Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
Presentación
Miniaturization with Help of Reduced Component to Component Spacing
Miniaturization and the integration of a growing number of functions in portable electronic devices require an extremely high packaging density for the active and passive components. There are
.. leer más
Challenges of Manufacturing with Printed Circuit Board Cavities
Cavity technology in a Printed Circuit Board (PCB) has existed for many years. The methodology to create the cavity in the PCB has evolved over time as technologies have advanced and the manufa
.. leer más
Alternative Concepts for High Speed,High Frequency and Signal Integration into the PCB
Transmission of data is a major driver in the electronics industry. Higher data volumes,high speed data transfer and short time signal transmission have to be realized to meet these requirement
.. leer más
Printing of Solder Paste – A Quality Assurance Methodology
Solder paste printing is known to be one of the most difficult processes to quality assure in electronic manufacturing. The challenge increases as the technology development moves toward a mix
.. leer más
Jetting Strategies for mBGAs a question of give and take...
The demands on volume delivery and positioning accuracy for solder paste deposits are increasing as the size and complexity of circuits continue to develop in the electronics industry. Accordin
.. leer más
Implementing Embedded Component from Concept-To-Manufacturing
The utilization of embedded components has increased across many applications in various industries,and with rapid emergence of technologies and the need to secure IP,new methodologies are bein
.. leer más
Embedded Components: A Comparative Analysis of Reliability Part II
In light of new process and product technologies in the field of embedded components,questions arise with respect to advantages and potential disadvantages to standard SMT component placement w
.. leer más
Reliability of Embedded Planar Capacitors: A Review
Embedded capacitors offer board designers the ability to address the demands of high switching speeds and high I/O count packages while stemming the proliferation of minute decoupling capacitor
.. leer más
Tin Whisker Risk Management by Conformal Coating
The objective of this study is to evaluate conformal coatings for mitigation of tin whisker growth. The conformal coatings chosen for the experiment are acrylic,polyurethane and parylene. The c
.. leer más
Testing Printed Circuit Boards for Creep Corrosion in Flowers of Sulfur Chamber
The iNEMI technical subcommittee on creep corrosion is developing a flowers-of-sulfur (FOS) based qualification test for creep corrosion on printed-circuit boards (PCBs). The test setup consist
.. leer más
Effectiveness of Conformal Coat to Prevent Corrosion of Nickel-palladium-gold-finished Terminals
Nickel-palladium-gold-finished terminals are susceptible to creep corrosion. Excessive creep corrosion can result in device failure due to insulation resistance loss between adjacent terminals.
.. leer más
The Effect of Radiation Losses on High Frequency PCB Performance
This paper is an extension of an IPC paper [1] presented last year which addressed microwave insertion loss of common PCB transmission line circuits. Insertion loss of these circuits is made up
.. leer más
Insertion Loss Reduction through Non-Roughening Inner-Layer Surface Treatments
As channel speeds approach 25 Gbps,near the expected maximum bandwidth for traditional copper-based PCBs,every available tool to minimize total insertion loss in the board material system will
.. leer más
Solder Paste Stencil Design for Optimal QFN Yield and Reliability
The use of bottom terminated components (BTC) has become widespread,specifically the use of Quad Flat No-lead (QFN) packages. The small outline and low height of this package type,improved elec
.. leer más
Reliability Study of Bottom Terminated Components
Bottom terminated components (BTC) are leadless components where terminations are protectively plated on the underside of the package. They are all slightly different and have different names,s
.. leer más
AXI Applications with BTC and Connectors in Flextronics
Bottom Termination surface mount Components (BTC) are extremely popular because of their low cost,low stand-off height and excellent thermal and electrical properties. In this manufacturing are
.. leer más
Color Logical Analysis Approach for LED Testing in Manufacturing
Complexity of test development for LED test and long LED test execution time in production are big challenges faced by the PCB manufacturing industry. This paper introduces a parallel multi-cha
.. leer más
Reduce Design Time and Product Lifecycle Costs with Functional Blocks Common to Designs and Test Fixtures
This paper proposes an integrated design and test strategy which uses functional design blocks common to both designs and test fixtures,with the aim of saving time and money. Benefits of this s
.. leer más
SJIT,Solder Joint Integrity Test,To Find Latent Defects in Printed Wiring Board
To find defects of solder joint in printed wiring board assembly,quite a few test methods have been developed so far.
