Years in the works, IPC earned the U.S. Department of Labor’s approval for our National Program Standards of Apprenticeship on Wednesday, November 15.

This webinar is designed to provide non-professional cybersecurity specialists with the facts and awareness they need. No extensive knowledge of cybersecurity is required. Topics include:
•    The possibility you may be the target of a cyber attack.
•    Why attack countermeasures and manufacturing members of the production floor seem so far away.
•    The efforts and limitations of IT engineers.
•    The essence of Zero Trust Architecture.
•    The role of manufacturing members on the shop floor.
•    Balancing the cost of countermeasures versus profits within the manufacturing industry.
•    Discussion of IPC-1792

Additively Manufactured Electronics (AME) adds another dimension to 3D printing – the ability to generate working circuit boards and high-performance electronic devices. Bring yourself up to speed with an overview of this emerging field:

What AME is and how does it differ from PE.
Present the inkjet manufacturing process.
Discuss materials.
Touch on embedded components.
Applications including formed components and design techniques.
Present D-67 committee task groups and standards activity 

This webinar is for anyone giving or even contemplating giving a verbal presentation with associated slides. Specific topics will include: personal aspects, the venue, preparing the presentation, giving the presentation and dealing with questions.

With the introduction of eight new training courses in 2023, IPC reaffirms its commitment to ensuring that professionals in electronics manufacturing remain at the forefront of the industry.

Details of the IPC PCB Fabricator Apprentice Curriculum

Electronics Assembler apprenticeship program

Information for IPC apprenticeships for apprentices

Information about IPC apprenticeships for employers

Bottom termination components (BTCs) are becoming increasingly common in assemblies due to their low cost and high performance. There are varying types of BTCs in the electronics industry, such as QFN, SOIC, and LGA, all of which are typical on assemblies. The defining characteristic of these components is that the terminations are flat on the bottom, therefore relying on solder paste to make the component to board connection. This means that the height of the solder is primarily determined by the volume of solder paste and the finished assembly might not have visible solder joints to inspect. As you can imagine, this makes BTCs very challenging to inspect, often leading to X-ray analysis for process control.

Are you using BTCs on your assembly? 
Looking to understand the inspection process of BTCs?
Having trouble inspecting your BTC? 

In this webinar we will take a deep dive into the inspection of Bottom Termination Components utilizing visual, X-ray and cross section analysis.