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Five IPC APEX EXPO Exhibiting Companies Earn 2019 Innovation Awards

IPC announces the winners of the IPC APEX EXPO 2019 Innovation Awards, a celebration of the innovators and forward thinkers who are changing the technological landscape of the electronics industry.

Volunteers Honored for Contributions to IPC and the Electronics Industry

IPC presented Committee Leadership, Special Recognition and Distinguished Committee Service Awards on January 28 and January 30 at IPC APEX EXPO 2019 at the San Diego Convention Center. The awards were presented to individuals who made significant contributions to IPC and the industry by lending their time and expertise through IPC committee service.

Success of CHIPS Act Depends on Quickly Establishing a Pilot Facility for Integrated Circuit Substrates, Tech Leaders Warn

The success of the CHIPS for America program depends on establishing a U.S. pilot facility for manufacturing integrated circuit (IC) substrates; and getting it done sooner, incrementally, is better than doing it perfectly, according to a new industry report.

IPC Announces New Thought Leaders Program Experts

IPC has revamped its Thought Leaders Program (TLP) an initiative designed to “mine” key industry experts’ insight and knowledge on issues driving change within the electronics industry.

North American EMS Industry Up 5.1 Percent in February

IPC announced today the February 2023 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.30.

North American PCB Industry Sales Up 5.6 Percent in February

IPC announced today the February 2023 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 0.99.

Despite Growing Economic Uncertainties, the Electronics Manufacturing Industry Remains Upbeat

Per IPC’s March 2023 Global Sentiment of the Electronics Supply Chain Report, the last month delivered another month of stable industry sentiment: industry demand appears to remain intact, production holds steady and some labor challenges may be receding.

IPC Applauds New U.S.-Canada Partnership to Strengthen Advanced Packaging and Printed Circuit Board Manufacturing in North America

The following is statement by John W. Mitchell, president and CEO of IPC, the global electronics manufacturing association, on the joint statement today of U.S. President Joe Biden and Canadian Prime Minister Justin Trudeau:   

IPC Welcomes U.S. Presidential Determination Prioritizing Domestic Development of Printed Circuit Boards and IC Substrates

IPC welcomes the “presidential determination” that prioritizes the domestic development of printed circuit boards (PCBs) and advanced packaging, including IC substrates, under Title III of the Defense Production Act (DPA).

Global Banking Crisis Signals Economic Volatility, Signs of Recession

IPC Issues March Economic Outlook Report

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