The Interdisciplinary Center for Advanced Manufacturing Systems (ICAMS) at Auburn University is again conducting a study on behalf of the Department of Defense to understand

Today, March 27, is the first anniversary of U.S. President Joe Biden’s “presidential determination” (PD) on printed circuit boards (PCBs), advanced packaging, and IC

Although politics and theater may have permeated President Joe Biden’s State of the Union address on Thursday night, there were several points when the substantive interests

The European Commission published on 27 February its Communication on advanced materials. The Communication sets out the proposed approach to develop industrial leadership

Today at the White House, leaders from the Departments of Commerce, Defense, and Energy; the National Science Foundation; and the National Center for the Advancement of

IPC joined with the Printed Circuit Board Association of America (PCBAA) to deliver a letter to Congress today that was signed by 54 member companies. The impactful letter

The latest political stalemate over the federal budget is creating headaches for programs of importance to the electronics industry. The federal government is now almost four

IPC appreciated the opportunity to participate in a January 16, 2024 workshop organized by the European Commission to collect feedback on needs, challenges, and drivers for

This afternoon the U.S. Department of Defense (DOD) released a long anticipated National Defense Industrial Strategy (NDIS).