Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
PTFE based Solutions for the Future of High Speed Digital
A growing need is developing in the high-speed digital arena (backpanels,motherboards,line cards etc) for materials offering sufficient signal integrity for applications up to 10 Gbps. One solu
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Manufacturing and Reliability Evaluation of a Lead-Free Electronics Network Card
Lead-free manufacturing is becoming an industry initiative for environmental and legislative reasons. Lead-Free processing is rather new to the industry and the development of a successful asse
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Design of Experiments to Assess the Solderability of Various Printed Wiring Board Finishes
There are two main driving forces that are causing the electronics industry to take a look at alternatives to hot air solder leveling (HASL) as a surface finish for printed wiring boards (PWB).
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Where Crystal Planes Meet: Contribution to the Understanding of the Tin Whisker Growth Process
The texture of a tin deposit has been described as a key factor influencing whisker growth. Based on X-ray diffraction (XRD) and whisker growth data,this paper intends to show one possible mech
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Microstructural Evolution and Damage Mechanisms in Pb-Free Solder Joints During Extended -40 Degrees C to 125 Degrees C Thermal Cycles
A comparative study of package-to-board interconnections of a 1.27mm pitch BGA package using two Pb-free alloys and Sn-Pb solder in extended –40 to 125°C thermal cycling is described. The micro
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Reliability and Failure Analysis of Lead-Free Solder Joints
This paper provides a comparison of the air-to-air thermal cyclic reliability and associated failure modes of second level interconnects in lead-free,1.27 mm pitch,256 I/O BGA devices with eute
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Accelerating Plating Cycles and Reducing Costs: Improving the Plating of High Aspect Ratio Holes & Blind Vias
This paper describes a new technology for speeding the initiation and uniformity of electroplating deposits that does
not depend on modifying the chemistry or physical environment of the platin
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Advanced Laminate and Prepreg for PWBs with Embedded Components
The technology for embedding components in PWBs will change the process how PWB are fabricated over the next
few years. At the present time,polymer thick film is the most frequently used materi
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The Advanced NiAu-Process for Second Image Technology
Designs of new electronic products show a significant drive for smaller and more complex PWBs. This continuing trend of miniaturization affects components in the same way as for the connecting
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Beyond Periodic Pulse Reverse
According to Michael Shernerof of Scientific American (Jan. 2002) technology has advanced more in the past one century than in the previous one hundred centuries. Yet it seems from a technical
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Board Finishes for the EMS Provider
Some new alternative PWB surface finishes have been entering the industry over the past few years. In order for any
new board surface finish to be accepted for general use,it must be approved b
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Breaking the Information Bottleneck in Printed Circuit Board Engineering Teams: The Promise of New Software Innovation
This paper addresses the challenges of pre-production engineering,why the engineering department is viewed as a
bottleneck in many PCB companies,and how a dedicated software system breaks the i
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Component Damage from Printed Circuit Board Loading
Electronic components are being used in increasingly more severe shock environments. This combined with an
industry trend of increased component reliability to help reduce electronic system dow
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Conductive Anodic Filament Growth Failure
With increasing focus on reliability and miniaturized designs,Conductive Anodic Filament (CAF) as failure
mechanism is gaining a lot of attention. Smaller geometries make the printed circuit bo
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Conductive Anodic Filament Resistant FR-4 Substrates
As the trend to increased interconnection density continues,conductive printed circuit board features become closer and closer together. It is now common to see 3 mil lines and spaces on local
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Controlled Surface Etching Process for Fine Line/Space Circuits
The design rule of PWBs and substrates for plastic packages is moving towards higher density as semiconductor
chip design evolves into increasingly finer lines. First,it was studied how fine th
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Cost Effects of Pulse Plating Reversal Current
Direct Current plating in acid copper baths containing organic supplements shows us that during electrolysis,these organic additives are attracted by the copper anode and being adsorbed on its
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Cost-Effective Laminate Materials Made by Continuous Lamination Using Thermosetting Polymer Alloys (TPA) for Microwave and High Speed Applications
Utilizing continuous lamination techniques,new materials are being developed to meet demanding market
requirements. Laminates produced using Thermosetting Polymer Alloys (TPA) are cost effectiv
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Defining Accelerated Test Requirements for PWBs: A Physics-Based Approach
Typically thermal cycle test requirements for printed wiring boards (PWBs) are somewhat arbitrarily established for
a particular product. Many programs simply default to a standard test without
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Design Considerations Affecting the Measured Capacitance of Embedded Singulated Capacitors
The physical placement of embedded singulated capacitors in relation to one another and to other board structures could have an impact on the measured capacitance of individual capacitors. For
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