Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
Presentación
The Effect of Powder Surface Area and Oxidation on the Voiding Performance of PoP Solder Pastes
With the miniaturization of components in the semiconductor industry,the need for specialized solder pastes with finer
powder mesh sizes for package-on-package (PoP) assemblies has become imper
.. leer más
SMT Manufacturability and Reliability in PCB Cavities
Considering technological advances in multi-depth cavities in the PCB manufacturing industry,various subtopics have materialized regarding the processing and application of such features in dev
.. leer más
Challenges for Step Stencils with Design Guidelines for Solder Paste Printing
The stencil printing process is one of the most critical processes in the electronic production. Due to the requirement: “faster and smaller” it is necessary to place components with different
.. leer más
Virtual Access Technique Augments Test Coverage on Limited Access PCB Assemblies
Increased pressures to reduce time to market and time to volume have forced many manufacturers of populated printed circuit boards to rely on capacitively coupled,un-powered,vectorless in-circu
.. leer más
Testing DDR Memory
Testing DDR memories on Printed Circuit Boards has steadily gotten more difficult. Most such memories do not have any on-chip Design-for-Test features. Adequate test access is a disappearing lu
.. leer más
Corrosion Resistance of Different PCB Surface Finishes in Harsh Environments
Corrosion resistance is becoming one of the most important topics in the electronics industry. Corrosion results in field
failures and huge losses,which annually total several billion U.S. doll
.. leer más
The Surface Finish Effect on the Creep Corrosion in PCB
Creep corrosion normally happens in the end system,PCB,connectors and components are widely noted due to the exposure of
high sulfur environments under elevated humidity. In this study,the majo
.. leer más
Detailed Analysis of Impedance and Loss versus Frequency for Transmission Lines Made From Flexible Circuit Materials
With the emergence of high speed,controlled impedance circuits requiring increasingly tight tolerances,there is a realization among designers and fabricators that more precise data is needed th
.. leer más
Thermal Characteristics of PCB Laminates used in High Frequency Applications
As technology advances,understanding thermal management issues of high frequency PCB’s increases. There are many different aspects to consider for PCB thermal management. This paper will invest
.. leer más
The Application of Spherical Bend Testing to Predict Safe Working Manufacturing Process Strains
The increased temperatures associated with lead free processes have produced significant challenges for PWB laminates.
Newly developed laminates have different curing processes,are commonly fil
.. leer más
Investigation of Pad Cratering in Large Flip-Chip BGA using Acoustic Emission
Electronics assemblies with large flip-chip BGA packages can be prone to either pad cratering or brittle intermetallic (IMC)
failures under excessive PCB bending. Pad cratering cracks are not d
.. leer más
PAD CRATERING
- What is Pad Cratering?
- Pad Craters
- Pad Cratering… Opens Circuits
- How is the Electronics Industry dealing with this Defect Mode?
- What does this have in common with a Pad Cratering solu
.. leer más
Assembly and Reliability of 1704 I/O FCBGA and FPBGAs
Commercial-off-the-shelf ball/column grid array packaging (COTS BGA/CGA) technologies in high reliability versions are now being considered for use in a number of National Aeronautics and Space
.. leer más
The Relationship between Backward Compatible Assembly and Microstructure on the Thermal Fatigue Reliability of an Extremely Large Ball Grid Array
Accelerated temperature cycling was used to evaluate the thermal fatigue reliability for the case of backward compatible
assembly (mixed alloy,Pb-free BGA/SnPb paste) of a 3162 pin count,extrem
.. leer más
Reliability of BGA Solder Joints after Re-Balling Process
Due to the obsolescence of SnPb BGA components,electronics manufacturers that use SnPb solder paste either have to use
lead-free BGAs and adjust the reflow process or re-ball these components w
.. leer más
Warpage Issues and Assembly Challenges Using Coreless Package Substrate
Coreless technology in package substrate has been developed to satisfy the increasing demand of lighter,smaller and superior electrical performance regarding as the future trend in electronic a
.. leer más
An Investigation into the Predictability of PCB Coplanarity for Room vs. Lead Free Assembly Temperatures
With the advent of larger packages and higher densities/pitch the Industry has been concerned with the co -planarity of both
the substrate package and the PCB motherboard. The iNEMI PCB Co-Plan
.. leer más
Projection Moiré vs. Shadow Moiré for Warpage Measurement and Failure Analysis of Advanced Packages
There are three key industry trends that are driving the need for temperature-dependent warpage measurement: the trend toward finer-pitch devices,the emergence of lead-free processing,and chang
.. leer más
Wire Bonding and Soldering on Enepig and Enep Surface Finishes with Pure Pd- Layers
As a surface finish,electroless nickel / electroless palladium / immersion gold (ENEPIG) has received increased attention
for both packaging/IC-substrate and PWB applications. With a lower gold
.. leer más
A Plasma Deposited Surface Finish for Printed Circuit Boards
This paper will discuss a new approach to the final finishing for the PCB industry which is based on the use of an ultra-thin
