The next edition of EFECS – the European Forum for Electronic Components and Systems is taking place in Malta, on December 3–4, 2025, at the Hilton Hotel in St. Julian’s
The 2nd Pan-European Electronics Design Conference (PEDC) is a one of a kind Pan-European conference with technical and scientific peer-reviewed presentations.
Join fellow EMS leaders in the region to share industry pain points and solutions.
The world economy is entering a new chapter marked by uneven growth, persistent inflationary pressures, and shifting trade dynamics. The United States shows resilience, Europe continues to face stagnation risks, and Asia’s mix of advanced and emerging markets is driving both opportunity and volatility.
Why Attend the Electrical Wire Processing Technology Expo (EWPTE)?
Produced by WHMA/Global Electronics Association, the ONLY trade association exclusively representing the cable and wire harness manufacturing industry including manufacturers, their suppliers and customers, EWPTE is where the industry comes together with more than 3,000 attendees and nearly 200 exhibitors to find solutions to challenging wire problems through training and education and for the opportunity to network with industry leaders and subject matter experts.
The wire harness industry is constantly evolving with new technology and practices. The 2026 WHMA Annual Global Leadership Summit offers the tools you need to help your business succeed in this fast-changing landscape. WHMA's Annual Global Leadership Summit (formerly the WHMA Annual Conference) is a networking event for executives representing wire harness manufacturers, OEMs and suppliers for companies that build wiring harnesses and cable assemblies.
Peer-to-peer networking provides countless opportunities for you to improve your business as you learn, share, and discover new approaches to the wire harness industry.
Learn from industry leaders at best-practices roundtables, technical education workshops, and keynote speakers.
Get the first look at cutting-edge technology in the Exhibit Hall featuring industry leading suppliers.
Join the Hand Soldering Regional Estonia 2025 Competition, for Students and Professionals, being held 21-23 October 2025, at TalTech University (Main Lobby), Tallinn, Estonia.
Competitors will demonstrate their soldering skills on a complex printed circuit board assembly within 60 minutes — for prizes, recognition, and the chance to secure a spot at the IPC Hand Soldering World Championship later in 2025.
Supply Chain Integrity: Protecting Your Business from Counterfeit Electronics - A Non-Technical Guide to Component Authentication
Join SAE G19A subcommittee expert Anthony Bryant for an essential one-hour webinar focused on supply chain integrity and counterfeit electronics prevention. This session is specifically designed for non-technical personnel working in the electronics component supply chain including procurement professionals, supply chain managers, quality assurance staff, and business leaders.
With counterfeit electronics reporting increasing by 25% in 2024 to over 1,055 suspect parts, the threat to supply chain integrity has never been more critical. This webinar will equip attendees with practical knowledge to identify red flags, understand current trends, and implement effective counterfeit mitigation strategies that protect both business operations and end-user safety.
Key Learning Outcomes:
• Understand current counterfeit electronics trends and their business impact
• Learn visual inspection techniques requiring no technical background
• Identify documentation red flags and fraudulent paperwork
• Recognize supplier risk indicators and sourcing vulnerabilities
• Implement practical counterfeit avoidance strategies
• Understand regulatory compliance requirements and industry standards
Target Audience: Procurement professionals, supply chain managers, quality assurance personnel, business leaders, and anyone involved in electronics component sourcing and management.
Wire bonding remains the dominant chip-interconnection method—and it's not going anywhere soon. This webinar offers a practical overview of modern wire bonding processes, metrology challenges, and emerging materials. Learn about pitch shrinkage demands, direct bonding to Cu on ULK substrates, and innovations like silver and gold-coated palladium copper wires. Explore key bonding techniques including thermosonic, ultrasonic, and thermocompression, plus new options for Cu wire coatings.
Perfect for engineers navigating next-gen packaging and reliability.
Join fellow EMS leaders in the region to share industry pain points and solutions.