Capacitance method and IEEE 1149.1 or boundary scan method are often used t
.. leer más
The use of an available Color Sensor for Burn-In of LED Products
In today’s world it is important that a product has sufficient accreditation that it can be enter many different market places. While accreditation can be a costly process,it is prudent to know
.. leer más
Current and Emerging Gaps in Standards for Semiconductor Assembly Materials in the Era of 2.5D and 3D Dimensional Devices
What’s the Future of Interposers for Semiconductor IC Packaging?
.. leer más
Methodology to Predict Mechanical Strength and Pad Cratering Failures under BGA Pads on Printed Circuit Boards
In the past few years,several papers,test methods and methodologies have been developed to estimate pad cratering under Ball Grid Array (BGA) pads in Printed Circuit Board Assemblies (PCBAs).
.. leer más
Double Reflow-Induced Interfacial Failures in Pb-free Ball Grid Array Solder Joints
Assembly defects can effectively shorten reliability lifetimes in addition to lowering manufacturing yields or creating premature service failures. This paper describes and characterizes an unu
.. leer más
Rework and Reliability of High I/O Column Grid Array Assemblies
Commercial-off-the-shelf column grid array packaging (COTS CGA) technologies in high reliability versions are now being considered for use in a number of National Aeronautics and Space Administ
.. leer más
Advanced Rework Technology and Processes for Next Generation Large Area Arrays,01005,PoP and QFN Devices
BGA Rework is now largely mature,although new supplemental processes that provide improved process control such as
Solder Paste Dipping and Non-Contact Site Cleaning can now be integrated into
.. leer más
EOS Exposure of Components in Soldering Process
This paper examines the nature; the consequences and the mitigation of electrical overstress (EOS) caused by electromagnetic interference (EMI),or electrical noise,on power lines and ground in
.. leer más
Cleaning Of Assembled PCBs A Crucial Way of Enhancing Product Reliability and Avoiding Problems in the Field
Over the last years more and more International newspapers reported in Europe / USA and Japan: “Tunnel train got stuck under the Channel – thousands of people stranded “Recall of thousands of c
.. leer más
Miniaturization with Help of Reduced Component to Component Spacing
Miniaturization and the integration of a growing number of functions in portable electronic devices require an extremely high packaging density for the active and passive components. There are
.. leer más
Challenges of Manufacturing with Printed Circuit Board Cavities
Cavity technology in a Printed Circuit Board (PCB) has existed for many years. The methodology to create the cavity in the PCB has evolved over time as technologies have advanced and the manufa
.. leer más
Alternative Concepts for High Speed,High Frequency and Signal Integration into the PCB
Transmission of data is a major driver in the electronics industry. Higher data volumes,high speed data transfer and short time signal transmission have to be realized to meet these requirement
.. leer más
Printing of Solder Paste – A Quality Assurance Methodology
Solder paste printing is known to be one of the most difficult processes to quality assure in electronic manufacturing. The challenge increases as the technology development moves toward a mix
.. leer más
Jetting Strategies for mBGAs a question of give and take...
The demands on volume delivery and positioning accuracy for solder paste deposits are increasing as the size and complexity of circuits continue to develop in the electronics industry. Accordin
.. leer más
Implementing Embedded Component from Concept-To-Manufacturing
The utilization of embedded components has increased across many applications in various industries,and with rapid emergence of technologies and the need to secure IP,new methodologies are bein
.. leer más
Embedded Components: A Comparative Analysis of Reliability Part II
In light of new process and product technologies in the field of embedded components,questions arise with respect to advantages and potential disadvantages to standard SMT component placement w
.. leer más
Reliability of Embedded Planar Capacitors: A Review
Embedded capacitors offer board designers the ability to address the demands of high switching speeds and high I/O count packages while stemming the proliferation of minute decoupling capacitor
.. leer más
Tin Whisker Risk Management by Conformal Coating
The objective of this study is to evaluate conformal coatings for mitigation of tin whisker growth. The conformal coatings chosen for the experiment are acrylic,polyurethane and parylene. The c
.. leer más
Testing Printed Circuit Boards for Creep Corrosion in Flowers of Sulfur Chamber
The iNEMI technical subcommittee on creep corrosion is developing a flowers-of-sulfur (FOS) based qualification test for creep corrosion on printed-circuit boards (PCBs). The test setup consist
.. leer más
Effectiveness of Conformal Coat to Prevent Corrosion of Nickel-palladium-gold-finished Terminals
Nickel-palladium-gold-finished terminals are susceptible to creep corrosion. Excessive creep corrosion can result in device failure due to insulation resistance loss between adjacent terminals.
