Free and Exclusive Webinars to Global Electronics Association Members
Led by industry experts who share their technical knowledge and insights, these webinars are dedicated to educating Global Electronics Associastion members on relevant topics. Expand your knowledge by registering for an upcoming session.
Upcoming Session Dates: Check back soon for upcoming sessions.
Join us for this informative webinar as we explain the significance of measuring both voiding and coverage of solder joints. We will explore the data behind IPC J-STD-001HA/-A-610HA that supports reliability concerns and highlight the importance of understanding the meaning behind coverage versus voiding. We will also touch upon where in the industry there is adoption and implementation of these measurements. Don't miss this opportunity to gain valuable insights into this critical aspect of electronics manufacturing.
DfR- DESIGN for Rinse-Ability: The Effect of SMT Component Package Design on Cleaning Circuit Card Assemblies (CCA) manufactured using Surface Mount Technology SMT processes have exhibited cleaning residues remaining after subsequent conformal coating required for Mil/Aero product within electronic component/package housings with degradation/corrosion of internal parts that may detrimentally affect the electrical performance of the components. Certain components or package configurations were observed to exhibit more entrainment and/or entrapment of cleaning residues with experiments performed resulting in “Design for Rinse-ability” specifications or guidelines implemented.
Evaluation of SMT Solder Pastes for Flux Residues Mitigation in Cleaning Machines Increased volumes of CCAs being cleaned after SMT have resulted more flux residue building-up on cleaning machine wash/rinse tanks, “gumming-up” sump-pumps, causing sensor failures, as well as, increasing PM cleaning cycles with residue difficult to remove. Residue is attributed to the presence of an insoluble additive in the current solder paste. An alternate solder paste was evaluated that did not have this insoluble flux constituent and was found to be metallurgically equivalent and has since been run in production CCAs with no assembly, electrical performance issues or physical solder-joint defects.
This webinar features IPC Hall of Famer, Mike Carano and will cover a short introduction to HDI and Ultra HDI-Enabling Advanced Packaging Technology including:
• A Basic Overview
• Why HDI and Ultra HDI?
• Design Considerations
• Reliability Concerns
• Processes
• Standards (IPC)
This webinar will cover a short introduction to the kinds of machine data available in an EMS factory as well as how to setup an analytics environment using freely available, open source tools. Key topics include:
- What kinds of data are present in factory equipment?
- How much data is there in an EMS factory and is it feasible to collect and store it all?
- What are examples of analytics you can do with PNP, AOI and tester data?
- What are important considerations in setting up a data collection system for analyzing machine data?
This webinar will preview the IPC APEX EXPO 2023 professional development course, “Preventing Product Failure and Manufacturing Defects.” Join Dr. Jennie S. Hwang to explore how to prevent prevailing production defects and product reliability issues that affect the first-pass yield/cost/performance by understanding potential causes and plausible solutions.
The webinar will cover product failure as related to tin whisker and five production defects including PCB pad cratering vs. pad lifting, BGA head-on-pillow, open or insufficient solder joints, copper dissolution and lead-free through-hole barrel filling.
The root causes/preventive measures for the five prevalent production defects; and specific defects associated with the reliability of BTC/PoP/BGA assembly will be highlighted. Tin whisker criteria for reliability implications and the relative effectiveness of mitigating measures will be ranked.
This webinar will preview the IPC APEX EXPO 2023 professional development course, “Troubleshooting SMT Yield Problems and Failure Analysis." Join Ray Prasad for this webinar and get an exclusive "sneak peek" on:
- Advancing your understanding of root causes of SMT and through hole defects
- Implementing corrective actions in design, assembly and material purchases
- Taking necessary actions to improve yield and reduce product cost.
- You are also encouraged to bring your pesky defects for discussion and root cause analysis.
Gilbert Kaplan, a former Undersecretary of Commerce for International Trade and current Chairman of the Advisory Board of the Manufacturing Policy Initiative at the O'Neill School of Public and Environmental Affairs at Indiana University, provides an outlook on U.S. manufacturing competitiveness and what we should expect from the Biden Administration, from "Made in America" to advanced technologies, taxes, trade, and regulation.
Using XRF to Meet IPC Specifications: A Guide for Manufacturers
July 8, 2020 - IPC specifications for printed board surface finishes set the standard for quality and reliability in printed board manufacturing today. Adhering to these specifications increases yield and performance but involves tight process control and accurate measurement of surface finish thickness. Central to meeting the IPC specifications is the accuracy of XRF measurements to determine plating thickness.
