IPC Masters Competition China 2026
The IPC Electronics Assembly Masters Competition, established in 2010, attracts participants from core sectors of the electronics manufacturing industry, including defense, aerospace, rail transportation, automotive electronics, communications, and consumer electronics.
Cable & Wire Harness Competition 2026 - Regional Qualification France
Introduced in France for the first time, the Cable & Wire Harness Competition (CWH) will take place during Global Industrie 2026 in Paris Nord Villepinte. This competition invites skilled technicians and harness assembly specialists to demonstrate their expertise in wire preparation, crimping, splicing, and assembly, all in accordance with the requirements of IPC/WHMA-A-620, the consensus industry standard for cable and wire harness assemblies.
IPC Hand Soldering Competition 2026 - Regional Qualification France
Join the France Regional Qualification for the IPC Hand Soldering Competition (HSC) at Global Industrie 2026 in Paris Nord Villepinte on 30 March – 2 April 2026.
Introduction to PCB Design II
In this course, participants employ the lessons learned in Introduction to PCB Design I to effectively implement their designs using techniques such as multi-layer routing, signal integrity, transmission lines, and more. The course also focuses on how manufacturing and assembly techniques impact design, documentation and manufacturing file generation.
PCB Design for Emerging Design Technologies
This course is intended for individuals who have completed or possess the equivalent skills or experience from PCB Fundamentals Parts 1 & 2 and who need further experience with design, manufacturing, packaging, and routing challenges for products that require advanced and emerging technologies to solve design challenges, including high-speed digital designs.
Introduction to PCB Design I - Southeast Asia
This introductory course will focus on front-end design concepts such as schematic capture, library parts creation, basic electrical engineering concepts, and documentation.