Join IPC President and CEO John Mitchell and alliantgroup’s Jenn Groff for an informative session and discussion on the latest updates to powerful tax credits and incentives for IPC members, manufacturers, and suppliers.

My colleague Happy Holden famously stated that only about 10% of design packages received by PCB fabricators are complete and accurate out of the gate. This means unnecessary time and cost are going into the other 90% of jobs. What it also means is that design success and product reliability are in jeopardy if these issues are not identified and addressed.  Early engagement between a PCB fabricator and a PCB designer is essential to avoid common design issues that will impact the success of any PCB design. Getting the PCB fabricator's engineers together with the PCB designers to understand manufacturing capabilities and collaborate on the optimum design solution for a particular application is mission-critical to the success of the project. This webinar will cover:  •    Customer service representatives are not engineers; why all technical questions cannot be addressed during the quoting stage. •    What happens when the customer's netlist does not match the customer's Gerber/3d data. •    Customer impedance requirements don't match the drawings/data.  •    Picking the appropriate material set for a given design application. •    Customized CAM adjustments for manufacturability.  •    The impact of a PCB designer not understanding fabricator capabilities. •    Unmanufacturable designs. •    Inheriting designs from another PCB fabricator. •    Overdesigning a project from a complexity and cost standpoint.  •    Early and often engagement; it's all about time and cost.

Bring your questions for this expert panel to explore how your organization can mirror these successes and make training a central lever for growth—not just compliance.

Real discussion on the “digital tools of the trade” to realize Industry 4.0 in a systematic approach, with focus on the business case ROI, real time connectivity, and predictive AI-enabled technologies for Maintenance 4.0 and Quality 4.0

IPC and iNEMI convened electronics industry experts in person on June 17 to discuss circularity challenges at the workshop, "There’s no end to a circle. A workshop on how to address circularity challenges in electronics manufacturing" at the Electronics Goes Green conference in Berlin. The fundamental goal of the workshop was to scope industry solutions to address pressing circularity challenges. Please join us on July 17 at 10:00 AM EDT to learn more about the results of the workshop and next steps that will lead to work by iNEMI and IPC.

4.00 PM: Welcome Address by Mr Rajiv Nath, Forum Coordinator, Association of Indian Medical Device Industry (AIMED) & Mr. G V Subrahmanyam, Jt. Coordinator, EVG, AiMeD

We are delighted to welcome expert panelists to discuss what automakers, startups, and T1s are demanding from their supply chains in terms of sustainability. Panelists will weigh in the top 3 challenge areas beyond current regulatory reporting and what may be coming next.

Review historical timeline of the research in this area. Join Dr. Syed Sajid Ahmad, Ph.D summarize and present pertinent results including the means & actions proposed and tried to alleviate the adverse effects of the Kirkendall voiding caused by the phenomenon. What promotes purple plague. How to control its formation and growth. Observation and measurement methods. Interface analysis techniques. Methods of failure analysis.

In this webinar, we will dive into the Ecodesign for Sustainable Products Regulation (ESPR) and Digital Product Passports (DPPs), providing a clear explanation of what they are and how they work.

The proliferation of electronics into harsh environments has however, highlighted the well-established link between process residues and electro-chemical migration (ECM) caused failures. Higher operational voltages, increased component densities, and assembly miniaturization, and increased reliability expectations increase the relationship between clean assemblies and long-term reliability.

Bottom termination components (BTCs) are becoming increasingly common in assemblies due to their low cost and high performance. There are varying types of BTCs in the electronics industry, such as QFN, SOIC, and LGA, all of which are typical on assemblies. The defining characteristic of these components is that the terminations are flat on the bottom, therefore relying on solder paste to make the component to board connection. This means that the height of the solder is primarily determined by the volume of solder paste and the finished assembly might not have visible solder joints to inspect. As you can imagine, this makes BTCs very challenging to inspect, often leading to X-ray analysis for process control. Are you using BTCs on your assembly?  Looking to understand the inspection process of BTCs? Having trouble inspecting your BTC?  In this webinar we will take a deep dive into the inspection of Bottom Termination Components utilizing visual, X-ray and cross section analysis. 

This webinar discusses new methods and techniques that use 3D X-ray microscopy (XRM), nanoscale imaging, and deep learning (DL) to visualize the internal structures and assemblies of electronic devices, e.g., ball grid array components (BGAs), column grid arrays, solder connections, underfill/staking, etc. Key discussions include: • Deep Learning Algorithms: These improve the quality of scans by enhancing contrast and reducing noise. • DeepScout Tool: This tool uses 3D XRM scans from specific areas to train a neural network, allowing for high-resolution images to be created from lower-resolution data over a larger area. These methods can be used independently or complementary to other multiscale correlative microscopy evaluations, e.g., electron microscopy. They provide valuable insights into electronic packages and integrated circuits, revealing details from large features (hundreds of mm) to microscopic details in electronic components (tens of nm). By using X-ray imaging and machine learning, along with other imaging methods, we can speed up development time, reduce costs, and simplify failure analysis (FA) and quality inspection of printed circuit boards (PCBs) and electronic devices assembled with new emerging technologies.

Data-driven manufacturing is revolutionizing the industry, improving quality, productivity and agility, while also decreasing production costs and ordering lead-times. In sectors requiring a very high degree of security within manufacturing and of product data, the adoption of Smart Manufacturing solutions has been severely limited. As a result, many companies in the electronics manufacturing industry, especially those in high-security sectors, are left with an increasing gap in terms of competitiveness, leading to relatively increased costs and a lack of flexibility. IPC Connected Factory Exchange (IPC-CFX), an open industry standard for shop floor communication, provides a whole new mechanism of secure data transfer, as well as the ability to securely bridge the “air-gap” between the operational shop floor and secure business systems. In this webinar, we will explain the issues around internal factory security and how any company can leverage the secure encryption and standardized equipment messaging of IPC-CFX in security-critical manufacturing environments to support Smart Industry 4.0 initiatives and data collection and analysis, without risk of compromise. Can't make the live session? No problem! Register and you will receive a recording this presentation via email.

This webinar is designed to provide non-professional cybersecurity specialists with the facts and awareness they need. No extensive knowledge of cybersecurity is required. Topics include: •    The possibility you may be the target of a cyber attack. •    Why attack countermeasures and manufacturing members of the production floor seem so far away. •    The efforts and limitations of IT engineers. •    The essence of Zero Trust Architecture. •    The role of manufacturing members on the shop floor. •    Balancing the cost of countermeasures versus profits within the manufacturing industry. •    Discussion of IPC-1792

We are delighted to welcome Adrian Harea of Schaeffler and Michael Schleicher of Semikron-Danfoss to lead a discussion on DfM for EV's high-voltage / high-power applications.

Join us for FREE e-textiles presentations and virtual demonstrations from around the world! Visit the event website for complete details.