Winners of Hand Soldering Competition Vietnam 2026 Announced

The Global Electronics Association hosted the Hand Soldering Competition Vietnam 2026 in conjunction with VIMF 2026 and NEPCON ASIA Vietnam 2026, with the Southern Regional Round held June 17–18 in Ho Chi Minh City and the Northern Regional Round held August 5–7 in Hanoi, Vietnam.

Characterization of IC Chip Package IBIS Model and Signal Integrity

This one-hour webinar presents an insight into the PCB Signal Integrity simulation and IBIS model characterization process. A review of what exactly signal integrity simulation does on the PCB and at the system level. A discussion on how the IBIS model is a default for analyzing IC Chips’ input/output waveform integrity. The IBIS model is broken down for easier understanding of its operation and integration into the SI simulation. In addition, a quick note on how to achieve accurate results for Signal Integrity simulation.