Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
Presentación
Unique Implementation of a 15 Layer,Unboned/Looseleaf,Bookbinder Rigid Flex with Backdrill and LGA Interconnect
While flex and rigid flex (IPC-6013 Types 1 through 4i[1]) have always been important in 3D packaging to help resolve space constraints and meet other design requirements,the continued push for
.. leer más
Smart Factory at Fuyong
The highly-automated and connection-driven methods in Electronics Manufacturing is a more and more important topic in the industry today. Advances in modern manufacturing technologies make fact
.. leer más
Will the "Internet of Manufacturing" Really Affect Business?
With technology these days,we often find solutions without a problem,rather than the other way around. The concept of the “Internet of Manufacturing” (IoM),combined with the evolution toward au
.. leer más
IPC-1782 Standard for Traceability Supporting Counterfeit Components
Traceability has grown from being a specialized need for certain safety critical segments of the industry,to now being a recognized value-add tool for the industry as a whole. The perception of
.. leer más
2.5D and 3D Semiconductor Package Technology: Evolution and Innovation
The electronics industry is experiencing a renaissance in semiconductor package technology. A growing number of innovative 3D package assembly methodologies have evolved to enable the electroni
.. leer más
Low Profile Embedded Magnetics for RF Communication Systems
Portable electronics demand that inductors and transformers be implemented in low profile surface mount packages. In communication systems,magnetic components are used for impedance matching,vo
.. leer más
NSOP Reduction for QFN RFIC Packages
Wire bonded packages using conventional copper leadframe have been used in industry for quite some time. The growth of portable and wireless products is driving the miniaturization of packages
.. leer más
Challenges on ENEPIG Finished PCBs: Gold Ball Bonding and Pad Metal Lift
As a surface finish for PCBs,Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) was selected over Electroless Nickel/Immersion Gold (ENIG) for CMOS image sensor applications with
.. leer más
An Investigation into the Use of Nano-Coated Stencils to Improve Solder Paste Printing with Small Aperture Area Ratios
Certain types of nano-coated stencils dramatically improve the transfer efficiency of solder paste during paste printing. These nano-coatings also refine the solder paste brick shape giving imp
.. leer más
Comparison of Site Printing Performance for Rework - Adhesive Backed Plastic versus Mini Metal Stencils
Ever since there has been a widespread usage of surface mount parts,the trend of continued shrinkage of devices with ever finer pitches has continued to challenge PCB assemblers for the rework
.. leer más
Mitigation of Pure Tin Risk by Tin-Lead SMT Reflow - Results of an Industry Round-Robin
The risk associated with whisker growth from pure tin solderable terminations is fully mitigated when all of the pure tin is dissolved into tin-lead solder during SMT reflow. In order to take f
.. leer más
To Quantify a Wetting Balance Curve
Wetting balance testing has been an industry standard for evaluating the solderability of final finishes on printed circuit boards (PCB) for many years. A Wetting Balance Curve showing Force as
.. leer más
Additive Manufacturing in a Supply Chain Solution Provider Environment
Additive Manufacturing has recently been brought into the spotlight as an alternative manufacturing method. While there are many different additive manufacturing technologies,the two that will
.. leer más
21st Century PCB FAB Factory Design Which Eliminates Regional Cost Advantages
Over fifteen years has passed since North America and Europe ceased being the center of worldwide PCB fabrication,and were supplanted by a Far East market with low cost labor,more relaxed envir
.. leer más
RoHS Substance Measurements in Complex Products
With the wide breadth of component types used in complex electronic equipment,implementation of the European Union Restriction of Hazardous Substances 2011/65/EU/ (RoHS) is a challenge. A low v
.. leer más
PCB Cleanliness Assessment Methodologies - A Comparative Study
PCB manufacturers use a wide variety of solder pastes and fluxes including No-Clean,RMA and OA,both leaded and lead-free within their processes. As part of the manufacturing process,components
.. leer más
Void Reduction in Reflow Soldering Processes by Sweep Stimulation of PCB Substrate
Due to the ongoing trend towards miniaturization of power components,the need for increased thermal conductivity of solder joints in SMT processes gains more and more importance. Therefore,the
.. leer más
Controlling Voiding Mechanisms in the Reflow Soldering Process
While a significant level of voiding can be tolerated in solder joints where electrical conductivity is the main requirement,voiding at any level severely compromises thermal conductivity. For
.. leer más
Novel Thermally Conductive Low Pressure Overmold Materials as a Solution for Thermal Management
The dissipation of heat from a power die,such as those used to drive the increasingly popular LED arrays,has traditionally been achieved by use of a thermal interface material (TIM) and a metal
.. leer más
Can Lower Temperature Solderable Adhesive Replace SAC Paste
The electronic industry is currently very interested in low temperature soldering processes,such as using Sn/Bi alloy,to improve process yield,eliminate the head-in-pillow effect,and enhance re
.. leer más
Thermal Profile Variation and PCB Reliability
When designing PCBs,solder paste selection is critical. Once a specific paste type and supplier are identified,the manufacturing process is developed and refined. Critical to the quality of the
.. leer más
Does Solder Particle Size Impact the Electrical Reliability of a No-Clean Solder Paste Flux Residue
No-clean soldering processes continue to dominate the electronics manufacturing world,especially amongst consumer-type electronics. For many years,type 3 was pretty much the “standard” solder p
.. leer más
Solderability and Reliability Evolution of no-Clean Solder Fluxes for Selective Soldering
Flux consumption for wave soldering tends to decrease,mainly due to its gradual replacement by reflow soldering methods (i.e. pin-in-paste) in many electronics applications. However,in several
.. leer más
Factors Affecting the Adhesion of Thin Film Copper on Polyimide
The use of copper foils laminated to polyimide (PI) as flexible printed circuit board precursor is a standard practice in the PCB industry. We have previously described [1] an approach to very
.. leer más
Approaches to Commercializing New Nano-Electronic Materials
•Nano-electronics potential
•Barriers to entry – and opportunities
•Examples
–Nano-solder
–Capacitor materials
–Graphene
•Opportunities for rapid commercialization?
