IPC announced today the February 2018 findings from its North American Printed Circuit Board (PCB) Statistical Program. Year-over-year shipment and order growth continued in February, and the book-to-bill ratio climbed to 1.17.
IPC has launched its newest workforce development training course, Wire Harness Assembly for Operators.
Don Dupriest, Lockheed Martin Missiles & Fire Control, has been elected chair of the IPC Technical Activities Executive Committee (TAEC) for a two-year term. Dupriest succeeds Chris Mahanna of Robisan Laboratory, Inc., who held the role for IPC's top standards development oversight committee for the past two years.
The fourth M-EXPO Wire Processing Technology exhibition (M-EXPO) will be held in Ciudad Juárez, Chihuahua, Mexico, September 21-22, 2022. Due to ongoing COVID-19 health and welfare concerns, the event will not be held in 2021.
C-level executives from top electronics companies across the United States – all members of IPC – will gather in Washington, D.C. on May 21-23 for discussions with members of Congress and the Administration on issues that are critical to the future of the electronics industry and U.S. economy. IMPACT Washington, D.C. 2018 is IPC’s premier advocacy event, presenting members with the opportunity to conduct high-level meetings with their elected officials.
Newly Appointed IPC APEX EXPO Technical Program Committee Calls for IPC APEX EXPO 2022 Participation
The newly appointed IPC APEX EXPO Technical Program Committee (TPC) is inviting engineers, researchers, academics, technical experts, and industry leaders to submit technical conference abstracts for IPC APEX EXPO 2022 to be held at the San Diego Convention Center. The technical conference will take place January 25–27, 2022.
PC and the Information Technology Industry Council (ITI) will host a virtual conference, “Critical and Emerging Environmental Product Requirements” on June 29 from 11:00 am to 3:30 pm EDT. The event will explore the latest environmental requirements that impact product design, manufacturing, supply chain management, and technology innovation.
IPC's Validation Services Program has awarded Ventec International Group, a global electronics materials manufacturing company headquartered in Suzhou, China, a second IPC-4101 Qualified Products Listing (QPL). Ventec successfully qualified their products, VT-90H and VT-901, to specification sheet 40 of IPC-4101E, Specification for Base Materials for Rigid and Multilayer Printed Boards
More than 50 CEOs urged Commerce Secretary Gina Raimondo to take concrete steps to address challenges confronting the entire U.S. electronics supply chain.
IPC announced today the April 2021 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.16.