Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
Presentación
PCB Assembly System Set-Up for Pop
Traditional SMT assembly is a two dimensional process. Each component is placed on the same horizontal plane in different
X and Y locations. In Package on Package (PoP) assembly,components are
.. leer más
Embedded Packaging Technologies: Imbedding Components to Meet Form,Fit,and Function
As the electronics industry moves toward smaller form and fit factors,advanced packaging technologies are needed to achieve these challenging design requirements. Current design problems are no
.. leer más
Printable Materials and Devices for Electronic Packaging
Printing technologies provide a simple solution to build electronic circuits on low cost flexible substrates. Materials will play important role for developing advanced printable technology. Ad
.. leer más
Improvements in Microwave Laminates for Power Amplifier Reliability and Efficiency
Demands for higher data rates and capacity have continued to drive RF and Microwave electronics continue toward higher
frequency and higher power requirements. These power and frequency demands
.. leer más
Effects of Moisture Content on Permittivity and Loss Tangent of Printed Circuit Board Materials
Printed circuit board laminate datasheets provide permittivity (dielectric constant,Dk) and loss tangent (dissipation factor,Df) values that are used for specification and board design. But pas
.. leer más
Low Loss & Novel Halogen-Free Laminates for High Frequency Device Applications
In this paper,ITEQ demonstrates outstanding performance of new halogen-free and low loss laminates,IT-258GA,IT-168G,and IT-150D,for the coming halogen free generation,and higher frequency appli
.. leer más
Determining Dielectric Properties of High Frequency PCB Laminate Materials
This paper will focus on understanding the dielectric constant (dk) of high frequency laminate materials. The dissipation factor (df) and other electrical properties will be discussed as well,h
.. leer más
Design To Manufacturing Standards
• The Information Process
• Knowing the jargon (terms & definitions)
• Defining the requirements
• Expansion of Documentation standards
• Document Grade and Completeness
• Relationship of CAD/C
.. leer más
IPC/JEDEC J-STD-609AMarking and Labeling of Components,PCBs and PCBAs to Identify Lead (Pb),Lead-Free (Pb-Free) and Other Attributes
• The standard covers marking and labellingof both tin-lead and lead-free components,boards and solders used in 2ndlevel assembly.
• Other areas covered include board base material type and sur
.. leer más
The Value of IPC-2152
Current carrying capacity in printed board design is technology dependent and an element of printed circuit board thermal
management. Conductor temperature rise as a function of current is depe
.. leer más
Thermal Cycling Reliability Screening of Multiple Pb-free Solder Ball Alloys
Thermal cycling tests were conducted using two different ceramic ball grid array (CBGA) test vehicles having balls comprised of nine different Pb free solder alloys. The experiment was designed
.. leer más
Achieving High Reliability Low Cost Lead-Free SAC Solder Joints Via Mn Or Ce Doping
In this study,the reliabilities of low Ag SAC alloys doped with Mn or Ce (SACM or SACC) were evaluated under JEDEC drop,dynamic bending,thermal cycling,and cyclic bending test conditions agains
.. leer más
Low-Silver BGA Assembly Phase II – Reliability Assessment Fifth Report: Preliminary Thermal Cycling Results
Some ball grid array suppliers are migrating their sphere alloys from SAC305 (3% Ag) or SAC405 (4% Ag) to alloys with lower silver contents. There are numerous perceived reliability benefits to
.. leer más
Manufacturing Equipment: From Single Machines to Integrated High Performance Systems
- Production Processes
- Manual Production Line (2000)
- Fully Automated System (today)
- Cell Interconnection
- Encapsulation Materials
- Encapsulation Process
- Influence of Temperature
- Enc
.. leer más
Creep Corrosion of OSP and ImAg PWB Finishes
With increasing adoption of lead-free PWB surface finishes,along with increasing product deployments in more corrosive
environments,the electronics industry is observing increased occurrences o
.. leer más
An Investigation into Hand Sanitizers and Hand Lotions and Potential Risks to High Performance Electronics
As people become more concerned about the global outbreaks of various strains of influenza,more precautions are being taken with respect to personal hygiene. A common precaution involves the us
.. leer más
Relationship Between Via Size and Cleanliness
Microvia technology has many advantages: it requires a smaller designed area,which saves the board size and weight,using less space,allowing for a smaller PCB,which can results in lower costs,a
.. leer más
Where are REACH SVHC in Electronic Products and Parts?
