Over the past 19 years, the National Electrical Wire Processing Technology Expo has grown into a comprehensive industry resource! As the exclusive showcase for the electrical wire harness, wire and cable processing industries, the Expo connects buyers with local, national, and international manufacturers and distributors. It’s the only event where the industry meets as a whole to present and access new technologies, innovative products and services, as well as solutions for challenging wire problems. By bringing together buyers and manufacturers, this Expo presents the ideal venue to find new opportunities and generate new business.
Contribute to the industry standards and guidelines that your company, customers, suppliers and competitors rely on by attending IPC standards development meetings. Newcomers and industry veterans are welcome. Participate and learn more about these critical industry documents.
While COVID related issues caused the cancellation of the February annual meeting the WHMA BOD asked to bring the WHMA community together via webinar to have an opportunity to stay connected. To this end, WHMA/IPC has organized the presentations below to be held by Zoom conference on February 17, 2021.
Taught by an IPC-certified industry expert with more than 30 years of experience in the field, this 6-week online program is designed to provide the knowledge and skills necessary to identify printed circuit board defects and determine corrective action.
The proliferation of electronics into harsh environments has however, highlighted the well-established link between process residues and electro-chemical migration (ECM) caused failures. Higher operational voltages, increased component densities, and assembly miniaturization, and increased reliability expectations increase the relationship between clean assemblies and long-term reliability.
Join IPC at Global Industrie March 25-28 in Paris, when we will host the IPC Forum, a program covering all aspects of the electronics manufacturing industry. Meet the best experts in the industry presenting on key industry topics.
A group of industry experts will discuss the evidence of the root causes of creep corrosion, relevant testing, and effective mitigation strategies available to prevent creep corrosion failures in electronics. Fundamentally, creep corrosion is the product of the reaction of copper with sulfur, which may be mitigated with manufacturing processes, such as the printed circuit board solder mask and surface finish, conformal coating, and enclosure levels, as well as during end use operation, such as filtration. Several types of harsh environmental test methods that are used to evaluate for product susceptibility to creep corrosion will also be reviewed.
Panelists include:
• Randy Schueller, Ph.D., Dell, Director, Client Reliability & Durability
• Christopher Genthe, Rockwell Automation, Senior Principal Engineer
• Paul Leone, Rockwell Automation, Principal Engineer
The International Microelectronics Assembly and Packaging Society (IMAPS) and IPC will host a three-day Workshop to discuss and promote strategies to improve On-Shoring Advanced Packaging and Assembly, April 29 - May 1, 2024, at The Westin Arlington, Arlington, VA.
This webinar will focus on circularity in electronics manufacturing, particularly on the recovery and reuse of integrated circuits (ICs).
Contribute to the industry standards and guidelines that your company, customers, suppliers and competitors rely on by attending IPC standards development meetings. Newcomers and industry veterans are welcome. Participate and learn more about these critical industry documents.