Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
Presentación
Bare Board Material Performance after Pb-free Reflow
This presentation will review the findings of a HDPUG consortia effort to evaluate 29 different bare board material and stack-up combinations and their associated performance after 6X Pb-free r
.. leer más
Water Vapor Uptake and Release in Printed Boards
Excessive moisture entrapped/absorbed within printed board laminates can expand during soldering operations,causing delamination or other damage. While moisture absorption data is available for
.. leer más
Why Electroless Palladium: Study on Impact of Electroless Palladium on Electroless Nickel Deposits
Electroless nickel immersion gold (ENIG) has captured the major share of the lead free final finish market globally even though it’s not the least expensive. ENIG not only provides a robust met
.. leer más
A Study of Solder Optimization Development for Portable Electronic Device
With increasing use of portable appliances such as PDA and cellular phone,changing environment of application requires higher solder joint reliability. The Cu-OSP process has been widely used f
.. leer más
The Role of the Interfacial Intermetallic in Lead-Free Solder
The formation during the soldering process of the layer of intermetallic compound Cu6Sn5 at the solder substrate interface
provides the essential evidence that a metallurgical bond that is the
.. leer más
REACH,RoHS,TSCA,CPSC – What’s next?
Restrictions on the use of chemicals in began 30 years ago in the US with the passage of the Toxic Substances Control Act. Over the last five years we have seen a logarithmic increase in produc
.. leer más
International Environmental Standards for the Electronics Industry
Industry associations,such as IPC,were quick to develop standards to help the electronics industry deal with emerging environmental regulations; however,for regulatory compliance,smooth interna
.. leer más
Materials Declaration: Practical Tips for Cutting through the Paperwork
This presentation will examine materials declaration from a practical point of view,identify the role of materials declaration in the product lifecycle analysis and thus hone in on the practica
.. leer más
High Frequency Circuit Materials used in the PCB Industry
Specialty high frequency circuit materials have been used in the PCB industry for decades and for many different reasons. There are several attributes of these materials that are very unique wh
.. leer más
A Closer Look at why Cleaning prior to Conformal Coating becomes Key in Aspects of Climatic Reliability?
The ever-increasing use of high frequency in high density interconnect (HDI) assemblies,combined with the worldwide move towards lead-free manufacturing,has initiated a closer assessment of eff
.. leer más
Opening Eyes on Fiber Weave and CAF
The signal channels that link high speed processors to memory and various other peripherals,are limited by the inherent characteristics of the printed circuit board. These are what ultimately c
.. leer más
A Non-Vacuum Process for Deposition of Thin Copper on Flexible Base Materials
The use of flexible circuit boards in the design and manufacture of electronic products has experienced a consistent and rapid growth over the last 15 years because their light weight and physi
.. leer más
Polyphenylene Ether Macromonomers. Iii. Enhancement of Dielectric Materials
Two major trends in printed wiring boards electronics are applications that require higher operating frequency,often in the radio frequency range (GHz),and the use of lead free solder assembly.
.. leer más
Novel Dielectric Materials: Breaking the Gigahertz Barrier
For many critical electronic applications,there is a need for dielectric systems that exhibit better electrical insulation
performance than epoxies and other conventional materials. In the prod
.. leer más
Validated Test Method to Characterize and Quantify Pad Cratering Under Bga Pads on Printed Circuit Boards
The conversion to lead free Ball Grid Array (BGA) packages has raised several new assembly and reliability issues. One reliability concern becoming more prevalent is the increased propensity fo
.. leer más
Qualification of Thin Form Factor PWBs for Handset Assembly
The handheld wireless product market place demands products that are small,thin,low-cost and lightweight and improved user interfaces. In addition,the convergence of handheld wireless phones wi
.. leer más
To be or not to be in Color: A 10 year study of the benefits and pitfalls of including color...
Imagine that you were choosing a camera for your AOI system. Should you opt for a black and white camera or a color camera? This seems like a no-brainer. Most of us would go for a color camera.
.. leer más
Bridging Supply Chain Gap for Exempt High-Reliability OEM’s
RoHS exempt high reliability OEMs breathed a sign of relief for not having to go through the grind of revising their processes and material to be RoHS compliant. However,this was short lived be
.. leer más
Preparing Supply Chains for the Disruption of Green Transitions
The European Union list of Substances of Very High Concern (SVHCs) published in the Registration,Evaluation,Authorization and Restriction of Chemicals (REACH) regulation,requires producers of A
.. leer más
SMT Process Characterization and Financial Impact
Portable Electronics devices are having more functionality but the size is getting smaller. What it means to SMT is to place more,smaller and ultra fine pitch devices on PC board. This makes SM
.. leer más
Low-Silver BGA Assembly Phase I – Reflow Considerations and Joint Homogeneity Third Report: Comparison of Four Low-Silver Sphere Alloys and...
