Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
Presentación
Voiding Mechanism and Control in Mixed Solder Alloy System
•Transition to Pb-free soldering is incomplete for high reliability or high temperature applications
•For those not fully converted into Pb-free,mixed system is common due to lack of some Pb-co
.. leer más
Method to Measure Intermetallic Layer Thickness and Its Application to Develop a New Equation to Predict Its Growth
Lead Free Technology has brought new materials and different quality concerns to the Electronics Industry. For that,the creation of new methods to determine the quality of materials is needed a
.. leer más
Assembly Materials for High Temperature Application
Based on the trend for new technology in the automotive market including high power modules for e-mobility,and a combination of logic and power which will be developed for the future market wit
.. leer más
Reliability of Lead-Free LGAs and BGAs: Effects of Solder Joint Size,Cyclic Strain and Microstructure
An accelerated thermal cycle experiment comparing similarly constructed area array devices representing Land Grid Array
(LGA) and Ball Grid Array (BGA) technology with 0.254,0.30,and 0.40mm dia
.. leer más
Quantitative Analysis of Corrosion Resistance for Electroless Ni-P Plating
An electroless nickel (EN) layer is frequently used in various industrial applications. Commonly it is used as the barrier layer in electroless nickel/immersion gold (ENIG) as a solderability p
.. leer más
Simulation of Embedded Components in PCB Environment and Verification of Board Reliability
Embedded components technology has launched its implementation in volume products demanding for highest miniaturization level. Small modules with embedded dies and passive components on the top
.. leer más
Embedded Passive Technology
Embedded Passive Technology is a viable technology that has been reliably used in the defense and aerospace industry for over 20 years. Embedded Passive (Resistors and Capacitors) Technology ha
.. leer más
Warpage Optimization of Printed Circuit Boards with Embedded Active and Passive Components
Importance of the properties during curing:
- Curing analysis has to be carried in a PCB level to improve understanding warpage mechanism. Specially it is very important in a laminating process
.. leer más
Insertion Loss Comparisons of Common High Frequency PCB Constructions
Printed Circuit Boards (PCB’s) have been used for many years in low loss,high frequency microwave applications and many of these circuits have become increasingly complex. Often these complex c
.. leer más
Influence of Via Stub Length and Antipad Size on the Insertion Loss Profile
The growing transmission speed and volume of digital content increases the pressure on reduction of overall insertion loss of printed circuit boards permanently.
In today’s circuit boards,it is
.. leer más
Embedded System Access - a Paradigm Shift in Electrical Test
Throughout a product’s life cycle it may need to be tested various times. New product designs need to be validated during the prototyping phase,manufacturing defects need to be detected and dia
.. leer más
Why Signal Always Be Loss in a High Speed Frequency Transmission Line
The high speed transmission applications in the electronic product become inevitable developing trend. The signal integrity becomes the most important issue in the electronic industry. The mate
.. leer más
Advanced Second Level Assembly Analysis Techniques - Troubleshooting Head-In-Pillow,Opens,and Shorts with Dual Full-Field 3D Surface Warpage Data Sets
SMT assembly planning and failure analysis of surface mount assembly defects often include component warpage evaluation. Coplanarity values of Integrated Circuit packages have traditionally bee
.. leer más
Head in Pillow X-ray Inspection at Flextronics
Manufacturing technology faces challenges with new packages/process when confronting the need for high yields. Identifying product defects associated with the manufacturing process is a critica
.. leer más
Online Databse of Materials for Printed Electronics
Materials Registry for Printed Electronics
- WMU’s CAPE received an award from FlexTech Alliance to create an online database for accessing technical information on functional materials used in
.. leer más
Improving Yields and Quality: Two Case Studies: Graping and the Head-on-Pillow defect
HoP Mitigation is addressed with respect to solder paste,components,inspection,process and the environment.
Graping minimization recommendations are given with data driven suggestions.
