Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
Presentación
A Fast,Precise and Reproducible QC-Rheometry Routine for Solder Paste
SPC data has shown that the solder paste printing process is the primary source of soldering defects in SMT assembly.
Consequently,verification of the specified printing properties of solder pa
.. leer más
Optimizing Solder Paste Printing For Wafer Bumping
Recently,wafer bumping using solder paste with very fine solder powder has come into focus as more cost effective than
conventional sputtered or plated methods. This additive method revolves ar
.. leer más
Solder Paste Printing of High Density Substrates using Enhanced Print Technology
The research discussed in this paper uses an innovative enhancement technique for printing High Density substrates. The
technique takes advantage of high frequency low amplitude vibrations appl
.. leer más
Investigating Compliant Tooling Solutions within a Mass Imaging Process
The printing process is always highlighted as contributing the most process defects to a surface mount manufacturing
production facility; typical values presented are around the 60% range. Fact
.. leer más
Squeegee Blades vs. Pump Technology: A Comparison of Solder Paste Print Performance
Enclosed print heads have recently been available to circuit board manufacturers as an alternate technology to conventional
squeegee printing. By design,enclosed print heads offer several advan
.. leer más
A New Non-Halogen Flame-Retardant System for Printed Wiring Boards
There is continued interest in utilizing alternatives to bromine-based flame retardants for printed wiring boards. As a result,a
wide variety of phosphorus and non-phosphorus systems have been
.. leer más
New Materials for HDI Interconnect Applications
A study was conduced to see if faster laser ablation rates,improved fracture resistance and better copper adhesion
after electroless plating could be engineered into existing Resin Coated Foils
.. leer más
High Phosphorous Electroless Nickel Process for Mobile Phone PWBs
An Electroless Nickel and Immersion Gold (ENIG) plating process with a middle phosphorous content nickel layer is
currently a mainstream final finishing application for mobile phone Printed Wir
.. leer más
Next Generation Organic Solderability Preservatives (OSP) for Lead-free soldering and Mixed Metal Finish PWB’s and BGA Substrates
With the electronics industry rapidly moving to lead-free soldering and requirements for long term reliability of the assembly
becoming more critical,fabricators and OEM’s must determine the mo
.. leer más
Phosphorus in Electroless Nickel Layers – Curse or Blessing?
The influence of co-deposited Phosphorous (P) (from low to high P) within an electroless Nickel layer,regarding the
reliability of the solder joint integrity was investigated. The solder joint
.. leer más
The Chemistry and Properties of a Newly Developed Immersion Silver Coating for PWB
To meet the emerging requirement of eliminating lead from electronics,the printed wiring board (PWB) industry is migrating
from hot-air-leveled SnPb solder to alternative final finishes. A thin
.. leer más
Implementation of Immersion Silver PCB Surface Finish In Compliance With Underwriters Laboratories
At times,the electronics industry changes faster than the testing and regulatory groups serving the industry. In this case,the
electronics supply chain thoroughly evaluated the new printed circ
.. leer más
Lead and Lead-free Solder Project LCIA Characterization Methods
This paper describes the life-cycle impact assessment methodology developed by the University of Tennessee to calculate
the impacts resulting from the use of lead and lead-free solders during t
.. leer más
End-of-Life Management of Electronics Products Through Functional Signature Analysis
This paper presents a functional signature analysis method for the end-of-life management of products,particularly for
electrical-electronics and electromechanical applications.