.. leer más
Improved Maintenance and Reliability for Large Volume Underfill Processes
An ever-increasing number of electronics assembly applications are using flip chip packages that require large volume underfill. Large volume underfill is typically defined as being for a die s
.. leer más
A Review of Jetting Technologies for Fluid Dispensing - Identifying the Features that Influence Productivity
As consumer products continue to reduce in price,pressure is placed upon the manufacturing of sub-components for improving cost. Back in the mid-1990s,jet valves for fluid dispensing in electro
.. leer más
Utility of Dual Applicators for Non-Atomized Conformal Coating to Improve High-Volume Manufacturing Optimization
Electronics manufacturers protect their circuit boards with conformal coatings. Conformal coatings serve as a barrier from environmental hazards and internal shorts,tin whiskers,and corrosion a
.. leer más
PCB Sourcing Using PCQR
In a global market,it is often difficult to determine the best PCB suppliers for your technology needs,while also achieving the lowest costs for your products. Considering each PCB supplier has
.. leer más
Test Method Development for Detecting Pitting/Crevice Corrosion Formation on Electronic Assemblies
Pitting/Crevice corrosion on printed circuit boards has not been well studied in the industry. This mechanism has been seen at small solder mask openings near circuit traces on printed circuit
.. leer más
Unique Implementation of a 15 Layer,Unboned/Looseleaf,Bookbinder Rigid Flex with Backdrill and LGA Interconnect
While flex and rigid flex (IPC-6013 Types 1 through 4i[1]) have always been important in 3D packaging to help resolve space constraints and meet other design requirements,the continued push for
.. leer más
Smart Factory at Fuyong
The highly-automated and connection-driven methods in Electronics Manufacturing is a more and more important topic in the industry today. Advances in modern manufacturing technologies make fact
.. leer más
Will the "Internet of Manufacturing" Really Affect Business?
With technology these days,we often find solutions without a problem,rather than the other way around. The concept of the “Internet of Manufacturing” (IoM),combined with the evolution toward au
.. leer más
IPC-1782 Standard for Traceability Supporting Counterfeit Components
Traceability has grown from being a specialized need for certain safety critical segments of the industry,to now being a recognized value-add tool for the industry as a whole. The perception of
.. leer más
2.5D and 3D Semiconductor Package Technology: Evolution and Innovation
The electronics industry is experiencing a renaissance in semiconductor package technology. A growing number of innovative 3D package assembly methodologies have evolved to enable the electroni
.. leer más
Low Profile Embedded Magnetics for RF Communication Systems
Portable electronics demand that inductors and transformers be implemented in low profile surface mount packages. In communication systems,magnetic components are used for impedance matching,vo
.. leer más
NSOP Reduction for QFN RFIC Packages
Wire bonded packages using conventional copper leadframe have been used in industry for quite some time. The growth of portable and wireless products is driving the miniaturization of packages
.. leer más
Challenges on ENEPIG Finished PCBs: Gold Ball Bonding and Pad Metal Lift
As a surface finish for PCBs,Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) was selected over Electroless Nickel/Immersion Gold (ENIG) for CMOS image sensor applications with
.. leer más
An Investigation into the Use of Nano-Coated Stencils to Improve Solder Paste Printing with Small Aperture Area Ratios
Certain types of nano-coated stencils dramatically improve the transfer efficiency of solder paste during paste printing. These nano-coatings also refine the solder paste brick shape giving imp
.. leer más
Comparison of Site Printing Performance for Rework - Adhesive Backed Plastic versus Mini Metal Stencils
Ever since there has been a widespread usage of surface mount parts,the trend of continued shrinkage of devices with ever finer pitches has continued to challenge PCB assemblers for the rework
.. leer más
Mitigation of Pure Tin Risk by Tin-Lead SMT Reflow - Results of an Industry Round-Robin
The risk associated with whisker growth from pure tin solderable terminations is fully mitigated when all of the pure tin is dissolved into tin-lead solder during SMT reflow. In order to take f
.. leer más
To Quantify a Wetting Balance Curve
Wetting balance testing has been an industry standard for evaluating the solderability of final finishes on printed circuit boards (PCB) for many years. A Wetting Balance Curve showing Force as
.. leer más
Additive Manufacturing in a Supply Chain Solution Provider Environment
