IPC-7621 offers cost-effect alternative to potting IPC announces a new standard, IPC-7621, Guideline for Design, Material Selection and General Application of Encapsulation of

IPC President and CEO John Mitchell and IPC Vice President of Global Government Relations Chris Mitchell talk to PCB Chat host and Circuits Assembly and Printed Circuit Design

IPC’s advocacy efforts in Europe have grown significantly over the past few years.

John Mitchell, IPC president and CEO, extends a special invitation to IPC APEX EXPO 2018. https://www.youtube.com/watch?v=r-xcKwdz9iU&feature=youtu.be

By John Perry, Director of Printed Board Standards & Technology It has been well known that for many years IPC has provided a trio of performance classifications in its suite

Learn about the IPC E-Textiles standards committee seeking new comments on a draft of new e-textiles standard.