Due to the fast
.. leer más
Introduction to Microvia Design
Microvias are the fastest growing new technology for printed circuits. This talk will highlight the procedures,standards and
conditions that designers needs to consider to introduce microvias t
.. leer más
CAD Toolsets: Today,Tomorrow and Over the Horizon
One of the most enabling product industries in the world today is Computer Automated Design (CAD). Can you imagine how
far technology would have progressed if not for the automation of computer
.. leer más
PCB Design Using the Metric System
There are many ways of specifying units for many different measurements,and over the years they have developed a life of
their own. For example,length was once measured with glorious imprecisio
.. leer más
The CAD Library of the Future
The electronics industry is constantly growing and introducing new technology sometimes faster than we can keep up with. This
paper reviews one of the single most important,but sometimes overlo
.. leer más
VIGOR European Project New Industrial Applications in 3-D Interconnection
The 3-D interconnection and packaging emerged from the last decade. Today,the 3-D interconnection technologies are
becoming mature and their reliability assessed. 3-D technology constitutes the
.. leer más
Liquid Solders for High Temperature Solder Joints
This paper presents a new joining technology for high-temperature application of solder joints,based on the results of the
joint research project "TLSD". By the use of temporary liquid solder j
.. leer más
Using High Volume Electronics Manufacturing Technology to Develop a High Volume Fuel Cell Manufacturing Process
During the last several years there has been and continues to be an enormous investment by both governments and industry in
the development and manufacture of fuel cells. The United States,Japa
.. leer más
Jetting of Underfill and Encapsulants for High-Speed Dispensing in Tight Spaces
The underfill process has become common practice in the assembly of flip chip and CSP devices and the practice of area
array assembly has been adopted by many board designers and component asse
.. leer más
Wafer Applied Underfill: Flip Chip Assembly and Reliability
Manufacturers of consumer electronic products are continuously striving to confer greater functionality to smaller,lighter,
and less expensive packages,and flip chip is an important enabling te
.. leer más
Influence of Flux and Powder Morphology on Void Formation in Silicon Wafer Bumping
Use of solder paste as a material to bump silicon wafers for interconnection to other level of package interconnection is a
simple and cost effective process. However,the material properties of
.. leer más
Flip Chip Connections Using Bumps,Wells,and Imprinting
A conceptual framework for a new type of flip chip attachment is proposed. Gold stud bumps are provided on the chips,and
wells filled with solder paste are provided on a flexible substrate serv
.. leer más
Stencil Design and Performance for Flip Chip/Wafer Bumping
There has been much recent interest in printing solder paste onto UBM pads of a wafer. Usually the wafer pad is overprinted
using a stencil aperture that is larger than the wafer pad. This perm
.. leer más
Lead-Free Solder Bumping Technologies
Electroplated pure tin and tin alloys such as Sn99.3Cu0.7%,Sn98%Bi2% and Sn96.5%Ag3.5% have been identified as
viable drop-in replacements to tin-lead solder. High melting point tin alloys such
.. leer más
Enhanced Eutectic Solder Bump for Increased Flip Chip Reliability
Applications using flip chips in high temperature and high current designs have increased in recent years,and this trend is
expected to continue. Markets utilizing these designs include high pe
.. leer más
Creep of Sn-(3.5-3.9)wt%Ag-(0.5-0.8)wt%Cu Lead-Free Solder Alloys and Their Solder Joint Reliability
A new set of constitutive equations for a class of lead-free solder alloys,Sn(3.5-3.9)wt%Ag(0.5-0.8)wt%Cu is proposed in
this investigation. These equations are applied to a 256PBGA (plastic ba
.. leer más
An Assessment of the Impact of Lead-Free Assembly Processes on Base Material and PCB Reliability
Environmental regulations are forcing the elimination of lead (Pb) from electronic equipment. Solders containing lead have
been the standard in printed circuit assembly processes. Lead-free sol
.. leer más
A Fast,Precise and Reproducible QC-Rheometry Routine for Solder Paste
SPC data has shown that the solder paste printing process is the primary source of soldering defects in SMT assembly.
Consequently,verification of the specified printing properties of solder pa
.. leer más
Optimizing Solder Paste Printing For Wafer Bumping
Recently,wafer bumping using solder paste with very fine solder powder has come into focus as more cost effective than
conventional sputtered or plated methods. This additive method revolves ar
.. leer más
Solder Paste Printing of High Density Substrates using Enhanced Print Technology
The research discussed in this paper uses an innovative enhancement technique for printing High Density substrates. The
technique takes advantage of high frequency low amplitude vibrations appl
.. leer más
Investigating Compliant Tooling Solutions within a Mass Imaging Process
The printing process is always highlighted as contributing the most process defects to a surface mount manufacturing
production facility; typical values presented are around the 60% range. Fact
.. leer más
Squeegee Blades vs. Pump Technology: A Comparison of Solder Paste Print Performance
Enclosed print heads have recently been available to circuit board manufacturers as an alternate technology to conventional
squeegee printing. By design,enclosed print heads offer several advan
.. leer más
A New Non-Halogen Flame-Retardant System for Printed Wiring Boards
There is continued interest in utilizing alternatives to bromine-based flame retardants for printed wiring boards. As a result,a
wide variety of phosphorus and non-phosphorus systems have been
.. leer más
New Materials for HDI Interconnect Applications
A study was conduced to see if faster laser ablation rates,improved fracture resistance and better copper adhesion
after electroless plating could be engineered into existing Resin Coated Foils
.. leer más
High Phosphorous Electroless Nickel Process for Mobile Phone PWBs
An Electroless Nickel and Immersion Gold (ENIG) plating process with a middle phosphorous content nickel layer is
currently a mainstream final finishing application for mobile phone Printed Wir
.. leer más
Next Generation Organic Solderability Preservatives (OSP) for Lead-free soldering and Mixed Metal Finish PWB’s and BGA Substrates
With the electronics industry rapidly moving to lead-free soldering and requirements for long term reliability of the assembly
becoming more critical,fabricators and OEM’s must determine the mo
.. leer más
Phosphorus in Electroless Nickel Layers – Curse or Blessing?