Some Ball Grid Array suppliers are migrating their sphere alloys from SAC305 (3% Ag) or 405 (4% Ag) to alloys with lower silver contents. There are a numerous perceived benefits to this move in
.. leer más
Lead Free Process Development with Thick Multilayer PCBA Density in Server Applications
Although the EU RoHS legislation restricts the use of lead in electronics equipment,many high-end multi layer server printed circuit board assemblies (PCBAs) continue to be built with lead unde
.. leer más
Comparison of Thermal Fatigue Performance of SAC105 (Sn-1.0Ag-0.5Cu),Sn- 3.5Ag,and SAC305 (Sn-3.0Ag-0.5Cu) BGA Components with SAC305 Solder Paste
Many BGA and CSP component suppliers have begun shipment of components with a variety of “second generation” Pb-free solder ball alloys. Much of the motivation for the alloy changes has been to
.. leer más
FLAT-WRAP™ A Novel Approach to Copper Wrap Plate
Copper Wrap Plate as specified in IPC 6012B table 3-2,is a requirement developed to enhance reliability for PCB’s designed with via structures that require planarization and surface capping. PC
.. leer más
The Influence of Material Reactivity in Dk/Df Electrical Performance
Over the years,signal integrity performance and bandwidth gets more critical for today’s higher signal transmission speeds and bandwidth demand in every field of applications such as computing,
.. leer más
Opening Eyes on Fiber Weave and CAF
The signal channels that link high speed processors to memory and various other peripherals,are limited by the inherent characteristics of the printed circuit board. These are what ultimately c
.. leer más
Bare Board Material Performance after Pb-Free Reflow
The High Density Packaging Users Group (HDPUG) consortia completed an extensive study of 29 different bare board material and stackup combinations and their associated performance after 6X Pb-f
.. leer más
Reliability and Microstructure of Lead-Free Solder Joints in Industrial Electronics after Accelerated Thermal Aging
The reliability of lead-free (LF) solder joints in surface-mounted device components (SMD) has been investigated after thermo-cycle testing. Kirkendall voids have been observed at the interface
.. leer más
Long Term Reliability Analysis of Lead Free and Halogen Free Electronic Assemblies
The New England Lead Free Consortium,composed of many companies in the electronic supply chain in the regional area and chaired by the author; has embarked on an extensive long term reliability
.. leer más
Copper Pad Dissolution and Microstructure Analysis of Reworked Plastic Grid Array Assemblies
An experimental study was conducted to examine the impact of rework processes on quality and reliability. In this study,676 IO plastic ball grid array packages were assembled with Sn3.0Ag0.5Cu
.. leer más
Bare Board Material Performance after Pb-free Reflow
This presentation will review the findings of a HDPUG consortia effort to evaluate 29 different bare board material and stack-up combinations and their associated performance after 6X Pb-free r
.. leer más
Water Vapor Uptake and Release in Printed Boards
Excessive moisture entrapped/absorbed within printed board laminates can expand during soldering operations,causing delamination or other damage. While moisture absorption data is available for
.. leer más
Why Electroless Palladium: Study on Impact of Electroless Palladium on Electroless Nickel Deposits
Electroless nickel immersion gold (ENIG) has captured the major share of the lead free final finish market globally even though it’s not the least expensive. ENIG not only provides a robust met
.. leer más
A Study of Solder Optimization Development for Portable Electronic Device
With increasing use of portable appliances such as PDA and cellular phone,changing environment of application requires higher solder joint reliability. The Cu-OSP process has been widely used f
.. leer más
The Role of the Interfacial Intermetallic in Lead-Free Solder
The formation during the soldering process of the layer of intermetallic compound Cu6Sn5 at the solder substrate interface
provides the essential evidence that a metallurgical bond that is the
.. leer más
REACH,RoHS,TSCA,CPSC – What’s next?
Restrictions on the use of chemicals in began 30 years ago in the US with the passage of the Toxic Substances Control Act. Over the last five years we have seen a logarithmic increase in produc
.. leer más
International Environmental Standards for the Electronics Industry
Industry associations,such as IPC,were quick to develop standards to help the electronics industry deal with emerging environmental regulations; however,for regulatory compliance,smooth interna
.. leer más
Materials Declaration: Practical Tips for Cutting through the Paperwork
This presentation will examine materials declaration from a practical point of view,identify the role of materials declaration in the product lifecycle analysis and thus hone in on the practica
.. leer más
High Frequency Circuit Materials used in the PCB Industry
Specialty high frequency circuit materials have been used in the PCB industry for decades and for many different reasons. There are several attributes of these materials that are very unique wh
.. leer más
A Closer Look at why Cleaning prior to Conformal Coating becomes Key in Aspects of Climatic Reliability?
