Europe is one of the world’s three largest markets for AI data centres. However, most of the value created by that demand accrues to companies and supply chains outside of the EU. Today, the Global Electronics Association released From Chips to Systems: Building an End-to-End EU Strategy for Data Centre, Cloud Infrastructure and AI, a joint report with DECISION Études & Conseil that quantifies that gap, layer by layer, and offers a practical policy roadmap to close it.

The Global Electronics Association today announced the relaunch of its Double Materiality Assessment (DMA) Toolkit for the Electronics Industry, an updated resource designed to help organizations navigate double materiality assessment planning amid changing sustainability and corporate reporting expectations.

The Wiring Harness Manufacturer’s Association (WHMA), a council of Global Electronics Association, will host its 2027 Annual Global Leadership Summit, February 3–5, 2027, bringing together executives from wire harness manufacturers, OEMs and suppliers serving the wire harness and cable assembly industry.

Radbon Electronics Co., Ltd. has passed the IPC/WHMA-A-620 Qualified Manufacturers List (QML) validation by the Global Electronics Association, earning its place on the IPC Global Qualified Manufacturers List.

The Global Electronics Association announced today the July 2026 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.46.

The Global Electronics Association announced today the July 2026 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.29.