Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
Presentación
High Frequency Dk and Df Test Methods Comparison High Density User Group (HDP) Project
The High Density Packaging (HDP) user group has completed a project to evaluate the majority of viable Dk (Dielectric Constant)/Df (Dissipation Factor) and delay/loss electrical test methods,wi
.. leer más
Characterization of Printed Circuit Board Material & Manufacturing Technology for High Frequency
Today's Electronic Industry is changing at a high pace. The root causes are manifold. So world population is growing up to eight billions and gives new challenges in terms of urbanization,mobil
.. leer más
The Effects of PCB Fabrication on High-Frequency Electrical Performance
Achieving optimum high-frequency printed-circuit-board (PCB) performance is not simply a matter of specifying the best possible PCB material,but can be significantly impacted by PCB fabrication
.. leer más
Evaluation of Under-Stencil-Cleaning-Papers
Solder paste screen printing is known to be one of the most difficult processes to quality assure in Printed Board Assembly (PBA) manufacturing. An important process step in solder paste screen
.. leer más
Selecting Stencil Technologies to Optimize Print Performance
The SMT stencil is a key factor in the solder paste printing process. It has been shown repeatedly that print quality has the largest impact on end-of-line quality,and a good print process can
.. leer más
Enabling High-Speed Printing Using Low Cost Materials: Process Stability is Paramount
The rapid growth of electronic devices across the globe is driving manufacturers to enhance high-speed mass production techniques in the printed circuit board assembly arena. As manufacturers d
.. leer más
A High Reliability,Stress-free Copper Deposit for FPC,Polyimide,and Rigid-Flex
Today’s wide variety of laminate materials and specialized dielectric choices pose a challenge for process engineering. In particular,smooth surfaces,such as polyimide,flex circuit substrates a
.. leer más
Reliability Implications of Pinhole Defects in Soldermask
What are the Raw Material Risks?
-Today PCB Suppliers handle a range of customers with different end use environments
-Telecommunications
-Automotive
-Consumer electronics
-
.. leer más
A Novel Conformal Back-Up Material and Process for Drilling Plated Circuit Boards
Interconnects between layers of circuitry in multilayer printed circuit boards are produced by drilling and plating. Drilling quality can have a major impact on the longevity of the plated inte
.. leer más
Acceptance Testing of Low-Ag Reflow Solder Alloys
Since the implementation of the European Union RoHS directive in 2006,the electronics industry has seen an expansion of available low-silver lead (Pb)-free alloys for wave soldering,miniwave re
.. leer más
Reliability Study of Low Silver Alloy Solder Pastes
Sn3.0Ag0.5Cu (SAC305) is currently the most popular near eutectic lead-free alloy used in the manufacturing processes. Over the last several years,the price of silver has dramatically increased
.. leer más
Investigation of Low Temperature Solders to Reduce Reflow Temperature,Improve SMT Yields,and Realize Energy Savings
The miniaturization of electronic devices demands the continued shrinking of system z-height. A significant consequence of these ultra-thin systems is yield loss due to high temperature warpage
.. leer más
Streamlining PCB Assembly and Test NPI with Shared Component Libraries
PCB assembly designs become more complex year-on-year,yet early-stage form/fit compliance verification of all designed-in components to the intended manufacturing processes remains a challenge.
.. leer más
Flexibility Testing of Printed and Wearable Electronics
•Introduction to printed and wearable electronics
•Flexibility testing challenges
•Proposals for flexibility testing
•Validation case studies
•Future work
.. leer más
Sustainable Product Design and Supplier Material Disclosure
Sustainable product design and the task of bringing new,earth friendly products to market is a top priority for corporate leaders in the manufacturing industry. By not reaching their compliance
.. leer más
Rigid-Flex PCB Right the First Time - Without Paper Dolls
The biggest problem with designing rigid-flex hybrid PCBs is making sure everything will fold in the right way,while maintaining good flex-circuit stability and lifespan. The next big problem t
.. leer más
Selective Reflow Rework Process
In the rework environment,most equipment and procedures are designed for low volume repair/rework process. When a high volume rework is needed,the challenges begin. For example,a long cycle tim
.. leer más
Effectiveness of Different Materials as Heat Shields during Reflow/Rework
As device density continues to maximize the PCB real estate the reflowing of neighboring components or damaging of heat-sensitive components in the rework process continues to cause problems. D
.. leer más
Investigation into Challenges of using .BSDL Files: iNEMI Survey Results and Conclusions
The number one issue identified by the 2009 International Electronics Manufacturing Initiative (iNEMI) Boundary-Scan survey was problems with obtaining correct and compliant boundary-scan descr
.. leer más
Causes and Costs of No Fault Found Events
No-Fault-Found (NFF) events occur when a system level test,such as built-in test (BIT),indicates a failure but no such failure is found during repair. With more electronics continuously monitor
.. leer más
3D Assembly Processes a Look at Today and Tomorrow
The world of electronics continues to increase functional densities on products. One of the ways to increase density of a product is to utilize more of the 3 dimensional spaces available. Tradi
.. leer más
New Approaches to Develop a Scalable 3D IC Assembly Method
The challenge for 3D IC assembly is how to manage warpage and thin wafer handling in order to achieve a high assembly yield and to ensure that the final structure can pass the specified reliabi
.. leer más
Control of the Underfill of Surface Mount Assemblies by Non-Destructive Techniques
Underfilling is a long-standing process issued from the micro-electronics that can enhance the robustness and the reliability of first or second-level interconnects for a variety of electronic
.. leer más
A Lower Temperature Solder Joint Encapsulant for Sn/Bi Applications
The electronic industry is currently very interested in low temperature soldering processes such as using Sn/Bi alloy to improve process yield,eliminate the head-in-pillow effect,and enhance re
.. leer más
Re-Shoring or Near-Shoring Concepts Should be Strongly Considered when the OEM's Goal is to Deliver Optimum Balance Between Landed Cost...