.. leer más
Gravure Printing of ITO Transparent Electrodes for Applications in Printed Electronics
ITO nanoparticles were successfully printed on glass with the AccuPress Gravure System
•A wide range of sheet resistivity values was achieved with different engraving resolutions of the gravure
.. leer más
Printed & Flexible Electronics – Surf’s Up
Printed & Flexible Electronics
• Development Waves – 1st,2nd,and 3rd
• Essentials
• Products and Applications
• Technology and Infrastructure Development
• Printed & Flexible Electronics Pipeli
.. leer más
Mixed Metals Impact on Reliability
With the adoption of RoHS and implementation of Lead Free solders a major concern is how this will impact reliability. Both commercial and military hardware are impacted by this change even tho
.. leer más
Testing Intermetallic Fragility on Enig upon Addition of Limitless Cu
As reliability requirements increase,especially for defense and aerospace applications,the need to characterize components used in electronic assembly also increases. OEM and EMS companies look
.. leer más
Assessment of Reterminated RoHS Components for SnPb Applications
The banning of Pb in electronic component termination finishes has flushed through the supply chain making it impossible in some cases for hi-reliability users to purchase Pb containing interco
.. leer más
The Coming of The MultiChip Module
MultiChip Module Status
•It isn’t a new idea since back in the 1980’s everyone was trying to combine different components into a single package
•It started with Hybrids then different forms of
.. leer más
BVA: Molded Cu Wire Contact Solution for Very High Density Package-on- Package (PoP) Applications
Stacking heterogeneous semiconductor die (memory and logic) within the same package outline can be considered for less complex applications but combining the memory and processor functions in a
.. leer más
Printed Circuit Structures,the Evolution of Printed Circuit Boards
The Printed Circuit Board (PCB) is the backbone of electronics and a large number of consumer devices. The challenge to put more function in a smaller space requires more components utilizing s
.. leer más
Cost effective 3D Glass Microfabrication for Advanced Electronic Packages
Interposer technologies are gathering more importance in IC packaging as the industry continues miniaturization trends in microfabrication nodes and IC packaging to meet design and utility need
.. leer más
TOF SIMS Analysis for SnxOy Determination on Lead-Free HASL PCB’s
During the production of Lead-Free Hot Air Solder Leveling (LF HASL),non-wetting issues in several components were found including BGA pad. The common visual aspect of the suspicious pads was t
.. leer más
Improving Density in Microwave Multilayer Printed Circuit Boards for Space Applications
The need in complexity for microwave space products such as active BFNs (Beam Forming Networks) is increasing,with a significantly growing number of amplitude / phase control points (number of
.. leer más
Behavior of Materials in the Manufacturing Environment
This study was conducted to understand seven materials reliability,behavior of Dielectric constant and Dissipation factor over medium to high frequencies. A modified version of HDPUG design was
.. leer más
Nanomaterials Performance Advantages in Printed Electronics Addressing Implementation Issues
Nanotechnology is a key enabling technology for printed electronics. Low temperature reactivity,reaction speeds,flexibility and fine pitch considerations dictate that nanomaterials should be gi
.. leer más
Phototonic Curing: Broad Implications in Printed Electronics
•Photonic curing uses high-intensity flash lamps to selectively heat target materials.
•The PulseForge tools are based on the patented use of photonic curing and are designed for use in develop
.. leer más
Voiding Mechanism and Control in Mixed Solder Alloy System
•Transition to Pb-free soldering is incomplete for high reliability or high temperature applications
•For those not fully converted into Pb-free,mixed system is common due to lack of some Pb-co
.. leer más
Method to Measure Intermetallic Layer Thickness and Its Application to Develop a New Equation to Predict Its Growth
Lead Free Technology has brought new materials and different quality concerns to the Electronics Industry. For that,the creation of new methods to determine the quality of materials is needed a
.. leer más
Assembly Materials for High Temperature Application
Based on the trend for new technology in the automotive market including high power modules for e-mobility,and a combination of logic and power which will be developed for the future market wit
.. leer más
Reliability of Lead-Free LGAs and BGAs: Effects of Solder Joint Size,Cyclic Strain and Microstructure
An accelerated thermal cycle experiment comparing similarly constructed area array devices representing Land Grid Array
(LGA) and Ball Grid Array (BGA) technology with 0.254,0.30,and 0.40mm dia
.. leer más
Quantitative Analysis of Corrosion Resistance for Electroless Ni-P Plating
An electroless nickel (EN) layer is frequently used in various industrial applications. Commonly it is used as the barrier layer in electroless nickel/immersion gold (ENIG) as a solderability p
.. leer más
Simulation of Embedded Components in PCB Environment and Verification of Board Reliability
Embedded components technology has launched its implementation in volume products demanding for highest miniaturization level. Small modules with embedded dies and passive components on the top
.. leer más
Embedded Passive Technology
Embedded Passive Technology is a viable technology that has been reliably used in the defense and aerospace industry for over 20 years. Embedded Passive (Resistors and Capacitors) Technology ha
.. leer más
Warpage Optimization of Printed Circuit Boards with Embedded Active and Passive Components
Importance of the properties during curing:
- Curing analysis has to be carried in a PCB level to improve understanding warpage mechanism. Specially it is very important in a laminating process
.. leer más
Insertion Loss Comparisons of Common High Frequency PCB Constructions
Printed Circuit Boards (PCB’s) have been used for many years in low loss,high frequency microwave applications and many of these circuits have become increasingly complex. Often these complex c
.. leer más
Influence of Via Stub Length and Antipad Size on the Insertion Loss Profile
The growing transmission speed and volume of digital content increases the pressure on reduction of overall insertion loss of printed circuit boards permanently.