The European REACH regulation (Regulation (EC) No 1907/2006) imposes requirements to declare and sometimes restrict the use of Substances of Very High Concern (SVHC). REACH affects all product
.. leer más
Round Robin Testing in Support of IPC J-STD-709: Combustion Sample Preparation Methods for Ion Chromatography Analysis of Br and Cl
This paper will present the results of a round robin study of sample combustion followed by ion chromatography (CIC) to measure the concentration of bromine and chlorine in electronic materials
.. leer más
Effect of Board Clamping System on Solder Paste Print Quality
Stencil printing technology has come a long way since the early 80’s when SMT process gained importance in the electronics
packaging industry. In those early days,components were fairly large,m
.. leer más
Stencil Design Considerations to Improve Drop Test Performance
Future handheld electronic products will be slimmer than today and deliver more functions,enabled by innovative electronics
packaging design using smaller components with greater I/Os assembled
.. leer más
Fighting the Undesirable Effects of Thermal Cycling
Most electronic assemblies comprise a number of chips,packages and similar components that are attached to Printed Circuit Boards (PCBs) or similar substrates,usually using solder joints. Also
.. leer más
Comparative Analysis of Solder Joint Degradation Using RF Impedance and Event Detectors
Under cycling loading conditions,solder joints are susceptible to fatigue cracking,which often initiates at the surface where the strain range is maximized. Event detectors have been widely use
.. leer más
Poor Metrology: The Hidden Cost
Doing more with less has been the standard operating procedure in manufacturing over the past ten years. Everyone is looking for areas where they can cut corners,maintain quality,and improve pr
.. leer más
Using DMAIC Methodology for MLP Reflow Process Optimization
The widely publicized and studied implementation of lead free solders has led to increased scrutiny on the solder joint formation for surface mount technology electronic components. During the
.. leer más
Head-On-Pillow Defect – A Pain in the Neck or Head-On-Pillow BGA Solder Defect
The head on pillow defect is becoming more common. This paper describes one such occurrence for an OEM and explains how it was dealt with. In this particular case it was solved by application o
.. leer más
A Novel Approach to Experimentally Create and Mitigate Head-in-Pillow Defects
One of the solder joint failures encountered frequently during Printed Circuit Board Assembly (PCBA) is due to Head-in-Pillow (HiP) defects. The primary cause of HiP defect is due to the warpag
.. leer más
Challenges toward Implementing a Halogen-Free PCB Assembly Process
The electronics industry continues to strive to provide more environmentally friendly products. This movement is partly due to legislation from various countries,partly due to public outcry fro
.. leer más
PCB Assembly System Set-Up for Pop
Traditional SMT assembly is a two dimensional process. Each component is placed on the same horizontal plane in different
X and Y locations. In Package on Package (PoP) assembly,components are
.. leer más
Embedded Packaging Technologies: Imbedding Components to Meet Form,Fit,and Function
As the electronics industry moves toward smaller form and fit factors,advanced packaging technologies are needed to achieve these challenging design requirements. Current design problems are no
.. leer más
Printable Materials and Devices for Electronic Packaging
Printing technologies provide a simple solution to build electronic circuits on low cost flexible substrates. Materials will play important role for developing advanced printable technology. Ad
.. leer más
Improvements in Microwave Laminates for Power Amplifier Reliability and Efficiency
Demands for higher data rates and capacity have continued to drive RF and Microwave electronics continue toward higher
frequency and higher power requirements. These power and frequency demands
.. leer más
Effects of Moisture Content on Permittivity and Loss Tangent of Printed Circuit Board Materials
Printed circuit board laminate datasheets provide permittivity (dielectric constant,Dk) and loss tangent (dissipation factor,Df) values that are used for specification and board design. But pas
.. leer más
Low Loss & Novel Halogen-Free Laminates for High Frequency Device Applications
In this paper,ITEQ demonstrates outstanding performance of new halogen-free and low loss laminates,IT-258GA,IT-168G,and IT-150D,for the coming halogen free generation,and higher frequency appli
.. leer más
Determining Dielectric Properties of High Frequency PCB Laminate Materials
This paper will focus on understanding the dielectric constant (dk) of high frequency laminate materials. The dissipation factor (df) and other electrical properties will be discussed as well,h
.. leer más
Design To Manufacturing Standards
• The Information Process
• Knowing the jargon (terms & definitions)
• Defining the requirements
• Expansion of Documentation standards
• Document Grade and Completeness
• Relationship of CAD/C
.. leer más
IPC/JEDEC J-STD-609AMarking and Labeling of Components,PCBs and PCBAs to Identify Lead (Pb),Lead-Free (Pb-Free) and Other Attributes
• The standard covers marking and labellingof both tin-lead and lead-free components,boards and solders used in 2ndlevel assembly.
