Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
Presentación
Filling Pastes in PCB Production – Fields of Application,Possibilities and Limitations
In the past the use of filling pastes in PCB production was largely limited to via hole fillers. These materials with a solids
content of 100% are still successfully employed today to close via
.. leer más
The Feasibility of Blind Via on PTFE-FR4 Laminated Multi-Layer PCB
PTFE-FR4 hybrid laminated multi-layer PCB technology is being applied more and more widely. This technology requires blind via fabrication in a PTFE core. This paper gives a picture of the manu
.. leer más
Backdrilling Technology for Backpanel
In order to get excellent signal Integrity,half PTH holes will be a new trend in high frequency backpanel designing.
Backdrilling is necessary for this application. This paper explores the appl
.. leer más
Direct Immersion Gold as a Final Finish
In this study,the DIG process (Direct Immersion Gold),is investigated. DIG is a process in which gold is plated directly on
copper as a surface finish for printed circuit board and package appl
.. leer más
Characterization,Reproduction,and Resolution of Solder Joint Microvoiding
Microvoids are tiny voids in solder joints and differ from the more well known solder joint voiding in their individual size
and location. The microvoids discussed herein are described as an ab
.. leer más
Implementing Laser Marking of Printed Circuit Boards
Manufacturers of electronic devices,from home audio equipment to automotive keyless entry systems,are increasingly
seeking a reliable,cost effective method for uniquely identifying and tracking
.. leer más
Conductive Polymer Imaging For Communications and Electronics
Conductive inks and polymers based on metals were originally envisaged for quick repairs to Printed Circuit Boards (PCBs)
and semiconductor chips. Increasingly these materials are being used to
.. leer más
Optimization of Lead-Free Soldering Processes for Volume Manufacturing
In this paper,a comprehensive review is provided on the optimization of soldering processes (including reflow,wave
soldering,and rework),for different component types,different PCB sizes and fi
.. leer más
Lead-Free Solder Flip Chips on FR-4 Substrates with Different Assembly Processes and Materials
This study is focused on using different assembly options such as dip fluxing,flux jetting and reflow encapsulate for 200-
250um pitch lead-free (SnAgCu) flip chips on FR4 substrates. The impac
.. leer más
New Concept Multi-Layer FPC “SBic” For High-Density Device Mounting
We have developed a thin,high-density device-mounting,multilayer flexible printed circuit (hereinafter flexible printed
circuit is referred to as FPC) “SBic” (stands for Solder Bump Interconnec
.. leer más
Flexible PCB Plating Through Hole Considerations,Experiences and Solutions
Due to the worldwide increase in demand for flex and flex-rigid panels as well as the shift in the required designs of panels
there is an extreme need for improved PTH processing. There are sev
.. leer más
Environmentally Friendly Low Transmission Loss Base/Multilayer Materials
The frequencies used to communicate and process information have been extended beyond the GHz band to the microwave
band to handle the growing volume of data. Moreover,increasing global interes
.. leer más
Novel Material having Low Transmission Loss and Low Thermal Expansion designed for High Frequency Multi-layer Printed Circuit Board Applications
A new multi-layer PCB (printed circuit board) having low transmission loss and low thermal expansion that meets up-coming
further high speed and high volume data transmission demands was develo
.. leer más
Semiconductor Technology ITRS Roadmap
For four decades,the semiconductor industry has distinguished itself by the rapid pace of improvement in its products. The
principal categories of improvement trends are shown in Table 1 with e
.. leer más
System in Package: Identified Technology Needs from the 2994 iNEMI Roadmap
System in package (SiP) technology has grown significantly in the past several years. It was barely mentioned in the National
Electronics Manufacturing Initiative’s (NEMI’s) 2000 roadmap,but by
.. leer más
Roadmap to Compliance: The Role of Electronic Data Exchange in Supporting the European Union RoHS and WEEE Directives
The upcoming European Union RoHS and WEEE directives are driving new requirements for the management and exchange
of information,both across the extended electronics manufacturing value chain,a
.. leer más
Site-Specific Measurement of Cathodic Pulse Shape and Plating Current Density for Optimization of Pulse Plating Lines
Two important aspects concerning optimum performance of a (reverse) pulse plating line are (i) the uniform and correct pulse
shapes anywhere on the PCB and (ii) the uniformity of the plating cu
.. leer más
The Property Research and Applications of Vertical Pulse Copper Plating
Horizontal and vertical pulse plating have been widely used for panel plating in PCB industry,but rarely used for pattern
plating. This article analyzes and reviews the crystal structure,throwi
.. leer más
A Performance Simulation Tool for Bipolar Pulsed PCB Plating
The copper plating process is one of the most critical steps in the high end PCB manufacturing process. Although the
deposition inside through holes and blind holes is the key factor for reduci
.. leer más
Understanding the Impact of Accelerated Temperature Profiles on Lead-Free Soldering
Traditional reflow profiles for lead-free soldering typically require longer processing times due to elevated peak temperatures
and flux activation times defined by solder paste suppliers. Thes
.. leer más
Maximizing Lead Free Wetting
As lead free assembly is ramping up,wetting of lead free solder pastes is surfacing as the major paste performance tradeoff.
