Members and exhibitors at the upcoming IPC APEX EXPO 2018 will have the opportunity to promote their new ideas in electronics by competing for the IPC APEX EXPO 2018 Innovation Awards, awards that recognize outstanding products and services for the electronics industry.
The 2021 Electrical Wire Processing Expo (EWPTE) originally scheduled at the Wisconsin Center in Milwaukee, Wis. for May 11-13, 2021 has been postponed to May 10-12, 2022.
The best technical conference paper of IPC APEX EXPO® 2018 has been selected. Voted on through a ballot process by members of the IPC APEX EXPO Technical Program Committee, the paper authors will receive their awards during the opening keynote session on Tuesday, February 27.
IPC — Association Connecting Electronics Industries® announced today that all 149,700 sq. ft. of exhibit floor space has sold out for IPC APEX EXPO® 2018, making it the largest IPC APEX EXPO in the last decade. The premier technical conference and exhibition will take place February 27–March 1, 2018, at the San Diego Convention Center.
IPC welcomes the “Buy American” Executive Order signed today by U.S. President Joe Biden. The COVID-19 pandemic has illustrated starkly the importance of building robust domestic manufacturing capabilities that the United States lacks today.
IPC's Validation Services Program is proud to announce the recertification of two IEC Electronics Corporation facilities, located in Newark, New York and Albuquerque, New Mexico. Both facilities are certified to IPC-J-STD-001, IPC-A-610 and IPC/WHMA-A-620 Qualified Manufacturers Listing (QML) at the Class 3 level.
IPC, the global association of electronics manufacturers, is applauding the U.S. Department of Defense (DoD) for establishing a new Defense Electronics Consortium (DEC).
IPC — Association Connecting Electronics Industries® Pb-free Electronics Risk Management (PERM) Council has developed the first single document dedicated solely to assisting design engineering in the development of electronics that are completely lead-free (Pb-free) and meet the demanding requirements of aerospace, defense and high performance (ADHP) products and systems.
IPC announced today the September 2021 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.25.
IPC announced today the July 2018 findings from its North American Printed Circuit Board (PCB) Statistical Program. Year-over-year growth continued for industry sales and orders. The book-to-bill ratio for July held steady at 1.05.