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Bottom termination components (BTCs) are becoming increasingly common in assemblies due to their low cost and high performance. There are varying types of BTCs in the electronics industry, such as QFN, SOIC, and LGA, all of which are typical on assemblies. The defining characteristic of these components is that the terminations are flat on the bottom, therefore relying on solder paste to make the component to board connection. This means that the height of the solder is primarily determined by the volume of solder paste and the finished assembly might not have visible solder joints to inspect. As you can imagine, this makes BTCs very challenging to inspect, often leading to X-ray analysis for process control.
Are you using BTCs on your assembly?
Looking to understand the inspection process of BTCs?
Having trouble inspecting your BTC?
In this webinar we will take a deep dive into the inspection of Bottom Termination Components utilizing visual, X-ray and cross section analysis.
Meijing Liu, CID+, is a senior PCB designer for Microart Services, an EMS company in Markham, Ontario, Canada. She recently took a six-week milaero PCB design class from IPC’s Kris Moyer, and she was surprised at how much content she was able to absorb in such a short time. I spoke with Meijing and we discussed some of her takeaways from the class, and how it has inspired her to pursue more design education in the future.
Using the IPC APEX EXPO Technical Conference as a model, this webinar will provide an overview of best practices for preparing technical data to write a high-quality manuscript suitable for conference presentation and publication. This tutorial is designed for anyone who wants to build their technical writing skills and share their innovations and research with a technical audience, and will have a special focus on the electronics industry. The session will highlight important advanced preparations prior to submitting an abstract or paper that should be considered by the author and their management. Using the style guideline created for ECWC16/IPC APEX EXPO 2024, attendees will receive an overview of the mechanics, format, and outlines used for an effective technical paper and presentation. Also covered will be how to avoid commercialism and common pitfalls that lead to inefficiencies and reduced quality. Time will be made available at the end of the presentation for questions and answers. IPC encourages anyone interested in writing technical papers to attend this free webinar.
IPC announces the launch of three new online courses designed to equip professionals with valuable knowledge and skills in the rapidly evolving electronics sector. Available on IPC’s online education platform, IPC EDGE, these new courses will provide industry experts and enthusiasts with opportunities for growth and development.
IPC Day Romania: Build Electronics Better with Standards and Solutions, Powered by Flex, is a conference providing unique opportunities to learn about the latest advancements in electronics manufacturing, participate in industry discussions, and network with a community of professionals dedicated to building electronics better.
India: Exploring Business & Investment Opportunities through IPC flagship event – 2nd edition of Integrated Electronics Manufacturing & Interconnection Event (IEMI) scheduled at Chennai on August 1 & Pune on August 3, 2023
IPC Standards applicable to the automotive electronics industry/Increase visibility into issues of risk and reliability in the automotive supply chain/Help deliver e-Mobility quality, reliability, and safety
The electronics manufacturing industry offers a wide range of career opportunities for all levels of education and experience. To make career searches easier, the IPC Education Foundation (IPCEF) launched a new, industry-focused career website www.careersinelectronics.com.
As a member benefit, IPC now provides two online, self-paced training courses, “Electrostatic Discharge (ESD) Control for Electronics Manufacturing” and “Safety for Electronics Manufacturing” free of charge in English, Spanish, French and German.