Global efforts to significantly increase lead free wetting chemicall
.. leer más
Effects of Cooling Slopes in Lead Free Reflow
As more electronic assemblers move to lead free SMT production,concerns are raised over reflow cooling slopes and effects
on solder joints. Due to the higher peak temperatures,cooling slopes ar
.. leer más
Reliability and Requirement of HDI Blind Hole
Nowadays there are two major ways to achieve the conducting function of HDI Blind Hole One is to employ conducting
metal paste to fill in the blind holes after laser drilling. The other is to f
.. leer más
New Circuit Formation Technology for High Density PWB
To meet future requirements for PWBs,various technologies of processes,materials and tools of PWBs have been discussed.
Especially important are technologies of circuit formation for high-end P
.. leer más
Internal Strain Free & Homogeneous Glass Fabrics for High Performance HDI Boards
A recent trend of increasing circuit density,particularly in the areas of plastic packages and multi-layer boards,has resulted in
ceaseless demand of improved mechanical properties for laminate
.. leer más
20μm Prepreg Substrates for Ultra-Thin Insulated Single-Layer
Recent increasing demand for miniaturization and multi-functionality of electronic devices has lead to higher PWBs circuit
density design,requiring thinner insulation layers,smaller via holes a
.. leer más
Development of the High Thermal Conduction Laminates for Large Current Board
With the objective of developing high thermal conductive laminates capable of being used as high current-carrying wiring
boards for automotive and industrial applications,we identified the opti
.. leer más
Japan’s JISSO Technology Roadmaps
Japan has a long history of publishing very important technology roadmaps. Some of the Japanese roadmaps published in the
past are:
JPCA Roadmaps
Report on the Technology Roadmap for Advanced S
.. leer más
The European Roadmap
A unified European roadmap for PWBs does not exist today. It is also most unlikely that a unified roadmap will available in a
foreseeable future time. However,the EIPC has worked together with
.. leer más
What makes the IPC Roadmap Unique?
Have you ever been confused after you have read two or three different roadmaps and even though they were supposedly
mapping the same attribute in the same time periods,the numbers in the cells
.. leer más
Filling Pastes in PCB Production – Fields of Application,Possibilities and Limitations
In the past the use of filling pastes in PCB production was largely limited to via hole fillers. These materials with a solids
content of 100% are still successfully employed today to close via
.. leer más
The Feasibility of Blind Via on PTFE-FR4 Laminated Multi-Layer PCB
PTFE-FR4 hybrid laminated multi-layer PCB technology is being applied more and more widely. This technology requires blind via fabrication in a PTFE core. This paper gives a picture of the manu
.. leer más
Backdrilling Technology for Backpanel
In order to get excellent signal Integrity,half PTH holes will be a new trend in high frequency backpanel designing.
Backdrilling is necessary for this application. This paper explores the appl
.. leer más
Direct Immersion Gold as a Final Finish
In this study,the DIG process (Direct Immersion Gold),is investigated. DIG is a process in which gold is plated directly on
copper as a surface finish for printed circuit board and package appl
.. leer más
Characterization,Reproduction,and Resolution of Solder Joint Microvoiding
Microvoids are tiny voids in solder joints and differ from the more well known solder joint voiding in their individual size
and location. The microvoids discussed herein are described as an ab
.. leer más
Implementing Laser Marking of Printed Circuit Boards
Manufacturers of electronic devices,from home audio equipment to automotive keyless entry systems,are increasingly
seeking a reliable,cost effective method for uniquely identifying and tracking
.. leer más
Conductive Polymer Imaging For Communications and Electronics
Conductive inks and polymers based on metals were originally envisaged for quick repairs to Printed Circuit Boards (PCBs)
and semiconductor chips. Increasingly these materials are being used to
.. leer más
Optimization of Lead-Free Soldering Processes for Volume Manufacturing
In this paper,a comprehensive review is provided on the optimization of soldering processes (including reflow,wave
soldering,and rework),for different component types,different PCB sizes and fi
.. leer más
Lead-Free Solder Flip Chips on FR-4 Substrates with Different Assembly Processes and Materials
This study is focused on using different assembly options such as dip fluxing,flux jetting and reflow encapsulate for 200-
250um pitch lead-free (SnAgCu) flip chips on FR4 substrates. The impac
.. leer más
New Concept Multi-Layer FPC “SBic” For High-Density Device Mounting
We have developed a thin,high-density device-mounting,multilayer flexible printed circuit (hereinafter flexible printed
circuit is referred to as FPC) “SBic” (stands for Solder Bump Interconnec
.. leer más
Flexible PCB Plating Through Hole Considerations,Experiences and Solutions
Due to the worldwide increase in demand for flex and flex-rigid panels as well as the shift in the required designs of panels
