Failure analysis case studies on solder de-wetting for electronics products will be covered during IPC APEX EXPO technical conference session 03 on Wednesday, March 10.
The U.S. Environmental Protection Agency (EPA) has finalized five rules for persistent, bioaccumulative, and toxic (PBT) chemicals to reduce risks and exposures to the extent practicable. The final risk management rules became effective on February 5.
IPC Calls for Electronics Manufacturing as a Key Focus in Recently Introduced “Endless Frontier Act”
This week the bipartisan, bicameral “Endless Frontier Act” was reintroduced by Senate Majority Leader Chuck Schumer (D-NY), Senator Todd Young (R-IN) and Representatives Ro Khanna (D-CA) and Mike Gallagher (R-WI) to bolster U.S. leadership and competitiveness globally.
The European Commission (EC) on April 21 took a leap forward in strengthening sustainability reporting for companies through the adoption of a proposal for a Corporate Sustainability Reporting Directive (CSRD).
IPC recently updated its South Korea white paper covering the history of chemical regulations, currently regulatory system and trends in South Korea.
On April 26, the U.S. Occupational Safety and Health Administration (OSHA) sent its Emergency Temporary Standard (ETS) for COVID-19 to the White House Office of Management and Budget for final review.
In the first installment of the “Five Questions With…” series, Sydney Xiao discusses the rise of AI infrastructure, supply chain transformation, workforce challenges, and the investments electronics companies need to remain competitive in the years ahead.
IPC-7621 offers cost-effect alternative to potting
IPC announces a new standard, IPC-7621, Guideline for Design, Material Selection and General Application of Encapsulation of Electronic Circuit Assembly by Low Pressure Molding with Thermoplastics, a guidance document that offers instruction on using Low Pressure Molding (LPM) in place of potting for circuitry encapsulation.
Unlike potting, where the potting vessel becomes the outer “shell” of the encapsulated part, LPM utilizes mold tooling which is removable and re-usea
https://youtu.be/AMcZMMdMxEk
IPC president and CEO John Mitchell discusses the skills gap in the manufacturing industry and IPC’s efforts to address the issue.
It is with deep sadness that IPC announces the death of one of its valued committee members and leaders, Brian Butler, president and CEO of Introbotix, Corp. Brian passed away on March 11, 2018.
Brian joined the IPC D-21c High Speed/High Frequency Controlled Impedance Task Group in early 2000.