The old tactic of outsourcing to a low cost geography simply to deliver lowest cost direct and indirect labor was never a panacea supply chain solution. In fact,when evaluating solutions for lo
.. leer más
How Reshoring Drives Profitability
For many years,manufacturing has sought to increase competitiveness by moving off-shore to countries with lower labour costs. Electronic manufacturing services (EMS) companies provided an essen
.. leer más
Influence of Salt Residues on BGA Head in Pillow
The oxide layers are known as wetting inhibitors in component and PCB metallizations. The oxide acts as barrier that prevent the tin diffusion from happening. Besides,in corrosion studies,the r
.. leer más
Refining Stencil Design to Counter HiP Defects
Head-In-Pillow (HIP) defects,in which the BGA solder balls and paste deposit come in contact but do not coalesce,have proven to be a major problem since transitioning to RoHS soldering. Compone
.. leer más
Testing Printed Circuit Boards for Creep Corrosion in Flowers of Sulfur Chamber: Phase 2A
The iNEMI technical subcommittee on creep corrosion is developing a flowers-of-sulfur (FOS) based qualification test for creep corrosion on printed-circuit boards (PCBs). In phase 1 of the proj
.. leer más
High Frequency Dk and Df Test Methods Comparison High Density User Group (HDP) Project
The High Density Packaging (HDP) user group has completed a project to evaluate the majority of viable Dk (Dielectric Constant)/Df (Dissipation Factor) and delay/loss electrical test methods,wi
.. leer más
Characterization of Printed Circuit Board Material & Manufacturing Technology for High Frequency
Today's Electronic Industry is changing at a high pace. The root causes are manifold. So world population is growing up to eight billions and gives new challenges in terms of urbanization,mobil
.. leer más
The Effects of PCB Fabrication on High-Frequency Electrical Performance
Achieving optimum high-frequency printed-circuit-board (PCB) performance is not simply a matter of specifying the best possible PCB material,but can be significantly impacted by PCB fabrication
.. leer más
Evaluation of Under-Stencil-Cleaning-Papers
Solder paste screen printing is known to be one of the most difficult processes to quality assure in Printed Board Assembly (PBA) manufacturing. An important process step in solder paste screen
.. leer más
Selecting Stencil Technologies to Optimize Print Performance
The SMT stencil is a key factor in the solder paste printing process. It has been shown repeatedly that print quality has the largest impact on end-of-line quality,and a good print process can
.. leer más
Enabling High-Speed Printing Using Low Cost Materials: Process Stability is Paramount
The rapid growth of electronic devices across the globe is driving manufacturers to enhance high-speed mass production techniques in the printed circuit board assembly arena. As manufacturers d
.. leer más
A High Reliability,Stress-free Copper Deposit for FPC,Polyimide,and Rigid-Flex
Today’s wide variety of laminate materials and specialized dielectric choices pose a challenge for process engineering. In particular,smooth surfaces,such as polyimide,flex circuit substrates a
.. leer más
Reliability Implications of Pinhole Defects in Soldermask
What are the Raw Material Risks?
