By Chris Mitchell, vice president, global government relations
On Friday, December 13, the United States and China announced they had struck a “phase one” deal that effectively pauses the trade war that has flared between the countries over the last two years.
The Trump administration says the deal “requires structural reforms and other changes to China’s economic and trade regime in the areas of intellectual property, technology transfer, agriculture, financial services, and currency and foreign exchange.” It also obligates China to make substantial purchases of U.S.
By Chris Mitchell, vice president, global government relations
In a win for U.S. taxpayers, defense readiness, and the electronics industry supply chain, the U.S. House and Senate are poised this week to approve a defense spending bill that includes $5 million for research and development on the issues surrounding lead-free electronics in mission-critical applications. President Trump is expected to sign the measure within hours after its passage.
IPC and nearly 30 of its members and allies lobbied for these funds, which are “seed money” for a longer-term R&D effort.
U.S. Congress to Approve Defense Spending Bill -- blog
By John Mitchell, IPC president and CEO
The U.S. economy has remained surprisingly resilient, and the result has been that the country’s unemployment has continued to inch lower. It’s now at 3.5 percent, the lowest rate since 1969, and that rate could go even lower as the U.S. boasts more than 7 million job openings. Those job openings suggest an opportunity for workers but a tight labor market for employers.
By Kunil Shah, Ph.D., chief scientist, LiloTree
The advent and ongoing evolution of internet-enabled mobile devices has continued to drive innovation in the manufacturing and design of technology capable of high-frequency/high-density electronic signal transfer.
On May 16, 2025, IPC hosted a high-level Industry Leaders Luncheon in Taipei, bringing together nearly 60 prominent representatives from government agencies, industry associations, and leading enterprises to explore trends and strategic opportunities shaping the future of electronics manufacturing.
The Interdisciplinary Center for Advanced Manufacturing Systems (ICAMS) at Auburn University is conducting its annual study on behalf of the Department of Defense to understand the issues and hurdles manufacturers face when adopting smart manufacturing technologies.
IPC successfully convened its 2025 Q2 Executive Policy Roundtable on May 21 at Tokyo Kaikan. The event brought together senior government officials, corporate executives, and industry experts to explore strategies for building resilient and future-proof supply chains in an increasingly complex geopolitical and economic landscape.
IPC, with the support of Research Fab Microelectronics Germany (FMD), is organizing the Workshop on Component-to-System Level Packaging – Addressing Integration Challenges for Automotive and Industrial Applications.
One essential skill—especially for those working on printed circuit board (PCB) assembly lines—is the ability to identify a wide range of electronic components accurately and efficiently.