• Other areas covered include board base material type and sur
.. leer más
The Value of IPC-2152
Current carrying capacity in printed board design is technology dependent and an element of printed circuit board thermal
management. Conductor temperature rise as a function of current is depe
.. leer más
Thermal Cycling Reliability Screening of Multiple Pb-free Solder Ball Alloys
Thermal cycling tests were conducted using two different ceramic ball grid array (CBGA) test vehicles having balls comprised of nine different Pb free solder alloys. The experiment was designed
.. leer más
Achieving High Reliability Low Cost Lead-Free SAC Solder Joints Via Mn Or Ce Doping
In this study,the reliabilities of low Ag SAC alloys doped with Mn or Ce (SACM or SACC) were evaluated under JEDEC drop,dynamic bending,thermal cycling,and cyclic bending test conditions agains
.. leer más
Low-Silver BGA Assembly Phase II – Reliability Assessment Fifth Report: Preliminary Thermal Cycling Results
Some ball grid array suppliers are migrating their sphere alloys from SAC305 (3% Ag) or SAC405 (4% Ag) to alloys with lower silver contents. There are numerous perceived reliability benefits to
.. leer más
Manufacturing Equipment: From Single Machines to Integrated High Performance Systems
- Production Processes
- Manual Production Line (2000)
- Fully Automated System (today)
- Cell Interconnection
- Encapsulation Materials
- Encapsulation Process
- Influence of Temperature
- Enc
.. leer más
Creep Corrosion of OSP and ImAg PWB Finishes
With increasing adoption of lead-free PWB surface finishes,along with increasing product deployments in more corrosive
environments,the electronics industry is observing increased occurrences o
.. leer más
An Investigation into Hand Sanitizers and Hand Lotions and Potential Risks to High Performance Electronics
As people become more concerned about the global outbreaks of various strains of influenza,more precautions are being taken with respect to personal hygiene. A common precaution involves the us
.. leer más
Relationship Between Via Size and Cleanliness
Microvia technology has many advantages: it requires a smaller designed area,which saves the board size and weight,using less space,allowing for a smaller PCB,which can results in lower costs,a
.. leer más
Where are REACH SVHC in Electronic Products and Parts?
The European REACH regulation (Regulation (EC) No 1907/2006) imposes requirements to declare and sometimes restrict the use of Substances of Very High Concern (SVHC). REACH affects all product
.. leer más
Round Robin Testing in Support of IPC J-STD-709: Combustion Sample Preparation Methods for Ion Chromatography Analysis of Br and Cl
This paper will present the results of a round robin study of sample combustion followed by ion chromatography (CIC) to measure the concentration of bromine and chlorine in electronic materials
.. leer más
Effect of Board Clamping System on Solder Paste Print Quality
Stencil printing technology has come a long way since the early 80’s when SMT process gained importance in the electronics
packaging industry. In those early days,components were fairly large,m
.. leer más
Stencil Design Considerations to Improve Drop Test Performance
Future handheld electronic products will be slimmer than today and deliver more functions,enabled by innovative electronics
packaging design using smaller components with greater I/Os assembled
.. leer más
Fighting the Undesirable Effects of Thermal Cycling
Most electronic assemblies comprise a number of chips,packages and similar components that are attached to Printed Circuit Boards (PCBs) or similar substrates,usually using solder joints. Also
.. leer más
Comparative Analysis of Solder Joint Degradation Using RF Impedance and Event Detectors
Under cycling loading conditions,solder joints are susceptible to fatigue cracking,which often initiates at the surface where the strain range is maximized. Event detectors have been widely use
.. leer más
Poor Metrology: The Hidden Cost
Doing more with less has been the standard operating procedure in manufacturing over the past ten years. Everyone is looking for areas where they can cut corners,maintain quality,and improve pr
.. leer más
Using DMAIC Methodology for MLP Reflow Process Optimization
The widely publicized and studied implementation of lead free solders has led to increased scrutiny on the solder joint formation for surface mount technology electronic components. During the
.. leer más
Head-On-Pillow Defect – A Pain in the Neck or Head-On-Pillow BGA Solder Defect
The head on pillow defect is becoming more common. This paper describes one such occurrence for an OEM and explains how it was dealt with. In this particular case it was solved by application o
.. leer más
A Novel Approach to Experimentally Create and Mitigate Head-in-Pillow Defects
One of the solder joint failures encountered frequently during Printed Circuit Board Assembly (PCBA) is due to Head-in-Pillow (HiP) defects. The primary cause of HiP defect is due to the warpag
.. leer más
Challenges toward Implementing a Halogen-Free PCB Assembly Process
The electronics industry continues to strive to provide more environmentally friendly products. This movement is partly due to legislation from various countries,partly due to public outcry fro
.. leer más