Review historical timeline of the research in this area. Join Dr. Syed Sajid Ahmad, Ph.D summarize and present pertinent results including the means & actions proposed and tried to alleviate the adverse effects of the Kirkendall voiding caused by the phenomenon. What promotes purple plague. How to control its formation and growth. Observation and measurement methods. Interface analysis techniques. Methods of failure analysis.

In this webinar, we will dive into the Ecodesign for Sustainable Products Regulation (ESPR) and Digital Product Passports (DPPs), providing a clear explanation of what they are and how they work.

The proliferation of electronics into harsh environments has however, highlighted the well-established link between process residues and electro-chemical migration (ECM) caused failures. Higher operational voltages, increased component densities, and assembly miniaturization, and increased reliability expectations increase the relationship between clean assemblies and long-term reliability.

Bottom termination components (BTCs) are becoming increasingly common in assemblies due to their low cost and high performance. There are varying types of BTCs in the electronics industry, such as QFN, SOIC, and LGA, all of which are typical on assemblies. The defining characteristic of these components is that the terminations are flat on the bottom, therefore relying on solder paste to make the component to board connection. This means that the height of the solder is primarily determined by the volume of solder paste and the finished assembly might not have visible solder joints to inspect. As you can imagine, this makes BTCs very challenging to inspect, often leading to X-ray analysis for process control. Are you using BTCs on your assembly?  Looking to understand the inspection process of BTCs? Having trouble inspecting your BTC?  In this webinar we will take a deep dive into the inspection of Bottom Termination Components utilizing visual, X-ray and cross section analysis. 

This webinar discusses new methods and techniques that use 3D X-ray microscopy (XRM), nanoscale imaging, and deep learning (DL) to visualize the internal structures and assemblies of electronic devices, e.g., ball grid array components (BGAs), column grid arrays, solder connections, underfill/staking, etc. Key discussions include: • Deep Learning Algorithms: These improve the quality of scans by enhancing contrast and reducing noise. • DeepScout Tool: This tool uses 3D XRM scans from specific areas to train a neural network, allowing for high-resolution images to be created from lower-resolution data over a larger area. These methods can be used independently or complementary to other multiscale correlative microscopy evaluations, e.g., electron microscopy. They provide valuable insights into electronic packages and integrated circuits, revealing details from large features (hundreds of mm) to microscopic details in electronic components (tens of nm). By using X-ray imaging and machine learning, along with other imaging methods, we can speed up development time, reduce costs, and simplify failure analysis (FA) and quality inspection of printed circuit boards (PCBs) and electronic devices assembled with new emerging technologies.

Data-driven manufacturing is revolutionizing the industry, improving quality, productivity and agility, while also decreasing production costs and ordering lead-times. In sectors requiring a very high degree of security within manufacturing and of product data, the adoption of Smart Manufacturing solutions has been severely limited. As a result, many companies in the electronics manufacturing industry, especially those in high-security sectors, are left with an increasing gap in terms of competitiveness, leading to relatively increased costs and a lack of flexibility. IPC Connected Factory Exchange (IPC-CFX), an open industry standard for shop floor communication, provides a whole new mechanism of secure data transfer, as well as the ability to securely bridge the “air-gap” between the operational shop floor and secure business systems. In this webinar, we will explain the issues around internal factory security and how any company can leverage the secure encryption and standardized equipment messaging of IPC-CFX in security-critical manufacturing environments to support Smart Industry 4.0 initiatives and data collection and analysis, without risk of compromise. Can't make the live session? No problem! Register and you will receive a recording this presentation via email.

This webinar is designed to provide non-professional cybersecurity specialists with the facts and awareness they need. No extensive knowledge of cybersecurity is required. Topics include: •    The possibility you may be the target of a cyber attack. •    Why attack countermeasures and manufacturing members of the production floor seem so far away. •    The efforts and limitations of IT engineers. •    The essence of Zero Trust Architecture. •    The role of manufacturing members on the shop floor. •    Balancing the cost of countermeasures versus profits within the manufacturing industry. •    Discussion of IPC-1792

We are delighted to welcome Adrian Harea of Schaeffler and Michael Schleicher of Semikron-Danfoss to lead a discussion on DfM for EV's high-voltage / high-power applications.

Join us for FREE e-textiles presentations and virtual demonstrations from around the world! Visit the event website for complete details.

This webinar will describe available apprenticeship funding opportunities to support your workforce development costs. We aim to demystify these funding opportunities and make them more accessible. We understand that navigating the labyrinth of government funding can be overwhelming, which is how IPC can help.

Supply Chain Integrity: Protecting Your Business from Counterfeit Electronics - A Non-Technical Guide to Component Authentication Join SAE G19A subcommittee expert Anthony Bryant for an essential one-hour webinar focused on supply chain integrity and counterfeit electronics prevention. This session is specifically designed for non-technical personnel working in the electronics component supply chain including procurement professionals, supply chain managers, quality assurance staff, and business leaders. With counterfeit electronics reporting increasing by 25% in 2024 to over 1,055 suspect parts, the threat to supply chain integrity has never been more critical. This webinar will equip attendees with practical knowledge to identify red flags, understand current trends, and implement effective counterfeit mitigation strategies that protect both business operations and end-user safety. Key Learning Outcomes: • Understand current counterfeit electronics trends and their business impact • Learn visual inspection techniques requiring no technical background • Identify documentation red flags and fraudulent paperwork • Recognize supplier risk indicators and sourcing vulnerabilities • Implement practical counterfeit avoidance strategies • Understand regulatory compliance requirements and industry standards Target Audience: Procurement professionals, supply chain managers, quality assurance personnel, business leaders, and anyone involved in electronics component sourcing and management.

John Mike Carano, RBP Chemical Technolgy, for a webinar hosted by IPC’s Thought Leaders Program, “Defect Resolution in Manufacturing,” for an interactive discussion.

This webinar will focus on circularity in electronics manufacturing, particularly on the recovery and reuse of integrated circuits (ICs).

The iNEMI/IPC/Fraunhofer Eco-Design Team recently hosted a series of interactive webinars featuring experts from leading electronics companies doing innovative, beyond compliance eco-design. The series provided an avenue for these experts to showcase their thought leadership, identify strategies for success, and their best practices.

We are delighted to welcome Dr. Habib Mustain of Hereaus to discuss power electronic substrate types, requirements, and challenges for today's EV applications.

Join Madison Maxey, founder and technical lead of Loomia, as she shares highlights of her IPC APEX EXPO 2023 professional development course. The course provides a primer to electrical and mechanical engineers -as well as product designers - on how to engage with electronic textiles for new product development. Attendees should walk away with a clear picture of when electronic textiles may be relevant to their engineering, which type of technology is ideal for their application, and how to thoroughly evaluate a technology when selected.