In this webinar, you will learn about:
- Improving efficiency in XRF Testing
- Using XRF to conform to IPC-4552A, IPC-4553A, IPC-4554 and IPC-4556
Speaker: Matt Kreiner, Hitachi High-Tech Analytical Science
Building Synergies in Power Electronics
April 8, 2020 - At the Power Sources Manufacturers Association (PSMA, www.psma.com), we focus on the relentless pursuit of cultivating, enhancing, and expanding the reach of the power electronics ecosystem into all aspects of the electronics industry. Since everything in the world of electronics requires power, we are constantly finding new stakeholders, groups, and organizations we must collaborate with and bring into our ecosystem. The best power supply designs in the world are useless without a proper manufacturing base to not only produce these complex designs in a volume of one or two (by some miracle), but in the millions to drive the most critical applications on the planet (or even off of it). This is why it is very important to ensure good resource exchange and collaboration between organizations like PSMA and IPC.
This talk will review the core aspects of the PSMA and IPC organizations to provide an overview of how each works in alignment with their respective missions and with the professionals of the electronics industry to fulfill the goals of promoting ecosystems for their membership and enhancing their positions in the industry. The areas of overlap will be reviewed and examined for gaps to identify opportunities for maximal synergy between the organizations (and perhaps even others). We shall be sure to review how key methodologies such as standards, reports, roadmaps, conferences, webinars, etc. can be leveraged between organizations for meeting the overall goals of educating the industry and empowering members and non-members alike to enhance their abilities to find new ways to continue producing miraculous technology every day.
Speaker: Brian Zahnstecher, Founder & Principal of PowerRox, LLC
A Closer Look at IPC Design – Meet the Design Community Leadership
March 11, 2020 - At IPC APEX EXPO 2020, IPC debuted the newest offering for design engineers around the world – IPC Design.
IPC Design exists to advance the art of printed board design by creating opportunities for technical networking, continuous learning, and engagement with academia. Affiliation with IPC Design can occur at any level – either as an individual, as a member of an IPC Design Chapter, or as part of a company or academic group.
Now, join the IPC Design Community Leadership as they discuss its structure, its features, and its future.
Speaker: Patrick Crawford, IPC
Role of Surface Finish for Next Generation PCB Technologies - 5G, HDI, RF-Microwave, High Frequencies
February 12, 2020 - Abstract: The advent and ongoing evolution of internet-enabled mobile devices has continued to drive innovations in the manufacturing and design of technology capable of high-frequency/high-density electronic signal transfer. The combined requirements for both fast, always-on data transmission, and small geometric form-factors can be difficult to satisfy without compromised performance and signal loss.
Among the primary factors affecting the integrity of high frequency signals is the surface finish applied on PCB copper pads – a need commonly met by technology manufacturers through the electroless nickel immersion gold process, ENIG. However, a well-documented limitation of ENIG is its insertion loss due to the inferior conductivity of nickel over copper, leading to higher conductor losses. Additionally, nickel’s ferromagnetic properties adversely affect circuit performance. The result is an overall reduced performance in high-frequency data transfer rate for ENIG-applied electronics, compared to bare copper.
The selection criteria of surface finish for 5G, high frequency, high density application involves minimal insertion loss, long shelf life, cost-effective and high reliability. There are few options (EPIG, EPAG, DIG, etc.) available in the market and their pros and cons will be discussed. Moreover, an innovative nickel-less approach involving a proprietary nano-engineered barrier designed to coat copper contacts, finished with an outermost gold layer has shown superior benefits over contemporaries.
Download the presentation.
Speaker: Kunal Shah, PhD. President, LILOTREE
Technology Bulletin: Why Semi-Additive Processes Are Coming and What You Need to Know
January 8, 2020 - Next generation electronics are challenging PCB fabricators to provide ultra-high-density circuitry which surpasses the capabilities of traditional manufacturing techniques. Semi-additive technology addresses this challenge, enabling the fabrication of 25-micron line and space and below and can be integrated with traditional PCB fabrication processes. This ultra-high-density packaging and interconnect solution can reduce size and weight by 90% over current state of the art processes within the US, is shown to have significant RF advantages over traditional subtractive-etch processing and is opening design possibilities that were previously unavailable.
Can you imagine the benefits of routing with a 25-micron trace and space? Just to name a few; complex pin outs would require fewer layers and a decrease in costly lamination cycles, the overall size of the PCB could be dramatically reduced, or conversely, additional electronics could be fit into an existing footprint.
This session will discuss the growing need for this technology and explore use cases demonstrating how circuitry created with semi-additive processing can be used as both a stand-alone solution and how it can also be integrated into a PCB stack up with layers fabricated with traditional subtractive etch processes.
Finally, we will review from a fabrication perspective, giving an overview of the materials driving this technology and how the semi-additive process is being integrated with traditional PCB fabrication techniques to meet this growing market demand for increasing complex electronics.
Speaker: Tara Dunn, President, Omni PCB and Mike Vinson
