IPC announced today the October 2022 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.07.

IPC announced today the October 2022 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.29.

The U.S. Government must actively encourage the expansion of the advanced packaging ecosystem, supply-chain partnerships, and industry-backed workforce programs if it wants to succeed in boosting the U.S semiconductor industry under the CHIPS Act.

A sharp increase in salary budgets and use of flexible hours programs for North American electronics assembly companies are among the findings of a new study published by IPC this week, the 2022 Wage Rate and Salary Study for the North American Electronics Assembly Industry.

The bipartisan CHIPS and Science Act of 2022 is launching a new era of leadership for U.S. semiconductor manufacturing and related industries. However, rebuilding the advanced electronics industry in the U.S. will require a long-term, sustained effort, and it is about more than just chips.

New data from IPC show that most electronics manufacturing industry executives see a recession as inevitable.

IPC announced today the September 2022 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.12.

IPC announced today the September 2022 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.29.

The U.S. Partnership for Assured Electronics (USPAE) is entering a new phase of rapid growth to better connect the electronics industry with government needs and opportunities. Effective immediately, membership dues are reduced to $1,000 for all organizations, and the process to join is streamlined.

Leaders of top semiconductor, microelectronic, IC-Substrate, PCB, EMS, and OSAT companies along with the U.S. government and European Commission are gathering in Washington, D.C. this week to discuss "the next big thing" in CHIPS Act implementation: expanding "advanced packaging" capacities and capabilities to go along with expanding production of semiconductor chips.