Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
Developmental Halogen-Free High Performance Dielectric Substrates (with Different Reinforcement Supports) for the PCB/HDI and High-Frequency Applications
This paper presents a comparison of several resin systems on different support reinforcements including on
Thermount®1 (or NWA),E-Glass (or E),and NE-Glass2 (SITM) (or NE). The resin systems co
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Digital Printing Systems for Printed Circuit Board Legends
The development of digital printing systems for printed circuit board legends (a.k.a. nomenclature,indent or letter
screening) is a major technological leap. Legend marking on printed circuit b
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Direct Laser Drillable Ultra Thin Copper Foils for Advanced PCB Manufacture
The demand for small packaging for portable electronic equipment and reduced chip form factor with higher interconnect fan-out,is driving printed circuit substrate technology rapidly forward. T
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Dry Film Resist Stripping from Overplated Lines
The ideal outer layer has a uniform circuit height throughout the board. This is a challenge to produce with pattern
plating,because the plated metal height depends on the current density,which
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The Effect of Etch Taper,Prepreg and Resin Flow of the Value of the Differential Impedance
Many printed circuit board manufacturers report that the measured value of the differential impedance is a few ohms greater than the calculated value when the substrate is FR4. There may be sev
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Electrically Mediated Pulse Reverse Copper Plating of Electronic Interconnects without Brighteners/Levelers
This paper describes a process for plating of interconnects for advanced electronic modules. In contrast to traditional
chemical mediation of plating processes,this process is electrically medi
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Electrochemical Migration Testing Results - Evaluating PWB Design,Manufacturing Process,and Laminate Material Impacts on CAF Resistance
Various requirements have developed for printed wiring boards regarding the minimum spacing between features.
Creepage distances per UL-60950 call out 1.2mm for voltages up to 50v,and call out
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Embedded Ceramic Resistors and Capacitors in PWB-Process and Design
Design and processing of ceramic resistors and capacitors fired onto copper foil and embedded into FR4 circuit
boards are presented and discussed. Evolution of design guidelines and processing
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Embedded Mezzanine Capacitor Technology for Printed Wiring Boards
A novel technology for embedding discrete capacitors in a mezzanine layer of an HDI PWB was developed and
implemented by Motorola in partnership with its PWB supply chain. The technology is bas
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Embedded Optical Fiber
The power attenuation of the optical fiber due to bends is investigated for the feasibility of the integration optical
fiber into PCBs.
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Embedded Passives Technology Implementation in RF Applications
Motorola has developed a suite of technologies for embedding resistors,inductors,and capacitors in HDI printed
wiring boards. This paper describes the technology and presents a case study demon
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Experimental and Numerical Assessment of Plated Via Reliability
This paper discusses two typical PTH failures – barrel cracking and post separation – induced by accelerated testing
or observed during manufacturing. Finite element models have been developed
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An FEA Study of Image Transfer in Printed Wiring Boards
A concern in the manufacture of laminate PWB’s is the transfer of interior circuit patterns to the surface of the
board. This can lead to difficulties in forming the external circuitry. Typical
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Full-Wave Electromagnetic Simulation of PWB Structures
Because high performance products are limited in speed by packaging and interconnections,signal integrity analysis
and PWB simulation become nowadays very pressing and key issues. Taking into a
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HID's Technology Influence on Signal Integrity
Highs Density Interconnects (HDI) printed circuits are now being designed in ever increasing quantities. HDI brings
some interesting new solutions to age-old signal integrity (SI) concerns,and
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Implementation of Embedded Resistor Trimming for PWB Manufacturing
In the Printed Wiring Board (PWB) industry,the growing demand for a higher number of circuit components to be
contained in smaller circuit areas requires that some of the passive components (re
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Improving Yield and Profitability with Laser Drilled Blind Microvias
Laser drilling has clearly captured the technology lead in the formation of HDI microvias with a 78% ownership,1
currently dominating over photo defined,plasma etched and mechanically drilled m
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The Influence of Fluid Dynamics on Plating Electrolyte for the Successful Production of Blind Micro-Vias: Laboratory Investigations Leading to Optimized Production Equipment
Successful copper plating of blind micro-vias is very strongly dependant on the effective mass transport of copper
ions into the vias. This mass transport limitation is demonstrated by a rough
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Laminate Materials with Low Dielectric Properties
Wireless Communications and Broadband technologies are driving the need for advanced laminate materials with
improved dielectric properties. This paper focuses on new laminate materials with po
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Laser Direct Imaging A Solution for Fine Line Imaging
The electronics market demands for smaller,faster,more reliable and less costly products continues to fuel major
changes in printed wiring board designs. Higher layer counts,increasing circuit
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Laser Direct Structuring as an Innovative Alternative for Traditional Lithography
The combination of high speed and accuracy laser beam deflection,the know-how on wet chemical processes for
Printed Circuit Boards (PCB’s),as well as CAD/CAM implementation for Laser direct Str
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Laser Drillable Prepreg Alternative to Coated Copper for HDI Applications
There is a contingent in the industry that feels reinforced substrates are needed to meet the performance
requirements of HDI microvia technology. Concerns that non-reinforced resin coated foil
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Laser Drilling MicroVias
There is a growing need in today’s electronic market for high performance Printed Circuit Boards (PCBs) with highspeed signals and enhanced performance. However,they must maintain signal integr
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Latest Developments in Integrated Polymer Photonic Waveguides in PWB's
Highs Density Interconnects (HDI) printed circuits are now being designed in ever increasing quantities for very high speed applications. The challenge of opto-electronics and integration of ph
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Low Transmission Loss Cyanate Ester Materials with Loose Cross-Linked Structure
A new thermosetting resin system with modified cyanate ester resins having a loose cross-linked structure and
alloyed with polymers was developed to provide low dielectric constant (Dk) and low
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