.. leer más
The Effect of Radiation Losses on High Frequency PCB Performance
This paper is an extension of an IPC paper [1] presented last year which addressed microwave insertion loss of common PCB transmission line circuits. Insertion loss of these circuits is made up
.. leer más
Insertion Loss Reduction through Non-Roughening Inner-Layer Surface Treatments
As channel speeds approach 25 Gbps,near the expected maximum bandwidth for traditional copper-based PCBs,every available tool to minimize total insertion loss in the board material system will
.. leer más
Solder Paste Stencil Design for Optimal QFN Yield and Reliability
The use of bottom terminated components (BTC) has become widespread,specifically the use of Quad Flat No-lead (QFN) packages. The small outline and low height of this package type,improved elec
.. leer más
Reliability Study of Bottom Terminated Components
Bottom terminated components (BTC) are leadless components where terminations are protectively plated on the underside of the package. They are all slightly different and have different names,s
.. leer más
AXI Applications with BTC and Connectors in Flextronics
Bottom Termination surface mount Components (BTC) are extremely popular because of their low cost,low stand-off height and excellent thermal and electrical properties. In this manufacturing are
.. leer más
Color Logical Analysis Approach for LED Testing in Manufacturing
Complexity of test development for LED test and long LED test execution time in production are big challenges faced by the PCB manufacturing industry. This paper introduces a parallel multi-cha
.. leer más
Reduce Design Time and Product Lifecycle Costs with Functional Blocks Common to Designs and Test Fixtures
This paper proposes an integrated design and test strategy which uses functional design blocks common to both designs and test fixtures,with the aim of saving time and money. Benefits of this s
.. leer más
SJIT,Solder Joint Integrity Test,To Find Latent Defects in Printed Wiring Board
To find defects of solder joint in printed wiring board assembly,quite a few test methods have been developed so far.
Capacitance method and IEEE 1149.1 or boundary scan method are often used t
.. leer más
The use of an available Color Sensor for Burn-In of LED Products
In today’s world it is important that a product has sufficient accreditation that it can be enter many different market places. While accreditation can be a costly process,it is prudent to know
.. leer más
Current and Emerging Gaps in Standards for Semiconductor Assembly Materials in the Era of 2.5D and 3D Dimensional Devices
What’s the Future of Interposers for Semiconductor IC Packaging?
.. leer más
Methodology to Predict Mechanical Strength and Pad Cratering Failures under BGA Pads on Printed Circuit Boards
In the past few years,several papers,test methods and methodologies have been developed to estimate pad cratering under Ball Grid Array (BGA) pads in Printed Circuit Board Assemblies (PCBAs).
.. leer más
Double Reflow-Induced Interfacial Failures in Pb-free Ball Grid Array Solder Joints
Assembly defects can effectively shorten reliability lifetimes in addition to lowering manufacturing yields or creating premature service failures. This paper describes and characterizes an unu
.. leer más
Rework and Reliability of High I/O Column Grid Array Assemblies
Commercial-off-the-shelf column grid array packaging (COTS CGA) technologies in high reliability versions are now being considered for use in a number of National Aeronautics and Space Administ
.. leer más
Advanced Rework Technology and Processes for Next Generation Large Area Arrays,01005,PoP and QFN Devices
BGA Rework is now largely mature,although new supplemental processes that provide improved process control such as
Solder Paste Dipping and Non-Contact Site Cleaning can now be integrated into
.. leer más
EOS Exposure of Components in Soldering Process
This paper examines the nature; the consequences and the mitigation of electrical overstress (EOS) caused by electromagnetic interference (EMI),or electrical noise,on power lines and ground in
.. leer más
Cleaning Of Assembled PCBs A Crucial Way of Enhancing Product Reliability and Avoiding Problems in the Field
Over the last years more and more International newspapers reported in Europe / USA and Japan: “Tunnel train got stuck under the Channel – thousands of people stranded “Recall of thousands of c
.. leer más