Join fellow EMS leaders in the region to share industry pain points and solutions.
IPC and iNEMI convened electronics industry experts in person on June 17 to discuss circularity challenges at the workshop, "There’s no end to a circle. A workshop on how to address circularity challenges in electronics manufacturing" at the Electronics Goes Green conference in Berlin. The fundamental goal of the workshop was to scope industry solutions to address pressing circularity challenges. Please join us on July 17 at 10:00 AM EDT to learn more about the results of the workshop and next steps that will lead to work by iNEMI and IPC.
Discover the newest innovations and hear from the best minds in the electronics manufacturing industry. IPC APEX EXPO 2025 will be our industry’s largest event in North America featuring a world-class trade show, professional development courses taught by industry experts, non-stop networking and more! Join us in Anaheim, California, March 15-20, 2025.
Join Anthony J. Bryant as he previews his August IPC Counterfeit Electronic Parts Mitigation course. The webinar reviews the key aspects of counterfeit documentation challenges focusing on the recent issues with aircraft engines and the broader High-Reliability supply chain concerns. Participants will gain a comprehensive understanding of the problem, as well as practical strategies and best practices for mitigating the risks. In this webinar, we’ll cover:
- Understand the scope and impact of counterfeit documentation in the aerospace industry
- Identify common tactics used by counterfeiters to create fake documentation
- Learn strategies and best practices for mitigating the risk of counterfeit documentation
- Discuss industry-wide initiatives and regulations aimed at addressing this challenge
This webinar will provide an overview of the new one-time EPA reporting rule on PFAS under the Toxic Substances Control Act. The new rule will have a significant impact on electronics producers and importers, because of (a) the widespread use of PFAS within the electronics supply chain; (b) the very expansive definition of PFAS in the rule, which includes commonly used polymers; and (c) EPA’s decision to include imported articles within the scope of the rule.
IPC has developed an annual international networking forum in India RegionIntegrated Electronics Manufacturing & Interconnections (IEMI). The two-day, two-city event will bring together designers, manufacturers, traders, suppliers, service providers, and technical experts to explore new business partnerships, gain technical knowledge, and source products & services
IPC has developed an annual international networking forum in India Region Integrated Electronics Manufacturing & Interconnections (IEMI). Event will bring together designers, manufacturers, traders, suppliers, service providers, and technical experts to explore new business partnerships, gain technical knowledge, and source products & services
Electronics manufacturers aim to minimize the amount of flux residues. Solder flux residues constitute a significant source of ionic contamination on the manufactured PCBAs, and the activator type in the flux determines their corrosiveness. The risk occurs on low standoff components, such as the QFN, due to blocked flux outgassing channels. The second risk is the number of soldering process steps used to build the assembly. Selective soldering, wave soldering, manual, and rework soldering can spread flux residues across the assembly. Pockets of active residue can be present when the flux is not fully heat-activated. For high reliability, the best practice is to clean the assembly.
This webinar will teach best practices for qualifying and validating acceptable electrical hardware performance. The methods taught during this presentation can be used to meet the requirements of IPC J-STD-001H ~ Section 8: Cleanliness.
Skilled soldering experts will be competing for 60 minutes on a complex circuit board assembly to win the 2024 National title, and earn a cash prize and a chance to compete at the IPC Hand Soldering World Championship.
Implementation of a new process, machine, or material triggers a qualification event for that change under the new H revision of IPC J-STD-001.
When a change in specific materials is being considered, one must determine and provide objective evidence that the improvement does not increase the quality or functionality risk of the product. In order to quantify the risk, the CM and/or OEM are required to acquire quantitative data before implementing the process change. The methodology developed in this webinar is designed to assist the user in incorporating specific tools and analytical measurements to ensure the product’s reliability via objective evidence and controls. This webinar illustrates the challenges of a real-life implementation of a new material change and the subsequent qualification.