fluoropolymer film as a protective coating to preserve solderabilit
.. leer más
Influence of Pd Thickness on Micro Void Formation of Solder Joints in ENEPIG Surface Finish
We investigated the micro-void formation of solder joints after reliability tests such as preconditioning (precon) and thermal
cycle (TC) by varying the thickness of Palladium (Pd) in Electrole
.. leer más
The Regulatory and Environment Status of Tetrabromobisphenol-A In Printed Wiring Boards
Tetrabromobisphenol-A (TBBPA) is the predominant flame retardant used in rigid FR-4 printed wiring boards (PWB). In
this application,the TBBPA is fully reacted into the epoxy resins that form t
.. leer más
An Innovative High CTI RCC Material
Consumption electronic devices are becoming much smaller,lighter and multifunctional,and high CTI application has
already been not satisfied with double sided design and requested thinner & mul
.. leer más
New Developments in PCB Laminates
There are few halogen free flame retardant laminates available and for those on the market currently,they are not considered mid loss and thermally stable. Theta circuit materials appear to be
.. leer más
IPC Standards and Printed Electronics Monetization
Printed Electronics is considered by many international technologists to be a platform for manufacturing innovation. Its rich portfolio of advanced multi-functional nano-designed materials,scal
.. leer más
Printed Electronics - Performance Requirements for Flexible Substrates
– Define Printed Electronics
– Provide general market
information & Applications
– Provide performance
information on a wide variety
of thermoplastic films
– Provide processing
considerations f
.. leer más
Advances in Conductive Inks across Multiple Applications and Deposition Platforms
Printed Electronics is generally defined as the patterning of electronic materials,in solution form,onto flexible substrates,omitting any use of the photolithography,etching,and plating steps c
.. leer más
Existing and Emerging Opportunities in Printed Electronics For Printers
• Summary of some new and existing technologies for printed electronics outside of traditional membrane switch manufacturing
• Discussion of requirements for understanding the technology of the
.. leer más
Printable Materials and Devices
Printing technologies provide a simple solution to build electronic circuits on low cost flexible substrates. Materials will play an important role for developing advanced printable technology.
.. leer más
The Uncertainty of Surface Insulation Resistance/Electrochemical Migration Performance of Completed Assemblies
The breadth of materials and processes used in today’s electronic assemblies may make it impossible to predict SIR/ECM performance without adequate testing of material and process combinations.
.. leer más
The Effect of Powder Surface Area and Oxidation on the Voiding Performance of PoP Solder Pastes
With the miniaturization of components in the semiconductor industry,the need for specialized solder pastes with finer
powder mesh sizes for package-on-package (PoP) assemblies has become imper
.. leer más
SMT Manufacturability and Reliability in PCB Cavities
Considering technological advances in multi-depth cavities in the PCB manufacturing industry,various subtopics have materialized regarding the processing and application of such features in dev
.. leer más
Challenges for Step Stencils with Design Guidelines for Solder Paste Printing
The stencil printing process is one of the most critical processes in the electronic production. Due to the requirement: “faster and smaller” it is necessary to place components with different
.. leer más
Virtual Access Technique Augments Test Coverage on Limited Access PCB Assemblies
Increased pressures to reduce time to market and time to volume have forced many manufacturers of populated printed circuit boards to rely on capacitively coupled,un-powered,vectorless in-circu
.. leer más
Testing DDR Memory
Testing DDR memories on Printed Circuit Boards has steadily gotten more difficult. Most such memories do not have any on-chip Design-for-Test features. Adequate test access is a disappearing lu
.. leer más
Corrosion Resistance of Different PCB Surface Finishes in Harsh Environments
Corrosion resistance is becoming one of the most important topics in the electronics industry. Corrosion results in field
failures and huge losses,which annually total several billion U.S. doll
.. leer más
The Surface Finish Effect on the Creep Corrosion in PCB
Creep corrosion normally happens in the end system,PCB,connectors and components are widely noted due to the exposure of
high sulfur environments under elevated humidity. In this study,the majo
.. leer más
Detailed Analysis of Impedance and Loss versus Frequency for Transmission Lines Made From Flexible Circuit Materials
With the emergence of high speed,controlled impedance circuits requiring increasingly tight tolerances,there is a realization among designers and fabricators that more precise data is needed th
.. leer más
Thermal Characteristics of PCB Laminates used in High Frequency Applications
As technology advances,understanding thermal management issues of high frequency PCB’s increases. There are many different aspects to consider for PCB thermal management. This paper will invest
.. leer más
The Application of Spherical Bend Testing to Predict Safe Working Manufacturing Process Strains
The increased temperatures associated with lead free processes have produced significant challenges for PWB laminates.
