Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
Presentación
Authenticity Testing
Counterfeit and substandard parts and components have been a recurring theme in practically every market. For the last several years,the largest concern has been in the military and aerospace i
.. leer más
Cleanliness Comparison – C3 Localized Versus Total Board Extractions
In this evaluation we will show an ionic residue comparison using Umpire 2 boards that were top and bottom surface mounted with standard reflow and selective wave soldered on the connector and
.. leer más
Next Generation Test Methodologies and Analysis for Physical Layer Structures
Printed circuit board (PCB) material properties and surface roughness directly influence attenuation and NEXT/FEXT crosstalk signal integrity of high speed digital interconnect design. Balancin
.. leer más
Cleaning Challenges in an HDI World
Electronic assembly innovations drive more performance using highly dense interconnects. Assembly residues may increase the risk of premature failure or improper functionality. The challenge fo
.. leer más
Common Mistakes in Electronic Design
Board-level designers are constantly expected to cram more computational power,into a smaller space,at lower cost,and accomplish this task in less time and with fewer resources. In this rush to
.. leer más
Analytical Procedures for Portable Lead-Free Alloy Test Data: State of Merge of iNEMI and SPVC Documents
The IPC Solder Products Value Council,in cooperation with iNEMI and a group of industry experts,has developed a protocol for testing the physical properties of lead free solder alloys. This pre
.. leer más
Evolution Toward a Workmanship Standard For Underfill
There is no issued industry standard for the workmanship of underfills – either from the perspective of visual examination (a la A-610) or by more intrusive techniques like cross-sectioning. Th
.. leer más
Design and Process Implementation Principles for Embedded Components
Vern Solberg is an independent consultant specializing in SMT and microelectronics design and manufacturing technology. He has served the industry for more than twenty-five years in areas relat
.. leer más
Thermal Pad Design at QFN Assembly for Voiding Control
Quad Flat No Leads (QFN) package designs receive more and more attention in electronic industry recently. This package offers a number of benefits including (1) small size,such as a near die si
.. leer más
Key Issues in Bottom Termination Component (BTC) Design and Assembly for Improved Reliability and Yield
With the release of IPC 7093,"Design and Assembly Process Implementation for Bottom Termination SMT Components," earlier this year,the term BTC is the newest acronym to enter the world of SMT.
.. leer más
Low Silver Solder Alloys with Good Drop Shock and Thermal Cycle Reliability
SAC105 was shown to have better drop shock reliability than SAC305 however SAC105 thermal cycle performance was not necessarily as good at SAC305. Small quantities (0.1% or so) of some elements
.. leer más
Thermal Cycle Solder Joint Integrity Assessment of SnBi Plated Components
The implementation of the European Restriction of Hazardous Substances (RoHS) Directive has initiated an electronics industry materials evolution. Printed wiring board laminate suppliers,compon
.. leer más
A Review of Issues and Next Steps in Moving From Sn3Ag0.5Cu to Low Silver Solder Alloys
The implementation of the European Restriction of Hazardous Substances (RoHS) Directive has initiated an electronics industry materials evolution. Printed wiring board laminate suppliers,compon
.. leer más
How to Manage Wave Solder Alloy Contaminations
European electronics industry is soldering with lead-free alloys for one decade now. In this period not only the knowledge of the alloys in the assembly process has been improved,but also a hig
.. leer más
Use of the IPC Solder Spread Coupon to Evaluate Pb-Free Solder Pastes and PCB Surface Finishes
Continental is using the IPC solder spread coupon (adopted from NPL) to evaluate Pb-free solder pastes and PCB surface finishes for Solderability. This presentation will compare and contrast so
.. leer más
Physics-of-Failure Approach to Integrated Circuit Reliability
Modern electronics typically consist of microprocessors and other complex integrated circuits (ICs) such as FPGAs,ADCs,and memory. They are susceptible to electrical,mechanical and thermal mode
.. leer más
Testing the Long Term Reliability of an Environmentally Friendly PCB Final Finish
The new plasma polymer PCB final finish that eliminates harsh chemicals and waste streams also promises to eliminate creep corrosion,but will it stand the test of time? Before any new produc
.. leer más
Controlling Moisture in Printed Circuit Boards
Moisture can accelerate various failure mechanisms in printed circuit board assemblies. Moisture can be initially present in the epoxy glass prepreg,absorbed during the wet processes in printed
.. leer más
HDPUG Pb-Free Board Materials Reliability Project 2 Moisture Sensitivity and Its Effect on Delamination
As part of High Density Packaging Users Group (HDPUG) Pb-Free Board Materials Reliability Project 2,the moisture sensitivity of various lead-free laminates and the effect of moisture uptake on
.. leer más
Moisture Measurements in PCBs and Impact of Design on Desorption Behaviour