-Today PCB Suppliers handle a range of customers with different end use environments
-Telecommunications
-Automotive
-Consumer electronics
-
.. leer más
A Novel Conformal Back-Up Material and Process for Drilling Plated Circuit Boards
Interconnects between layers of circuitry in multilayer printed circuit boards are produced by drilling and plating. Drilling quality can have a major impact on the longevity of the plated inte
.. leer más
Acceptance Testing of Low-Ag Reflow Solder Alloys
Since the implementation of the European Union RoHS directive in 2006,the electronics industry has seen an expansion of available low-silver lead (Pb)-free alloys for wave soldering,miniwave re
.. leer más
Reliability Study of Low Silver Alloy Solder Pastes
Sn3.0Ag0.5Cu (SAC305) is currently the most popular near eutectic lead-free alloy used in the manufacturing processes. Over the last several years,the price of silver has dramatically increased
.. leer más
Investigation of Low Temperature Solders to Reduce Reflow Temperature,Improve SMT Yields,and Realize Energy Savings
The miniaturization of electronic devices demands the continued shrinking of system z-height. A significant consequence of these ultra-thin systems is yield loss due to high temperature warpage
.. leer más
Streamlining PCB Assembly and Test NPI with Shared Component Libraries
PCB assembly designs become more complex year-on-year,yet early-stage form/fit compliance verification of all designed-in components to the intended manufacturing processes remains a challenge.
.. leer más
Flexibility Testing of Printed and Wearable Electronics
•Introduction to printed and wearable electronics
•Flexibility testing challenges
•Proposals for flexibility testing
•Validation case studies
•Future work
.. leer más
Sustainable Product Design and Supplier Material Disclosure
Sustainable product design and the task of bringing new,earth friendly products to market is a top priority for corporate leaders in the manufacturing industry. By not reaching their compliance
.. leer más
Rigid-Flex PCB Right the First Time - Without Paper Dolls
The biggest problem with designing rigid-flex hybrid PCBs is making sure everything will fold in the right way,while maintaining good flex-circuit stability and lifespan. The next big problem t
.. leer más
Selective Reflow Rework Process
In the rework environment,most equipment and procedures are designed for low volume repair/rework process. When a high volume rework is needed,the challenges begin. For example,a long cycle tim
.. leer más
Effectiveness of Different Materials as Heat Shields during Reflow/Rework
As device density continues to maximize the PCB real estate the reflowing of neighboring components or damaging of heat-sensitive components in the rework process continues to cause problems. D
.. leer más
Investigation into Challenges of using .BSDL Files: iNEMI Survey Results and Conclusions
The number one issue identified by the 2009 International Electronics Manufacturing Initiative (iNEMI) Boundary-Scan survey was problems with obtaining correct and compliant boundary-scan descr
.. leer más
Causes and Costs of No Fault Found Events
No-Fault-Found (NFF) events occur when a system level test,such as built-in test (BIT),indicates a failure but no such failure is found during repair. With more electronics continuously monitor
.. leer más
3D Assembly Processes a Look at Today and Tomorrow
The world of electronics continues to increase functional densities on products. One of the ways to increase density of a product is to utilize more of the 3 dimensional spaces available. Tradi
.. leer más
New Approaches to Develop a Scalable 3D IC Assembly Method
The challenge for 3D IC assembly is how to manage warpage and thin wafer handling in order to achieve a high assembly yield and to ensure that the final structure can pass the specified reliabi
.. leer más
Control of the Underfill of Surface Mount Assemblies by Non-Destructive Techniques
Underfilling is a long-standing process issued from the micro-electronics that can enhance the robustness and the reliability of first or second-level interconnects for a variety of electronic
.. leer más
A Lower Temperature Solder Joint Encapsulant for Sn/Bi Applications
The electronic industry is currently very interested in low temperature soldering processes such as using Sn/Bi alloy to improve process yield,eliminate the head-in-pillow effect,and enhance re
.. leer más
Re-Shoring or Near-Shoring Concepts Should be Strongly Considered when the OEM's Goal is to Deliver Optimum Balance Between Landed Cost...
The old tactic of outsourcing to a low cost geography simply to deliver lowest cost direct and indirect labor was never a panacea supply chain solution. In fact,when evaluating solutions for lo
.. leer más
How Reshoring Drives Profitability
For many years,manufacturing has sought to increase competitiveness by moving off-shore to countries with lower labour costs. Electronic manufacturing services (EMS) companies provided an essen
.. leer más
Influence of Salt Residues on BGA Head in Pillow
The oxide layers are known as wetting inhibitors in component and PCB metallizations. The oxide acts as barrier that prevent the tin diffusion from happening. Besides,in corrosion studies,the r
.. leer más
Refining Stencil Design to Counter HiP Defects
Head-In-Pillow (HIP) defects,in which the BGA solder balls and paste deposit come in contact but do not coalesce,have proven to be a major problem since transitioning to RoHS soldering. Compone
.. leer más
Testing Printed Circuit Boards for Creep Corrosion in Flowers of Sulfur Chamber: Phase 2A
The iNEMI technical subcommittee on creep corrosion is developing a flowers-of-sulfur (FOS) based qualification test for creep corrosion on printed-circuit boards (PCBs). In phase 1 of the proj
.. leer más