IPC and Weiss Engineering have signed a cooperative agreement to deliver industry intelligence to the European electronics community, expanding on a partnership that began in 2020.
IPC announced today the September 2021 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.25.
IPC announced today the July 2018 findings from its North American Printed Circuit Board (PCB) Statistical Program. Year-over-year growth continued for industry sales and orders. The book-to-bill ratio for July held steady at 1.05.
IPC announced today the September 2021 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.41.
IPC has released its October 2021 economic outlook report.
A new global survey found that the global shortage of semiconductors and other components continues to have serious consequences for electronics manufacturers, leading to rising costs and higher prices. The survey, conducted by IPC, the global electronics manufacturing association, also found that companies continue to face difficulty in finding qualified talent, with only 15 percent of respondents indicating that the situation is improving.
Details on the Tech Ed conference at WHMA 2022
IPC invites engineers, researchers, academics, technical experts and industry leaders to submit abstracts for IPC High Reliability Forum to be held May 14–16, 2019 in Hanover (Baltimore), Md.
A new study from IPC about the current state of advanced packaging in the semiconductor value chain finds that urgent action is required to strengthen domestic packaging ecosystem to meet increased production of semiconductor chips, without which the semiconductor supply chain is likely to remain weak and vulnerable.
IPC announced today the October 2021 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.15.