High levels of residual moisture in PCBs are problematic and can result in delamination during soldering and rework. Moisture accumulates during storage and industry practice recommends specifi
.. leer más
A New Method for Measuring Conformal Coating Adhesion
Coating adhesion has been a difficult property to measure,and the industry has made do with a scratch test that is only capable of qualitative tests. NPL with industrial partners,have developed
.. leer más
Introducing Novel Flame Retardant Materials to Produce Exceptionally Low Viscosity,High Temperature Resistant Epoxy Encapsulation Compounds
The most common epoxy encapsulation compounds available on the market utilise specialised fillers,such as Alumina trihydrate (ATH),to provide a high level of flame retardancy. Such fillers deco
.. leer más
Exploring the Performance of Silicone Gels at High and Low Temperature
Silicones have been used in the electronics industry as protective/assembly materials for operations that will have a wide temperature variation. A large variety of silicone products are availa
.. leer más
Applications of Solder Fortification with Preforms
Although many have predicted the demise of through-hole components,they are alive and well with tens of billions assembled each year. In many cases these components are assembled by wave solder
.. leer más
Pad Design and Process for Voiding Control at QFN Assembly
Quad Flat No Leads (QFN) package designs receive more and more attention in electronic industry recently. This package offers a number of benefits including (1) small size,such as a near die si
.. leer más
Investigation for Use of ‘Pin in Paste’ Reflow Process with Combination of Solder Preforms to Eliminate Wave Soldering
The Pin in Paste (PiP) technology is the process of soldering Pin through hole (PTH) components using the Surface Mount Technology (SMT) reflow process. The use of PiP process offers several ad
.. leer más
Down-Selecting Low Solids Fluxes for Pb-free Selective Soldering
Although many predicted the demise of through-hole components,they are alive and well with tens of billions used each year. In mixed SMT/through-hole PCBs,through-hole components,and especially
.. leer más
Effect of Thermal Conditions and Durations on Reaction Kinetics and Phase Transformations within SAC 305 Solder
As technology becomes increasingly reliant on electronics,understanding the longevity of lead-free solder also becomes imperative. This research project focused on phase transformation kinetics
.. leer más
Mitigating Head-in-Pillow Defects: An Experimental Approach to Identify No-Clean Soldering Materials
•Overview
•Test Method Considerations
•Proposed Test Methodology
•PCB,Stencil & Part Information
•Pick-up Adapter Design
•Test Setup Overview
•Head-in-Pillow Defect Detection
•Test Parameters
•
.. leer más
Authenticity Testing
Counterfeit and substandard parts and components have been a recurring theme in practically every market. For the last several years,the largest concern has been in the military and aerospace i
.. leer más
Cleanliness Comparison – C3 Localized Versus Total Board Extractions
In this evaluation we will show an ionic residue comparison using Umpire 2 boards that were top and bottom surface mounted with standard reflow and selective wave soldered on the connector and
.. leer más
Next Generation Test Methodologies and Analysis for Physical Layer Structures
Printed circuit board (PCB) material properties and surface roughness directly influence attenuation and NEXT/FEXT crosstalk signal integrity of high speed digital interconnect design. Balancin
.. leer más
Cleaning Challenges in an HDI World
Electronic assembly innovations drive more performance using highly dense interconnects. Assembly residues may increase the risk of premature failure or improper functionality. The challenge fo
.. leer más
Common Mistakes in Electronic Design
Board-level designers are constantly expected to cram more computational power,into a smaller space,at lower cost,and accomplish this task in less time and with fewer resources. In this rush to
.. leer más
Analytical Procedures for Portable Lead-Free Alloy Test Data: State of Merge of iNEMI and SPVC Documents
The IPC Solder Products Value Council,in cooperation with iNEMI and a group of industry experts,has developed a protocol for testing the physical properties of lead free solder alloys. This pre
.. leer más
Evolution Toward a Workmanship Standard For Underfill
There is no issued industry standard for the workmanship of underfills – either from the perspective of visual examination (a la A-610) or by more intrusive techniques like cross-sectioning. Th
.. leer más
Design and Process Implementation Principles for Embedded Components
Vern Solberg is an independent consultant specializing in SMT and microelectronics design and manufacturing technology. He has served the industry for more than twenty-five years in areas relat
.. leer más
Thermal Pad Design at QFN Assembly for Voiding Control
Quad Flat No Leads (QFN) package designs receive more and more attention in electronic industry recently. This package offers a number of benefits including (1) small size,such as a near die si
.. leer más
Key Issues in Bottom Termination Component (BTC) Design and Assembly for Improved Reliability and Yield
With the release of IPC 7093,"Design and Assembly Process Implementation for Bottom Termination SMT Components," earlier this year,the term BTC is the newest acronym to enter the world of SMT.
