IPC President and CEO John Mitchell invites you to join us in Washington, D.C. for a two-day meeting focused on the opportunities and challenges for next-generation advanced packaging production, public policy updates, commercial and defense electronics industry drivers, current business environment for IC substrates and component assembly and test manufacturing.

PC APEX EXPO 2023 will feature Emily Calandrelli, host and co-executive producer of the hit Netflix series “Emily’s Wonder Lab,” host and executive producer of FOX channel’s “Exploration Outer Space” and author of the children’s chapter book series, “The Ada Lace Adventures.”

In conjunction with NEPCON Vietnam 2022, IPC hosted its popular IPC Hand Soldering and Rework Competition in Hanoi, Vietnam on September 14-16, 2022. Held for the first time in person since the COVID-19 pandemic, this ninth competition series welcomed 33 competitors from 17 Vietnamese electronics companies.                                 

For the second consecutive year, IPC is hosting an IPC Design Competition, inviting printed circuit board designers to compete to become the IPC Design Champion of 2023. The IPC Design Competition is composed of two heats – a virtual preliminary heat and an in-person layout final for the three top competitors on January 24, 2023 at IPC APEX EXPO in San Diego, Calif.

Registration is now open for IPC APEX EXPO 2023, the largest event for electronics manufacturing in North America. IPC APEX EXPO will be held at the San Diego Convention Center in San Diego, Calif. from January 21-26, 2023.

WHMA/IPC has decided to postpone M-EXPO 2022 due to a variety of health, safety, economic and travel concerns.

Registration is now open for the first IPC Advanced Packaging Symposium: Building the IC-Substrate and Package Assembly Ecosystem, to be held October 11-12, 2022, at the Kimpton Hotel Monaco in Washington, D.C.

A panel featuring members of IPC E-mobility, Quality & Reliability Advisory Council, representing both original equipment manufacturers (OEMs) and their suppliers, will highlight the challenges of building safe, high-quality, and reliable electric vehicles (EVs) and their chargers at the Electric and Hybrid Vehicle Tech Expo and The Battery Show North America on September 14, 2022, in Novi. Mich.

IPC Advanced Packaging Symposium: Building the IC-Substrate and Package Assembly Ecosystem. This compact 2-day event is dedicated to in-depth discussions on strengthening the IC-Substrate and Package Assembly Ecosystem in North America and Europe.

To better support the needs of the growing UK EMS industry, IPC hosted the inaugural UK EMS Executive meeting in London on July 14.