This one-hour webinar will teach you how to design printed circuit boards (PCBs) that are easy to manufacture, test, and assemble. You’ll learn about three important design principles: Design for Manufacturing (DFM), Design for Test (DFT), and Design for Assembly (DFA). These principles help you create PCBs that save time, lower costs, and ensure the final product works as expected.
We’ll explain what DFM, DFT, and DFA mean and why they matter for your design. You’ll see how DFM makes simple PCBs by choosing the right materials, layer stack-ups, and trace sizes. Then, we’ll explore DFT, ensuring your board can be easily tested to catch any issues before production. Finally, we’ll cover DFA, which helps make assembly smoother by correctly placing components and avoiding errors.
Throughout the webinar, we’ll share real-world examples of what happens when these principles are followed—and when they’re not. You’ll also learn about necessary IPC standards, like IPC-2221 and IPC-A-610, that guide good PCB design practices. By the end of the session, you’ll know how to create reliable, cost-effective, and easy PCBs.
This webinar is perfect for anyone working on PCB designs, from beginners to experienced designers. Whether creating your first board or looking to improve your process, this session will give you the tools and tips to succeed. Join us to learn how to design PCBs that work perfectly from the start!
Join fellow EMS leaders in the region to share industry pain points and solutions. Our focus for this meeting is how companies profitably reach the next level of revenue. Following a presentation on the current EMS market and revenue tiers in the industry, participants will discuss how to reach the next level and grow their business. The discussion will pull from direct experience, questions, and ideas. From there, the conversation goes where you, the leaders, take it. Every roundtable ends with unique takeaways.
Join us for an inspiring webinar, “A View from the Top: Succeeding as Women Engineers in Microelectronics,” where we celebrate the achievements of two remarkable women in the electronics industry, Cheah Soo Lan, Master IPC Trainer for CID/CID+ and Despina Davis, Ph.D. This event features insightful interviews with trailblazing professionals who have excelled beyond engineering roles. Additionally, our speakers will introduce new IPC online instructor-led courses, including A Technical Overview of the Semiconductor Chip Industry—perfect for those new to semiconductor topics, offering a gateway to new career opportunities and enhanced expertise. Also, discover the intricacies of Microvia Electroplating, where you’ll learn essential techniques and best practices for reliable microvia fabrication in high-density interconnects. Don’t miss this opportunity to gain valuable insights and advance your career!
We are delighted to welcome Dr. Habib Mustain of Hereaus to discuss power electronic substrate types, requirements, and challenges for today's EV applications.
We are delighted to welcome Brian O'Leary of Indium to discuss the impact of the Software Defined Vehicle on hardware design and manufacture.
We are delighted to welcome expert panelists to discuss what automakers, startups, and T1s are demanding from their supply chains in terms of sustainability. Panelists will weigh in the top 3 challenge areas beyond current regulatory reporting and what may be coming next.
IPC Day EMS Europe - Gdansk, Poland - Wednesday, 25 September 2024
The Corporate Sustainability Due Diligence Directive (CSDDD) is a European Union directive that introduces legal obligations on businesses to respect human rights and the environment.
Ball Grid Array (BGA) defects pose significant challenges in circuit board assembly. The IPC guidelines provide a foundational framework for inspection, yet they may not encompass all scenarios effectively. Leveraging the latest advancements in 3D Computed Tomography (CT) technology allows for a detailed examination of each solder ball, facilitating a precise identification of common defects such as voiding, non-wetting, and head-in-pillow phenomena. Through this approach, engineers can conduct a thorough root cause analysis, enhancing the reliability of electronic assemblies.
Join fellow EMS leaders in the region to discuss key performance indicators and share industry pain points and solutions.