there is an extreme need for improved PTH processing. There are sev
.. leer más
Environmentally Friendly Low Transmission Loss Base/Multilayer Materials
The frequencies used to communicate and process information have been extended beyond the GHz band to the microwave
band to handle the growing volume of data. Moreover,increasing global interes
.. leer más
Novel Material having Low Transmission Loss and Low Thermal Expansion designed for High Frequency Multi-layer Printed Circuit Board Applications
A new multi-layer PCB (printed circuit board) having low transmission loss and low thermal expansion that meets up-coming
further high speed and high volume data transmission demands was develo
.. leer más
Semiconductor Technology ITRS Roadmap
For four decades,the semiconductor industry has distinguished itself by the rapid pace of improvement in its products. The
principal categories of improvement trends are shown in Table 1 with e
.. leer más
System in Package: Identified Technology Needs from the 2994 iNEMI Roadmap
System in package (SiP) technology has grown significantly in the past several years. It was barely mentioned in the National
Electronics Manufacturing Initiative’s (NEMI’s) 2000 roadmap,but by
.. leer más
Roadmap to Compliance: The Role of Electronic Data Exchange in Supporting the European Union RoHS and WEEE Directives
The upcoming European Union RoHS and WEEE directives are driving new requirements for the management and exchange
of information,both across the extended electronics manufacturing value chain,a
.. leer más
Site-Specific Measurement of Cathodic Pulse Shape and Plating Current Density for Optimization of Pulse Plating Lines
Two important aspects concerning optimum performance of a (reverse) pulse plating line are (i) the uniform and correct pulse
shapes anywhere on the PCB and (ii) the uniformity of the plating cu
.. leer más
The Property Research and Applications of Vertical Pulse Copper Plating
Horizontal and vertical pulse plating have been widely used for panel plating in PCB industry,but rarely used for pattern
plating. This article analyzes and reviews the crystal structure,throwi
.. leer más
A Performance Simulation Tool for Bipolar Pulsed PCB Plating
The copper plating process is one of the most critical steps in the high end PCB manufacturing process. Although the
deposition inside through holes and blind holes is the key factor for reduci
.. leer más
Understanding the Impact of Accelerated Temperature Profiles on Lead-Free Soldering
Traditional reflow profiles for lead-free soldering typically require longer processing times due to elevated peak temperatures
and flux activation times defined by solder paste suppliers. Thes
.. leer más
Maximizing Lead Free Wetting
As lead free assembly is ramping up,wetting of lead free solder pastes is surfacing as the major paste performance tradeoff.
Global efforts to significantly increase lead free wetting chemicall
.. leer más
Effects of Cooling Slopes in Lead Free Reflow
As more electronic assemblers move to lead free SMT production,concerns are raised over reflow cooling slopes and effects
on solder joints. Due to the higher peak temperatures,cooling slopes ar
.. leer más
Reliability and Requirement of HDI Blind Hole
Nowadays there are two major ways to achieve the conducting function of HDI Blind Hole One is to employ conducting
metal paste to fill in the blind holes after laser drilling. The other is to f
.. leer más
New Circuit Formation Technology for High Density PWB
To meet future requirements for PWBs,various technologies of processes,materials and tools of PWBs have been discussed.
Especially important are technologies of circuit formation for high-end P
.. leer más
Internal Strain Free & Homogeneous Glass Fabrics for High Performance HDI Boards
A recent trend of increasing circuit density,particularly in the areas of plastic packages and multi-layer boards,has resulted in
ceaseless demand of improved mechanical properties for laminate
.. leer más
20μm Prepreg Substrates for Ultra-Thin Insulated Single-Layer
Recent increasing demand for miniaturization and multi-functionality of electronic devices has lead to higher PWBs circuit
density design,requiring thinner insulation layers,smaller via holes a
.. leer más
Development of the High Thermal Conduction Laminates for Large Current Board
With the objective of developing high thermal conductive laminates capable of being used as high current-carrying wiring
boards for automotive and industrial applications,we identified the opti
.. leer más
Japan’s JISSO Technology Roadmaps
Japan has a long history of publishing very important technology roadmaps. Some of the Japanese roadmaps published in the
past are:
JPCA Roadmaps
Report on the Technology Roadmap for Advanced S
.. leer más
The European Roadmap
A unified European roadmap for PWBs does not exist today. It is also most unlikely that a unified roadmap will available in a
foreseeable future time. However,the EIPC has worked together with
.. leer más
What makes the IPC Roadmap Unique?
Have you ever been confused after you have read two or three different roadmaps and even though they were supposedly
mapping the same attribute in the same time periods,the numbers in the cells
.. leer más