The influence of co-deposited Phosphorous (P) (from low to high P) within an electroless Nickel layer,regarding the
reliability of the solder joint integrity was investigated. The solder joint
.. leer más
The Chemistry and Properties of a Newly Developed Immersion Silver Coating for PWB
To meet the emerging requirement of eliminating lead from electronics,the printed wiring board (PWB) industry is migrating
from hot-air-leveled SnPb solder to alternative final finishes. A thin
.. leer más
Implementation of Immersion Silver PCB Surface Finish In Compliance With Underwriters Laboratories
At times,the electronics industry changes faster than the testing and regulatory groups serving the industry. In this case,the
electronics supply chain thoroughly evaluated the new printed circ
.. leer más
Lead and Lead-free Solder Project LCIA Characterization Methods
This paper describes the life-cycle impact assessment methodology developed by the University of Tennessee to calculate
the impacts resulting from the use of lead and lead-free solders during t
.. leer más
End-of-Life Management of Electronics Products Through Functional Signature Analysis
This paper presents a functional signature analysis method for the end-of-life management of products,particularly for
electrical-electronics and electromechanical applications.
Due to the fast
.. leer más
Introduction to Microvia Design
Microvias are the fastest growing new technology for printed circuits. This talk will highlight the procedures,standards and
conditions that designers needs to consider to introduce microvias t
.. leer más
CAD Toolsets: Today,Tomorrow and Over the Horizon
One of the most enabling product industries in the world today is Computer Automated Design (CAD). Can you imagine how
far technology would have progressed if not for the automation of computer
.. leer más
PCB Design Using the Metric System
There are many ways of specifying units for many different measurements,and over the years they have developed a life of
their own. For example,length was once measured with glorious imprecisio
.. leer más
The CAD Library of the Future
The electronics industry is constantly growing and introducing new technology sometimes faster than we can keep up with. This
paper reviews one of the single most important,but sometimes overlo
.. leer más
VIGOR European Project New Industrial Applications in 3-D Interconnection
The 3-D interconnection and packaging emerged from the last decade. Today,the 3-D interconnection technologies are
becoming mature and their reliability assessed. 3-D technology constitutes the
.. leer más
Liquid Solders for High Temperature Solder Joints
This paper presents a new joining technology for high-temperature application of solder joints,based on the results of the
joint research project "TLSD". By the use of temporary liquid solder j
.. leer más
Using High Volume Electronics Manufacturing Technology to Develop a High Volume Fuel Cell Manufacturing Process
During the last several years there has been and continues to be an enormous investment by both governments and industry in
the development and manufacture of fuel cells. The United States,Japa
.. leer más
Jetting of Underfill and Encapsulants for High-Speed Dispensing in Tight Spaces
The underfill process has become common practice in the assembly of flip chip and CSP devices and the practice of area
array assembly has been adopted by many board designers and component asse
.. leer más
Wafer Applied Underfill: Flip Chip Assembly and Reliability
Manufacturers of consumer electronic products are continuously striving to confer greater functionality to smaller,lighter,
and less expensive packages,and flip chip is an important enabling te
.. leer más
Influence of Flux and Powder Morphology on Void Formation in Silicon Wafer Bumping
Use of solder paste as a material to bump silicon wafers for interconnection to other level of package interconnection is a
simple and cost effective process. However,the material properties of
.. leer más
Flip Chip Connections Using Bumps,Wells,and Imprinting
A conceptual framework for a new type of flip chip attachment is proposed. Gold stud bumps are provided on the chips,and
wells filled with solder paste are provided on a flexible substrate serv
.. leer más
Stencil Design and Performance for Flip Chip/Wafer Bumping
There has been much recent interest in printing solder paste onto UBM pads of a wafer. Usually the wafer pad is overprinted
using a stencil aperture that is larger than the wafer pad. This perm
.. leer más
Lead-Free Solder Bumping Technologies
Electroplated pure tin and tin alloys such as Sn99.3Cu0.7%,Sn98%Bi2% and Sn96.5%Ag3.5% have been identified as
viable drop-in replacements to tin-lead solder. High melting point tin alloys such
.. leer más
Enhanced Eutectic Solder Bump for Increased Flip Chip Reliability
Applications using flip chips in high temperature and high current designs have increased in recent years,and this trend is
expected to continue. Markets utilizing these designs include high pe
.. leer más
Creep of Sn-(3.5-3.9)wt%Ag-(0.5-0.8)wt%Cu Lead-Free Solder Alloys and Their Solder Joint Reliability
A new set of constitutive equations for a class of lead-free solder alloys,Sn(3.5-3.9)wt%Ag(0.5-0.8)wt%Cu is proposed in
this investigation. These equations are applied to a 256PBGA (plastic ba
.. leer más
An Assessment of the Impact of Lead-Free Assembly Processes on Base Material and PCB Reliability
Environmental regulations are forcing the elimination of lead (Pb) from electronic equipment. Solders containing lead have
been the standard in printed circuit assembly processes. Lead-free sol
.. leer más