The ever-increasing use of high frequency in high density interconnect (HDI) assemblies,combined with the worldwide move towards lead-free manufacturing,has initiated a closer assessment of eff
.. leer más
Opening Eyes on Fiber Weave and CAF
The signal channels that link high speed processors to memory and various other peripherals,are limited by the inherent characteristics of the printed circuit board. These are what ultimately c
.. leer más
A Non-Vacuum Process for Deposition of Thin Copper on Flexible Base Materials
The use of flexible circuit boards in the design and manufacture of electronic products has experienced a consistent and rapid growth over the last 15 years because their light weight and physi
.. leer más
Polyphenylene Ether Macromonomers. Iii. Enhancement of Dielectric Materials
Two major trends in printed wiring boards electronics are applications that require higher operating frequency,often in the radio frequency range (GHz),and the use of lead free solder assembly.
.. leer más
Novel Dielectric Materials: Breaking the Gigahertz Barrier
For many critical electronic applications,there is a need for dielectric systems that exhibit better electrical insulation
performance than epoxies and other conventional materials. In the prod
.. leer más
Validated Test Method to Characterize and Quantify Pad Cratering Under Bga Pads on Printed Circuit Boards
The conversion to lead free Ball Grid Array (BGA) packages has raised several new assembly and reliability issues. One reliability concern becoming more prevalent is the increased propensity fo
.. leer más
Qualification of Thin Form Factor PWBs for Handset Assembly
The handheld wireless product market place demands products that are small,thin,low-cost and lightweight and improved user interfaces. In addition,the convergence of handheld wireless phones wi
.. leer más
To be or not to be in Color: A 10 year study of the benefits and pitfalls of including color...
Imagine that you were choosing a camera for your AOI system. Should you opt for a black and white camera or a color camera? This seems like a no-brainer. Most of us would go for a color camera.
.. leer más
Bridging Supply Chain Gap for Exempt High-Reliability OEM’s
RoHS exempt high reliability OEMs breathed a sign of relief for not having to go through the grind of revising their processes and material to be RoHS compliant. However,this was short lived be
.. leer más
Preparing Supply Chains for the Disruption of Green Transitions
The European Union list of Substances of Very High Concern (SVHCs) published in the Registration,Evaluation,Authorization and Restriction of Chemicals (REACH) regulation,requires producers of A
.. leer más
SMT Process Characterization and Financial Impact
Portable Electronics devices are having more functionality but the size is getting smaller. What it means to SMT is to place more,smaller and ultra fine pitch devices on PC board. This makes SM
.. leer más
Low-Silver BGA Assembly Phase I – Reflow Considerations and Joint Homogeneity Third Report: Comparison of Four Low-Silver Sphere Alloys and...
Some Ball Grid Array suppliers are migrating their sphere alloys from SAC305 (3% Ag) or 405 (4% Ag) to alloys with lower silver contents. There are a numerous perceived benefits to this move in
.. leer más
Lead Free Process Development with Thick Multilayer PCBA Density in Server Applications
Although the EU RoHS legislation restricts the use of lead in electronics equipment,many high-end multi layer server printed circuit board assemblies (PCBAs) continue to be built with lead unde
.. leer más
Comparison of Thermal Fatigue Performance of SAC105 (Sn-1.0Ag-0.5Cu),Sn- 3.5Ag,and SAC305 (Sn-3.0Ag-0.5Cu) BGA Components with SAC305 Solder Paste
Many BGA and CSP component suppliers have begun shipment of components with a variety of “second generation” Pb-free solder ball alloys. Much of the motivation for the alloy changes has been to
.. leer más
FLAT-WRAP™ A Novel Approach to Copper Wrap Plate
Copper Wrap Plate as specified in IPC 6012B table 3-2,is a requirement developed to enhance reliability for PCB’s designed with via structures that require planarization and surface capping. PC
.. leer más
The Influence of Material Reactivity in Dk/Df Electrical Performance
Over the years,signal integrity performance and bandwidth gets more critical for today’s higher signal transmission speeds and bandwidth demand in every field of applications such as computing,
.. leer más
Opening Eyes on Fiber Weave and CAF
The signal channels that link high speed processors to memory and various other peripherals,are limited by the inherent characteristics of the printed circuit board. These are what ultimately c
.. leer más
Bare Board Material Performance after Pb-Free Reflow
The High Density Packaging Users Group (HDPUG) consortia completed an extensive study of 29 different bare board material and stackup combinations and their associated performance after 6X Pb-f
.. leer más
Reliability and Microstructure of Lead-Free Solder Joints in Industrial Electronics after Accelerated Thermal Aging
The reliability of lead-free (LF) solder joints in surface-mounted device components (SMD) has been investigated after thermo-cycle testing. Kirkendall voids have been observed at the interface
.. leer más
Long Term Reliability Analysis of Lead Free and Halogen Free Electronic Assemblies
The New England Lead Free Consortium,composed of many companies in the electronic supply chain in the regional area and chaired by the author; has embarked on an extensive long term reliability
.. leer más
Copper Pad Dissolution and Microstructure Analysis of Reworked Plastic Grid Array Assemblies
An experimental study was conducted to examine the impact of rework processes on quality and reliability. In this study,676 IO plastic ball grid array packages were assembled with Sn3.0Ag0.5Cu
.. leer más