High Density Packaging User Group and Global Electronics Association Announce New Copper Profile Test Method
High Density Packaging User Group (HDP) and the Global Electronics Association announce the release of a new test method, IPC-TM-650-2.2.23, based on the results of HDP’s Non-Contact Copper Foil Profile project.
Global Electronics Association Releases IPC-1783-CO2E Standard for Product Carbon Footprint Data
The Global Electronics Association today announced the release of IPC-1783-CO2E, International Standard for Data Collection and Reporting of CO2 Equivalent (CO2e) Emissions for the Electronics Manufacturing Supply Chain, a new global standard designed to bring greater consistency, credibility and comparability to product carbon footprint data across the electronics industry.
Radbon Electronics Achieves IPC/WHMA-A-620 QML Validation, Joins IPC Global Qualified Manufacturers List
Radbon Electronics Co., Ltd. has passed the IPC/WHMA-A-620 Qualified Manufacturers List (QML) validation by the Global Electronics Association, earning its place on the IPC Global Qualified Manufacturers List.
Global Electronics Association Brings IPC Builds Standards Development Event to Paris
The global electronics industry will gather in Paris this September to help shape the standards that define how electronics are designed, built, tested and trusted worldwide.
Global Electronics Association Releases IPC-A-630A for Electronic Box Assemblies
The Global Electronics Association has released IPC-A-630A, Requirements and Acceptance for Electronic Box Assemblies, an updated standard providing acceptance criteria for electronic box assemblies
From Prototype to Production: New Guideline Helps Industry Design, Integrate and Scale Reliable E-Textile Systems
The Global Electronics Association announces Fundamentals and Best Practices for E-Textile System Development, a new next-generation guideline that provides a structured framework for the design, testing and deployment of e-textiles systems.