.. leer más
Low Silver Solder Alloys with Good Drop Shock and Thermal Cycle Reliability
SAC105 was shown to have better drop shock reliability than SAC305 however SAC105 thermal cycle performance was not necessarily as good at SAC305. Small quantities (0.1% or so) of some elements
.. leer más
Thermal Cycle Solder Joint Integrity Assessment of SnBi Plated Components
The implementation of the European Restriction of Hazardous Substances (RoHS) Directive has initiated an electronics industry materials evolution. Printed wiring board laminate suppliers,compon
.. leer más
A Review of Issues and Next Steps in Moving From Sn3Ag0.5Cu to Low Silver Solder Alloys
The implementation of the European Restriction of Hazardous Substances (RoHS) Directive has initiated an electronics industry materials evolution. Printed wiring board laminate suppliers,compon
.. leer más
How to Manage Wave Solder Alloy Contaminations
European electronics industry is soldering with lead-free alloys for one decade now. In this period not only the knowledge of the alloys in the assembly process has been improved,but also a hig
.. leer más
Use of the IPC Solder Spread Coupon to Evaluate Pb-Free Solder Pastes and PCB Surface Finishes
Continental is using the IPC solder spread coupon (adopted from NPL) to evaluate Pb-free solder pastes and PCB surface finishes for Solderability. This presentation will compare and contrast so
.. leer más
Physics-of-Failure Approach to Integrated Circuit Reliability
Modern electronics typically consist of microprocessors and other complex integrated circuits (ICs) such as FPGAs,ADCs,and memory. They are susceptible to electrical,mechanical and thermal mode
.. leer más
Testing the Long Term Reliability of an Environmentally Friendly PCB Final Finish
The new plasma polymer PCB final finish that eliminates harsh chemicals and waste streams also promises to eliminate creep corrosion,but will it stand the test of time? Before any new produc
.. leer más
Controlling Moisture in Printed Circuit Boards
Moisture can accelerate various failure mechanisms in printed circuit board assemblies. Moisture can be initially present in the epoxy glass prepreg,absorbed during the wet processes in printed
.. leer más
HDPUG Pb-Free Board Materials Reliability Project 2 Moisture Sensitivity and Its Effect on Delamination
As part of High Density Packaging Users Group (HDPUG) Pb-Free Board Materials Reliability Project 2,the moisture sensitivity of various lead-free laminates and the effect of moisture uptake on
.. leer más
Moisture Measurements in PCBs and Impact of Design on Desorption Behaviour
High levels of residual moisture in PCBs are problematic and can result in delamination during soldering and rework. Moisture accumulates during storage and industry practice recommends specifi
.. leer más
A New Method for Measuring Conformal Coating Adhesion
Coating adhesion has been a difficult property to measure,and the industry has made do with a scratch test that is only capable of qualitative tests. NPL with industrial partners,have developed
.. leer más
Introducing Novel Flame Retardant Materials to Produce Exceptionally Low Viscosity,High Temperature Resistant Epoxy Encapsulation Compounds
The most common epoxy encapsulation compounds available on the market utilise specialised fillers,such as Alumina trihydrate (ATH),to provide a high level of flame retardancy. Such fillers deco
.. leer más
Exploring the Performance of Silicone Gels at High and Low Temperature
Silicones have been used in the electronics industry as protective/assembly materials for operations that will have a wide temperature variation. A large variety of silicone products are availa
.. leer más
Applications of Solder Fortification with Preforms
Although many have predicted the demise of through-hole components,they are alive and well with tens of billions assembled each year. In many cases these components are assembled by wave solder
.. leer más
Pad Design and Process for Voiding Control at QFN Assembly
Quad Flat No Leads (QFN) package designs receive more and more attention in electronic industry recently. This package offers a number of benefits including (1) small size,such as a near die si
.. leer más
Investigation for Use of ‘Pin in Paste’ Reflow Process with Combination of Solder Preforms to Eliminate Wave Soldering
The Pin in Paste (PiP) technology is the process of soldering Pin through hole (PTH) components using the Surface Mount Technology (SMT) reflow process. The use of PiP process offers several ad
.. leer más
Down-Selecting Low Solids Fluxes for Pb-free Selective Soldering
Although many predicted the demise of through-hole components,they are alive and well with tens of billions used each year. In mixed SMT/through-hole PCBs,through-hole components,and especially
.. leer más
Effect of Thermal Conditions and Durations on Reaction Kinetics and Phase Transformations within SAC 305 Solder
As technology becomes increasingly reliant on electronics,understanding the longevity of lead-free solder also becomes imperative. This research project focused on phase transformation kinetics
.. leer más
Mitigating Head-in-Pillow Defects: An Experimental Approach to Identify No-Clean Soldering Materials
•Overview
•Test Method Considerations
•Proposed Test Methodology
•PCB,Stencil & Part Information
•Pick-up Adapter Design
•Test Setup Overview
•Head-in-Pillow Defect Detection
•Test Parameters
•
.. leer más