensive skill competition event – IPC Masters 2024 in Shanghai, China.
This webinar will describe available apprenticeship funding opportunities to support your workforce development costs. We aim to demystify these funding opportunities and make them more accessible. We understand that navigating the labyrinth of government funding can be overwhelming, which is how IPC can help.