IPC APEX EXPO Call for Participation Deadline Extended
IPC has extended the deadline for IPC APEX EXPO 2021 technical conference abstracts to Monday, August 31. Due to travel restrictions by some companies and geopolitical areas, IPC is also accepting proposals for virtual presentations. IPC APEX EXPO 2021 technical conference will take place January 26–28 and professional development courses will run January 23–28.
IPC Statement on June’s Job Numbers
The following statement is attributed to John Mitchell, IPC president and CEO, regarding June’s unemployment report from the U.S. Department of Labor. Based on the data, IPC estimates the electronics manufacturing industry gained 20,000 jobs.
IPC Announces Paige Fiet as First IPC Board of Directors Student Liaison
For the first time, the IPC Board of Directors will include an IPC student member with a full voting board seat, in response to increased student member involvement in IPC and the potential for student members, as the emerging workforce, to influence workforce development. Paige Fiet, president of the IPC Student Chapter at Michigan Technological University, was elected as the first IPC Board of Directors Student Member Liaison. The IPC Education Foundation (IPCEF) developed the nomination/election process with IPC Student Chapter advisors and every IPC Student Chapter member was eligible to vote.
IPC Partners with in4ma to Support EMS Industry in Europe
IPC has partnered with German-based in4ma to better support standards, education and advocacy needs for the growing EMS industry in Europe. Formed by Dieter G. Weiss in 2015, in4ma has been a leading market research and industry analysis consulting company supporting the 45 billion Euro EMS industry.
North American PCB Industry Sales up 1.0 Percent in May
IPC announced today the May 2020 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.10.
IPC and High Density Package Users Group Sign MoU, Strengthening Collaboration and Value to Membership
IPC and High Density Package Users Group (HDP), a trade organization representing companies involved in the supply chain of manufacturing products that utilize high-density electronic packages and printed circuit boards, have signed a Memorandum of Understanding (MoU), enabling a strengthened partnership, increased technical collaboration between groups, and providing a mutual path toward emerging and disruptive high density interconnect (HDI) technologies.