The Corporate Sustainability Due Diligence Directive (CSDDD) is a European Union directive that introduces legal obligations on businesses to respect human rights and the environment.
Ball Grid Array (BGA) defects pose significant challenges in circuit board assembly. The IPC guidelines provide a foundational framework for inspection, yet they may not encompass all scenarios effectively. Leveraging the latest advancements in 3D Computed Tomography (CT) technology allows for a detailed examination of each solder ball, facilitating a precise identification of common defects such as voiding, non-wetting, and head-in-pillow phenomena. Through this approach, engineers can conduct a thorough root cause analysis, enhancing the reliability of electronic assemblies.
Join fellow EMS leaders in the region to discuss key performance indicators and share industry pain points and solutions.
Join fellow EMS leaders in the region to discuss key performance indicators and share industry pain points and solutions.
Join fellow EMS leaders in the region to share industry pain points and solutions.
Join fellow EMS leaders in the Nation’s Capital to discuss the most important public policy issues affecting the industry, pain points and solutions.
IPC Masters will include Hand Soldering Competition (HSC), Cable and Wire Harness Assembly Competition (CWAC), BGA/BTC (Ball Grid Array/Bottom Termination Components) Rework Competition and IPC Standard Knowledge Competition.
BACK BY POPULAR DEMAND -- John Watson explores how artificial intelligence (AI) is revolutionizing printed circuit board (PCB) design in this must-attend webinar, "The AI Advantage in PCB Design: Tools and Trends." This session will provide a deep dive into the transformative impact of AI on the PCB design process, helping engineers and designers tackle challenges with greater efficiency and innovation.
The webinar begins with an introduction to AI's fundamental role in modern PCB design. Participants will learn how AI enhances traditional workflows, offering capabilities beyond human limitations. From circuit optimization to error reduction, AI enables faster, smarter, and more precise design outcomes.
Through real-world examples, the session will highlight how AI is being used to solve common PCB design challenges, such as managing complex routing patterns, improving thermal performance, and reducing the time spent on iterative design revisions. These case studies will show how companies have integrated AI to address bottlenecks, reduce costs, and accelerate product development timelines.
Additionally, this webinar will explore the potential hurdles of adopting AI technologies in PCB design. Topics will include data preparation, the need for effective collaboration between engineers and AI systems, and the importance of validating AI-driven recommendations. Attendees will also get a glimpse into the future of AI in PCB design, including its role in fully autonomous design systems and its integration with next-generation technologies like augmented reality (AR) and virtual reality (VR).
What Participants Will Learn
1. How AI is transforming the design process in general.
2. The benefits of using AI are in improving efficiency and accuracy.
3. Key features and capabilities of AI-powered tools.
4. Real-world examples of AI solving design challenges.
5. Common challenges when adopting AI technologies.
6. Exciting future possibilities for AI in design and engineering.
IPC Design Day France 2025, IPC Designers Council France, proposed event taking place on April 3-4, 2025 at Hotel Pullman Aeroport Toulouse, France
The IPC WorksAsia is a technical seminar that IPC focuses on professional fields. It aims to strengthen member interaction and cooperation, promote resource sharing, and help electronics manufacturing enterprises stand out in the competition.