IPC announced today the May 2021 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.11.
IPC announced today the May 2021 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.55.
If your company has e-textiles and/or stretchable technologies on its roadmap and you find yourself asking the question, “How can I merge smart fabrics with smart engineering?” IPC has developed a technical and business education workshop to answer these questions and more. IPC E-Textiles 2018 will take place on September 13, 2018 in Des Plaines, Ill., and will bring together innovators, technologists and engineers to collaborate, and identify partners and solutions to propel growth for the e-textiles market.
Global economic recovery is accelerating as vaccination rates increase and countries fully open their economies. In this month’s economic outlook report from IPC, you will find U.S. and European data on economic growth, employment, consumer sentiment, manufacturers’ sentiment (PMI), manufacturing capacity utilization and end markets for electronics.
IPC and Weiss Engineering have signed a cooperative agreement to deliver industry intelligence to the European electronics community, expanding on a partnership that began in 2020.
Reflecting input from IPC and its collaboration with Senator Joe Donnelly (D-IN), Section 862 of the bill calls on the Secretary of Defense, in consultation with the Executive Agent for Printed Circuit Board and Interconnect Technology (based at the Naval Surface Warfare Center in Crane, Indiana) and the Director of the Office of Management and Budget (OMB), to prepare a report to Congress by January 2019 on the health of the defense electronics industrial base.
IPC’s national hand soldering competitions return to Europe this year with events scheduled in France, Estonia, and Germany.
Hundreds of IPC standards development committee members will converge upon the Milwaukee Center in downtown Milwaukee, Wis., August 28-September 2, 2021 for IPC SummerCom. These standards development meetings mark the first time committee members have met face to face since February 2020.
The competition was fierce as 27 competitors went soldering iron to soldering iron in IPC’s Hand Soldering Regional Qualification Competition at SMT Hybrid Packaging 2018 in Nuremberg, Germany. Of the 27 boards submitted by the competitors only four of the electronic assemblies were functional. Taking first place and a cash prize of €300 was Catherine Cardinal-Simoan, Thales International, who earned 422 points out of a possible 445.
IPC announced today the June 2021 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.15.