In March, the White House Office of Science and Technology Policy (OSTP) unveiled a strategy aimed at catalyzing microelectronics innovation in the United States.

A new video released today by IPC says “focusing on chips just isn’t enough” when it comes to ensuring America’s resilience and security. Instead, the U.S. Government should

Leaders of IPC member companies descended on Washington, D.C. on Wednesday, May 15 for the first IPC Impact Day of 2024. IPC Impact Days are a chance for industry executives

Today, IPC delivered a letter to Congress signed by 49 industry executives urging them to sustain current investments in the electronics industrial base or risk putting the

The Interdisciplinary Center for Advanced Manufacturing Systems (ICAMS) at Auburn University is again conducting a study on behalf of the Department of Defense to understand

Today, March 27, is the first anniversary of U.S. President Joe Biden’s “presidential determination” (PD) on printed circuit boards (PCBs), advanced packaging, and IC

Although politics and theater may have permeated President Joe Biden’s State of the Union address on Thursday night, there were several points when the substantive interests

The European Commission published on 27 February its Communication on advanced materials. The Communication sets out the proposed approach to develop industrial leadership

Today at the White House, leaders from the Departments of Commerce, Defense, and Energy; the National Science Foundation; and the National Center for the Advancement of