Join Anthony J. Bryant as he previews his August IPC Counterfeit Electronic Parts Mitigation course. The webinar reviews the key aspects of counterfeit documentation challenges focusing on the recent issues with aircraft engines and the broader High-Reliability supply chain concerns. Participants will gain a comprehensive understanding of the problem, as well as practical strategies and best practices for mitigating the risks. In this webinar, we’ll cover:

- Understand the scope and impact of counterfeit documentation in the aerospace industry
- Identify common tactics used by counterfeiters to create fake documentation
- Learn strategies and best practices for mitigating the risk of counterfeit documentation
- Discuss industry-wide initiatives and regulations aimed at addressing this challenge

IPC and iNEMI convened electronics industry experts in person on June 17 to discuss circularity challenges at the workshop, "There’s no end to a circle. A workshop on how to address circularity challenges in electronics manufacturing" at the Electronics Goes Green conference in Berlin. The fundamental goal of the workshop was to scope industry solutions to address pressing circularity challenges. Please join us on July 17 at 10:00 AM EDT to learn more about the results of the workshop and next steps that will lead to work by iNEMI and IPC.

Explore the world of PCB Board Fabrication and discover the journey of design artwork once it’s dispatched to the board shop. This comprehensive webinar provides insights into the process, making it a valuable resource for Electrical Engineers, PCB Layout Professionals, Supply Chain personnel, and anyone interested in PCB Board Fabrication. In this webinar, we’ll cover:

- Design and layout
- Material selection
- Drilling, imaging, and etching processes
- Plating and finishing
- Solder Mask materials and application
- Silkscreening
- Cost Drivers

This webinar will focus on circularity in electronics manufacturing, particularly on the recovery and reuse of integrated circuits (ICs).

A group of industry experts will discuss the evidence of the root causes of creep corrosion, relevant testing, and effective mitigation strategies available to prevent creep corrosion failures in electronics. Fundamentally, creep corrosion is the product of the reaction of copper with sulfur, which may be mitigated with manufacturing processes, such as the printed circuit board solder mask and surface finish, conformal coating, and enclosure levels, as well as during end use operation, such as filtration. Several types of harsh environmental test methods that are used to evaluate for product susceptibility to creep corrosion will also be reviewed.

Panelists include:
• Randy Schueller, Ph.D., Dell, Director, Client Reliability & Durability
• Christopher Genthe, Rockwell Automation, Senior Principal Engineer
• Paul Leone, Rockwell Automation, Principal Engineer

My colleague Happy Holden famously stated that only about 10% of design packages received by PCB fabricators are complete and accurate out of the gate. This means unnecessary time and cost are going into the other 90% of jobs. What it also means is that design success and product reliability are in jeopardy if these issues are not identified and addressed. 

Early engagement between a PCB fabricator and a PCB designer is essential to avoid common design issues that will impact the success of any PCB design. Getting the PCB fabricator's engineers together with the PCB designers to understand manufacturing capabilities and collaborate on the optimum design solution for a particular application is mission-critical to the success of the project. This webinar will cover: 
•    Customer service representatives are not engineers; why all technical questions cannot be addressed during the quoting stage.
•    What happens when the customer's netlist does not match the customer's Gerber/3d data.
•    Customer impedance requirements don't match the drawings/data. 
•    Picking the appropriate material set for a given design application.
•    Customized CAM adjustments for manufacturability. 
•    The impact of a PCB designer not understanding fabricator capabilities.
•    Unmanufacturable designs.
•    Inheriting designs from another PCB fabricator.
•    Overdesigning a project from a complexity and cost standpoint. 
•    Early and often engagement; it's all about time and cost.

Join experts from the U.S. State Department and the environmental law firm Beveridge and Diamond for a discussion of new and anticipated international rules governing plastics use and management in the electronics value chain.

This webinar will describe available apprenticeship funding opportunities to support your workforce development costs. We aim to demystify these funding opportunities and make them more accessible. We understand that navigating the labyrinth of government funding can be overwhelming, which is how IPC can help.

Implementation of a new process, machine, or material triggers a qualification event for that change under the new H revision of IPC J-STD-001.

When a change in specific materials is being considered, one must determine and provide objective evidence that the improvement does not increase the quality or functionality risk of the product. In order to quantify the risk, the CM and/or OEM are required to acquire quantitative data before implementing the process change. The methodology developed in this webinar is designed to assist the user in incorporating specific tools and analytical measurements to ensure the product’s reliability via objective evidence and controls. This webinar illustrates the challenges of a real-life implementation of a new material change and the subsequent qualification.

Electronics manufacturers aim to minimize the amount of flux residues. Solder flux residues constitute a significant source of ionic contamination on the manufactured PCBAs, and the activator type in the flux determines their corrosiveness. The risk occurs on low standoff components, such as the QFN, due to blocked flux outgassing channels. The second risk is the number of soldering process steps used to build the assembly. Selective soldering, wave soldering, manual, and rework soldering can spread flux residues across the assembly. Pockets of active residue can be present when the flux is not fully heat-activated. For high reliability, the best practice is to clean the assembly.

This webinar will teach best practices for qualifying and validating acceptable electrical hardware performance. The methods taught during this presentation can be used to meet the requirements of IPC J-STD-001H ~ Section 8: Cleanliness.