IPC is now accepting abstracts for technical papers with presentations, posters, and professional development courses at IPC APEX EXPO 2025. The technical conference will be held March 18-20 and professional development courses will take place March 16-17 and 20, 2025 at the Anaheim Convention Center in Anaheim, Calif.
A new report by IPC, reveals Europe’s growing dependency on other regions for electronics manufacturing in critical and strategic sectors including aerospace and defence. Despite the adoption of the European Chips Act, the “Securing EU’s Electronics Ecosystem” report finds the EU’s market share in critical electronics components beyond chips, including printed circuit boards (PCBs), electronic manufacturing services (EMS) and advanced packaging, will decline to 15 percent by 2035.
During IPC APEX EXPO 2019, the IPC Education Foundation launched six IPC student chapters at: Auburn, North Carolina State, Sacramento State, Central Carolina Community College, Gwinnett Technical College, and Michigan Technical University. The student chapters at North Carolina State, Central Carolina Community College and Michigan Technical University provide examples of how industry can partner with education institutions to prepare engineering students with knowledge specific to the electronics industry.
The IPC Advanced Packaging Symposium held in Tokyo on June 7, 2024, brought together leading experts, policy makers and other stakeholders from the semiconductor industry to discuss cutting-edge advancements and collaborative strategies shaping the future of advanced packaging technologies.
IPC's Validation Services Program announces that STI Electronics, Inc., a multifaceted technical organization supporting the electronics manufacturing industry, has been requalified, at the Class 3 level, to IPC J-STD-001, IPC-A-610, and IPC J-STD-001 Space & Military Addendum Qualified Manufacturers Listings (QML). During the same requalification process, STI was also requalified as an IPC-1791, Trusted Electronic Designer, Fabricator and Assembler Requirements Qualified Manufacturers Listing (QML) Type 3 Assembler.
IPC announced today the May 2024 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.36.
IPC announced today the May 2024 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 0.95.
A new white paper from IPC’s Chief Technologist (CTC) and Design Leadership (DLC) Councils, Better Electronics by Design: Next Generation Design Needs explores the elements of the “Design for Excellence” methodology, re-thinking how it needs to be further defined and applied in the full ecosystem of electronics design.
Sentiment among electronics manufacturers fell in June; despite the decline, sentiment remains above its long-term average according to IPC’s June Sentiment of the Global Electronics Manufacturing Supply Chain Report.
The Global Electronics Association invites designers, engineers, researchers, and product‐development leaders to attend the 2nd Pan-European Electronics Design Conference (PEDC), taking place 21-22 January 2026 in Prague.