Measuring the effectiveness of training requires a systematic approach to data collection and analysis. Here’s a step-by-step guide to calculating the ROI of your training programs.
Investing in employee training is essential for driving operational efficiency, improving productivity, and ensuring long-term business success. However, when measuring the ROI of training, it’s essential to account for both tangible and intangible benefits.
Measuring training programs' return on investment (ROI) is essential for justifying workforce development efforts, but it comes with challenges. From quantifying intangible benefits to ensuring consistent data collection and managing variability, organizations must adopt strategic approaches to assess training effectiveness accurately.
Learn about the IPC E-Textiles standards committee seeking new comments on a draft of new e-textiles standard.
By John Perry, Director of Printed Board Standards & Technology
It has been well known that for many years IPC has provided a trio of performance classifications in its suite of standards and specifications for the design, fabrication, assembly and acceptance of printed boards and printed board assemblies.
John Mitchell, IPC president and CEO, extends a special invitation to IPC APEX EXPO 2018.
https://www.youtube.com/watch?v=r-xcKwdz9iU&feature=youtu.be
IPC’s advocacy efforts in Europe have grown significantly over the past few years.
IPC President and CEO John Mitchell and IPC Vice President of Global Government Relations Chris Mitchell talk to PCB Chat host and Circuits Assembly and Printed Circuit Design & Fab Editor-in-Chief Mike Buetow about key government programs and initiatives and why it’s important for members to participate in lobbying efforts.
Listen to podcast:
https://upmg.podbean.com/e/pcb-chat-episode-12-john-mitchell-and-chris-mitchell/
IPC-7621 offers cost-effect alternative to potting
IPC announces a new standard, IPC-7621, Guideline for Design, Material Selection and General Application of Encapsulation of Electronic Circuit Assembly by Low Pressure Molding with Thermoplastics, a guidance document that offers instruction on using Low Pressure Molding (LPM) in place of potting for circuitry encapsulation.
Unlike potting, where the potting vessel becomes the outer “shell” of the encapsulated part, LPM utilizes mold tooling which is removable and re-usea
https://youtu.be/AMcZMMdMxEk
IPC president and CEO John Mitchell discusses the skills gap in the manufacturing industry and IPC’s efforts to address the issue.