IPC announces the release of IPC-2551, International Standard for Digital Twins. This first international standard is comprised of digital twin product, manufacturing, and lifecycle frameworks. Using this standard, any manufacturer, design organization or solution provider can initiate application interoperability to create smart value chains.
IPC — Association Connecting Electronics Industries® announces the appointment of Chris Mitchell as its new vice president of global government relations. Mitchell starts his new position today, March 5, 2018, and will be based in IPC’s Washington, D.C. Office.
New and experienced managers will gather at the Managers Forum at IPC APEX EXPO on March 8 to discuss strategies for thriving during times of crisis.
IPC announces the addition of Yusaku Kono as IPC’s Japan Representative. As IPC’s Japan Representative, Kono will lead the association’s efforts in expanding member outreach, standards development, education and advocacy support in Japan. He is based in Tokyo, Japan.
IPC announced today the March 2021 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.22.
IPC announced today the March 2021 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.43.
IPC, in conjunction with Global Industrie/Midest, Snese and IFTEC, conducted an IPC Hand Soldering Competition in Paris on March 27-30, 2018. The competition was fierce as 48 competitors went soldering iron to soldering iron to compete for the coveted hand soldering competition crown. For the first time in the IPC hand soldering competition history, the top three winners came from the same company, Matra Electronique in France. Taking first place with a cash prize of €300 and winning a JBC soldering station was Nathalie Kaladgwe, who earned 440 points out of a possible 445. Kaladgwe will be invited to compete at the IPC World Championship Hand Soldering Competition at IPC APEX EXPO 2019, San Diego, in January 2019
The annual Quality Benchmark Study for Electronics Assembly, one of IPC’s most popular studies, is currently underway. The survey is online and available in both English and Mandarin Chinese. The deadline for participation has been extended to April 30.
IPC announced today the March 2018 findings from its North American Printed Circuit Board (PCB) Statistical Program. Industry shipments and orders continued to grow at a brisk pace in March. The book-to-bill ratio retreated from its peak but remained strong at 1.13.
In this month’s economic outlook report from IPC, you will find U.S. and European data on economic growth, employment, Manufacturer’s Sentiment (PMI), manufacturing capacity utilization and end markets for electronics.