Implementation of a new process, machine, or material triggers a qualification event for that change under the new H revision of IPC J-STD-001.

When a change in specific materials is being considered, one must determine and provide objective evidence that the improvement does not increase the quality or functionality risk of the product. In order to quantify the risk, the CM and/or OEM are required to acquire quantitative data before implementing the process change. The methodology developed in this webinar is designed to assist the user in incorporating specific tools and analytical measurements to ensure the product’s reliability via objective evidence and controls. This webinar illustrates the challenges of a real-life implementation of a new material change and the subsequent qualification.

Electronics manufacturers aim to minimize the amount of flux residues. Solder flux residues constitute a significant source of ionic contamination on the manufactured PCBAs, and the activator type in the flux determines their corrosiveness. The risk occurs on low standoff components, such as the QFN, due to blocked flux outgassing channels. The second risk is the number of soldering process steps used to build the assembly. Selective soldering, wave soldering, manual, and rework soldering can spread flux residues across the assembly. Pockets of active residue can be present when the flux is not fully heat-activated. For high reliability, the best practice is to clean the assembly.

This webinar will teach best practices for qualifying and validating acceptable electrical hardware performance. The methods taught during this presentation can be used to meet the requirements of IPC J-STD-001H ~ Section 8: Cleanliness.

How can companies use marketing principles and tools to attract quality job candidates and improve employee retention? Stephanie Austin, director of marketing, Zentech Manufacturing, explains in “Manufacturing a Creative Workforce Development Strategy.” Austin, a member of IPC's EMS Steering Committee, will participate in the upcoming EMS Leadership Summit on April 8, 2024, at IPC APEX EXPO.

Years in the works, IPC earned the U.S. Department of Labor’s approval for our National Program Standards of Apprenticeship on Wednesday, November 15.

This webinar is designed to provide non-professional cybersecurity specialists with the facts and awareness they need. No extensive knowledge of cybersecurity is required. Topics include:
•    The possibility you may be the target of a cyber attack.
•    Why attack countermeasures and manufacturing members of the production floor seem so far away.
•    The efforts and limitations of IT engineers.
•    The essence of Zero Trust Architecture.
•    The role of manufacturing members on the shop floor.
•    Balancing the cost of countermeasures versus profits within the manufacturing industry.
•    Discussion of IPC-1792

Additively Manufactured Electronics (AME) adds another dimension to 3D printing – the ability to generate working circuit boards and high-performance electronic devices. Bring yourself up to speed with an overview of this emerging field:

What AME is and how does it differ from PE.
Present the inkjet manufacturing process.
Discuss materials.
Touch on embedded components.
Applications including formed components and design techniques.
Present D-67 committee task groups and standards activity 

This webinar is for anyone giving or even contemplating giving a verbal presentation with associated slides. Specific topics will include: personal aspects, the venue, preparing the presentation, giving the presentation and dealing with questions.

With the introduction of eight new training courses in 2023, IPC reaffirms its commitment to ensuring that professionals in electronics manufacturing remain at the forefront of the industry.

Details of the IPC PCB Fabricator Apprentice Curriculum

Electronics Assembler apprenticeship program