In today’s circuit boards,it is
.. leer más
Embedded System Access - a Paradigm Shift in Electrical Test
Throughout a product’s life cycle it may need to be tested various times. New product designs need to be validated during the prototyping phase,manufacturing defects need to be detected and dia
.. leer más
Why Signal Always Be Loss in a High Speed Frequency Transmission Line
The high speed transmission applications in the electronic product become inevitable developing trend. The signal integrity becomes the most important issue in the electronic industry. The mate
.. leer más
Advanced Second Level Assembly Analysis Techniques - Troubleshooting Head-In-Pillow,Opens,and Shorts with Dual Full-Field 3D Surface Warpage Data Sets
SMT assembly planning and failure analysis of surface mount assembly defects often include component warpage evaluation. Coplanarity values of Integrated Circuit packages have traditionally bee
.. leer más
Head in Pillow X-ray Inspection at Flextronics
Manufacturing technology faces challenges with new packages/process when confronting the need for high yields. Identifying product defects associated with the manufacturing process is a critica
.. leer más
Online Databse of Materials for Printed Electronics
Materials Registry for Printed Electronics
- WMU’s CAPE received an award from FlexTech Alliance to create an online database for accessing technical information on functional materials used in
.. leer más
Improving Yields and Quality: Two Case Studies: Graping and the Head-on-Pillow defect
HoP Mitigation is addressed with respect to solder paste,components,inspection,process and the environment.
Graping minimization recommendations are given with data driven suggestions.
.. leer más
Gravure Printing of ITO Transparent Electrodes for Applications in Printed Electronics
ITO nanoparticles were successfully printed on glass with the AccuPress Gravure System
•A wide range of sheet resistivity values was achieved with different engraving resolutions of the gravure
.. leer más
Printed & Flexible Electronics – Surf’s Up
Printed & Flexible Electronics
• Development Waves – 1st,2nd,and 3rd
• Essentials
• Products and Applications
• Technology and Infrastructure Development
• Printed & Flexible Electronics Pipeli
.. leer más
Mixed Metals Impact on Reliability
With the adoption of RoHS and implementation of Lead Free solders a major concern is how this will impact reliability. Both commercial and military hardware are impacted by this change even tho
.. leer más
Testing Intermetallic Fragility on Enig upon Addition of Limitless Cu
As reliability requirements increase,especially for defense and aerospace applications,the need to characterize components used in electronic assembly also increases. OEM and EMS companies look
.. leer más
Assessment of Reterminated RoHS Components for SnPb Applications
The banning of Pb in electronic component termination finishes has flushed through the supply chain making it impossible in some cases for hi-reliability users to purchase Pb containing interco
.. leer más
The Coming of The MultiChip Module
MultiChip Module Status
•It isn’t a new idea since back in the 1980’s everyone was trying to combine different components into a single package
•It started with Hybrids then different forms of
.. leer más
BVA: Molded Cu Wire Contact Solution for Very High Density Package-on- Package (PoP) Applications
Stacking heterogeneous semiconductor die (memory and logic) within the same package outline can be considered for less complex applications but combining the memory and processor functions in a
.. leer más
Printed Circuit Structures,the Evolution of Printed Circuit Boards
The Printed Circuit Board (PCB) is the backbone of electronics and a large number of consumer devices. The challenge to put more function in a smaller space requires more components utilizing s
.. leer más
Cost effective 3D Glass Microfabrication for Advanced Electronic Packages
Interposer technologies are gathering more importance in IC packaging as the industry continues miniaturization trends in microfabrication nodes and IC packaging to meet design and utility need
.. leer más
TOF SIMS Analysis for SnxOy Determination on Lead-Free HASL PCB’s
During the production of Lead-Free Hot Air Solder Leveling (LF HASL),non-wetting issues in several components were found including BGA pad. The common visual aspect of the suspicious pads was t
.. leer más
Improving Density in Microwave Multilayer Printed Circuit Boards for Space Applications
The need in complexity for microwave space products such as active BFNs (Beam Forming Networks) is increasing,with a significantly growing number of amplitude / phase control points (number of
.. leer más
Behavior of Materials in the Manufacturing Environment
This study was conducted to understand seven materials reliability,behavior of Dielectric constant and Dissipation factor over medium to high frequencies. A modified version of HDPUG design was
.. leer más
Nanomaterials Performance Advantages in Printed Electronics Addressing Implementation Issues
Nanotechnology is a key enabling technology for printed electronics. Low temperature reactivity,reaction speeds,flexibility and fine pitch considerations dictate that nanomaterials should be gi
.. leer más
Phototonic Curing: Broad Implications in Printed Electronics
•Photonic curing uses high-intensity flash lamps to selectively heat target materials.
•The PulseForge tools are based on the patented use of photonic curing and are designed for use in develop
.. leer más