Newly developed laminates have different curing processes,are commonly fil
.. leer más
Investigation of Pad Cratering in Large Flip-Chip BGA using Acoustic Emission
Electronics assemblies with large flip-chip BGA packages can be prone to either pad cratering or brittle intermetallic (IMC)
failures under excessive PCB bending. Pad cratering cracks are not d
.. leer más
PAD CRATERING
- What is Pad Cratering?
- Pad Craters
- Pad Cratering… Opens Circuits
- How is the Electronics Industry dealing with this Defect Mode?
- What does this have in common with a Pad Cratering solu
.. leer más
Assembly and Reliability of 1704 I/O FCBGA and FPBGAs
Commercial-off-the-shelf ball/column grid array packaging (COTS BGA/CGA) technologies in high reliability versions are now being considered for use in a number of National Aeronautics and Space
.. leer más
The Relationship between Backward Compatible Assembly and Microstructure on the Thermal Fatigue Reliability of an Extremely Large Ball Grid Array
Accelerated temperature cycling was used to evaluate the thermal fatigue reliability for the case of backward compatible
assembly (mixed alloy,Pb-free BGA/SnPb paste) of a 3162 pin count,extrem
.. leer más
Reliability of BGA Solder Joints after Re-Balling Process
Due to the obsolescence of SnPb BGA components,electronics manufacturers that use SnPb solder paste either have to use
lead-free BGAs and adjust the reflow process or re-ball these components w
.. leer más
Warpage Issues and Assembly Challenges Using Coreless Package Substrate
Coreless technology in package substrate has been developed to satisfy the increasing demand of lighter,smaller and superior electrical performance regarding as the future trend in electronic a
.. leer más
An Investigation into the Predictability of PCB Coplanarity for Room vs. Lead Free Assembly Temperatures
With the advent of larger packages and higher densities/pitch the Industry has been concerned with the co -planarity of both
the substrate package and the PCB motherboard. The iNEMI PCB Co-Plan
.. leer más
Projection Moiré vs. Shadow Moiré for Warpage Measurement and Failure Analysis of Advanced Packages
There are three key industry trends that are driving the need for temperature-dependent warpage measurement: the trend toward finer-pitch devices,the emergence of lead-free processing,and chang
.. leer más
Wire Bonding and Soldering on Enepig and Enep Surface Finishes with Pure Pd- Layers
As a surface finish,electroless nickel / electroless palladium / immersion gold (ENEPIG) has received increased attention
for both packaging/IC-substrate and PWB applications. With a lower gold
.. leer más
A Plasma Deposited Surface Finish for Printed Circuit Boards
This paper will discuss a new approach to the final finishing for the PCB industry which is based on the use of an ultra-thin
fluoropolymer film as a protective coating to preserve solderabilit
.. leer más
Influence of Pd Thickness on Micro Void Formation of Solder Joints in ENEPIG Surface Finish
We investigated the micro-void formation of solder joints after reliability tests such as preconditioning (precon) and thermal
cycle (TC) by varying the thickness of Palladium (Pd) in Electrole
.. leer más
The Regulatory and Environment Status of Tetrabromobisphenol-A In Printed Wiring Boards
Tetrabromobisphenol-A (TBBPA) is the predominant flame retardant used in rigid FR-4 printed wiring boards (PWB). In
this application,the TBBPA is fully reacted into the epoxy resins that form t
.. leer más
An Innovative High CTI RCC Material
Consumption electronic devices are becoming much smaller,lighter and multifunctional,and high CTI application has
already been not satisfied with double sided design and requested thinner & mul
.. leer más
New Developments in PCB Laminates
There are few halogen free flame retardant laminates available and for those on the market currently,they are not considered mid loss and thermally stable. Theta circuit materials appear to be
.. leer más
IPC Standards and Printed Electronics Monetization
Printed Electronics is considered by many international technologists to be a platform for manufacturing innovation. Its rich portfolio of advanced multi-functional nano-designed materials,scal
.. leer más
Printed Electronics - Performance Requirements for Flexible Substrates
– Define Printed Electronics
– Provide general market
information & Applications
– Provide performance
information on a wide variety
of thermoplastic films
– Provide processing
considerations f
.. leer más
Advances in Conductive Inks across Multiple Applications and Deposition Platforms
Printed Electronics is generally defined as the patterning of electronic materials,in solution form,onto flexible substrates,omitting any use of the photolithography,etching,and plating steps c
.. leer más
Existing and Emerging Opportunities in Printed Electronics For Printers
• Summary of some new and existing technologies for printed electronics outside of traditional membrane switch manufacturing
• Discussion of requirements for understanding the technology of the
.. leer más
Printable Materials and Devices
Printing technologies provide a simple solution to build electronic circuits on low cost flexible substrates. Materials will play an important role for developing advanced printable technology.
.. leer más
The Uncertainty of Surface Insulation Resistance/Electrochemical Migration Performance of Completed Assemblies
The breadth of materials and processes used in today’s electronic assemblies may make it impossible to predict SIR/ECM performance without adequate testing of material and process combinations.
.. leer más