IPC announced today the June 2022 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.03.
The U.S. electronics manufacturing industry is applauding the U.S. Senate for taking bipartisan action on legislation that will, if enacted, spur a new era of innovation, manufacturing and investment within the electronics industry.
IPC issued a news statement from President and CEO John Mitchell on today’s passage of the “CHIPS+” legislation in the U.S. House of Representatives, which follows Senate approval and paves the way to U.S. President Joe Biden’s signature.
PC's Validation Services Program has awarded an IPC J-STD-001 and IPC-A-610 Qualified Manufacturers Listing (QML) to DFI, Inc., a leading supplier of high-performance embedded solutions, industrial motherboards and custom products technology, worldwide.
IPC President and CEO John Mitchell issues news statement commenting on President Biden’s signature today on the “CHIPS and Science Act” in Washington, D.C.:
IPC's Study of Quality Benchmarks for Electronics Assembly 2022 is now available.
IPC has announced the July 2022 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.39.
IPC has announced the July 2022 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 0.98.
IPC’s Validation Services program has awarded an IPC-1791, Trusted Electronics Designer Requirements Qualified Manufacturer Listing (QML) to Fralock, located in Valencia, Calif.
IPC's Validation Services Program has awarded an IPC-4101 Qualified Products Listing (QPL) to Taiwan Union Technology Corporation (TUC), an electronics materials manufacturing company headquartered in Zhubei, Hsinchu County, Taiwan.