Additive Manufacturing has recently been brought into the spotlight as an alternative manufacturing method. While there are many different additive manufacturing technologies,the two that will
.. leer más
21st Century PCB FAB Factory Design Which Eliminates Regional Cost Advantages
Over fifteen years has passed since North America and Europe ceased being the center of worldwide PCB fabrication,and were supplanted by a Far East market with low cost labor,more relaxed envir
.. leer más
RoHS Substance Measurements in Complex Products
With the wide breadth of component types used in complex electronic equipment,implementation of the European Union Restriction of Hazardous Substances 2011/65/EU/ (RoHS) is a challenge. A low v
.. leer más
PCB Cleanliness Assessment Methodologies - A Comparative Study
PCB manufacturers use a wide variety of solder pastes and fluxes including No-Clean,RMA and OA,both leaded and lead-free within their processes. As part of the manufacturing process,components
.. leer más
Void Reduction in Reflow Soldering Processes by Sweep Stimulation of PCB Substrate
Due to the ongoing trend towards miniaturization of power components,the need for increased thermal conductivity of solder joints in SMT processes gains more and more importance. Therefore,the
.. leer más
Controlling Voiding Mechanisms in the Reflow Soldering Process
While a significant level of voiding can be tolerated in solder joints where electrical conductivity is the main requirement,voiding at any level severely compromises thermal conductivity. For
.. leer más
Novel Thermally Conductive Low Pressure Overmold Materials as a Solution for Thermal Management
The dissipation of heat from a power die,such as those used to drive the increasingly popular LED arrays,has traditionally been achieved by use of a thermal interface material (TIM) and a metal
.. leer más
Can Lower Temperature Solderable Adhesive Replace SAC Paste
The electronic industry is currently very interested in low temperature soldering processes,such as using Sn/Bi alloy,to improve process yield,eliminate the head-in-pillow effect,and enhance re
.. leer más
Thermal Profile Variation and PCB Reliability
When designing PCBs,solder paste selection is critical. Once a specific paste type and supplier are identified,the manufacturing process is developed and refined. Critical to the quality of the
.. leer más
Does Solder Particle Size Impact the Electrical Reliability of a No-Clean Solder Paste Flux Residue
No-clean soldering processes continue to dominate the electronics manufacturing world,especially amongst consumer-type electronics. For many years,type 3 was pretty much the “standard” solder p
.. leer más
Solderability and Reliability Evolution of no-Clean Solder Fluxes for Selective Soldering
Flux consumption for wave soldering tends to decrease,mainly due to its gradual replacement by reflow soldering methods (i.e. pin-in-paste) in many electronics applications. However,in several
.. leer más
Factors Affecting the Adhesion of Thin Film Copper on Polyimide
The use of copper foils laminated to polyimide (PI) as flexible printed circuit board precursor is a standard practice in the PCB industry. We have previously described [1] an approach to very
.. leer más
Approaches to Commercializing New Nano-Electronic Materials
•Nano-electronics potential
•Barriers to entry – and opportunities
•Examples
–Nano-solder
–Capacitor materials
–Graphene
•Opportunities for rapid commercialization?
.. leer más
Improved Maintenance and Reliability for Large Volume Underfill Processes
An ever-increasing number of electronics assembly applications are using flip chip packages that require large volume underfill. Large volume underfill is typically defined as being for a die s
.. leer más
A Review of Jetting Technologies for Fluid Dispensing - Identifying the Features that Influence Productivity
As consumer products continue to reduce in price,pressure is placed upon the manufacturing of sub-components for improving cost. Back in the mid-1990s,jet valves for fluid dispensing in electro
.. leer más
Utility of Dual Applicators for Non-Atomized Conformal Coating to Improve High-Volume Manufacturing Optimization
Electronics manufacturers protect their circuit boards with conformal coatings. Conformal coatings serve as a barrier from environmental hazards and internal shorts,tin whiskers,and corrosion a
.. leer más
PCB Sourcing Using PCQR
In a global market,it is often difficult to determine the best PCB suppliers for your technology needs,while also achieving the lowest costs for your products. Considering each PCB supplier has
.. leer más
Test Method Development for Detecting Pitting/Crevice Corrosion Formation on Electronic Assemblies
Pitting/Crevice corrosion on printed circuit boards has not been well studied in the industry. This mechanism has been seen at small solder mask openings near circuit traces on printed circuit
.. leer más