Join fellow EMS leaders in the Nation’s Capital to discuss the most important public policy issues affecting the industry, pain points and solutions.
The IPC CEMAC (China Electronics Manufacturing Annual Conference), an exclusive event for IPC members, is dedicated to advancing the development and collaboration of the electronics industry.
IPC Masters will include Hand Soldering Competition (HSC), Cable and Wire Harness Assembly Competition (CWAC), BGA/BTC (Ball Grid Array/Bottom Termination Components) Rework Competition and IPC Standard Knowledge Competition.
BACK BY POPULAR DEMAND -- John Watson explores how artificial intelligence (AI) is revolutionizing printed circuit board (PCB) design in this must-attend webinar, "The AI Advantage in PCB Design: Tools and Trends." This session will provide a deep dive into the transformative impact of AI on the PCB design process, helping engineers and designers tackle challenges with greater efficiency and innovation.
The webinar begins with an introduction to AI's fundamental role in modern PCB design. Participants will learn how AI enhances traditional workflows, offering capabilities beyond human limitations. From circuit optimization to error reduction, AI enables faster, smarter, and more precise design outcomes.
Through real-world examples, the session will highlight how AI is being used to solve common PCB design challenges, such as managing complex routing patterns, improving thermal performance, and reducing the time spent on iterative design revisions. These case studies will show how companies have integrated AI to address bottlenecks, reduce costs, and accelerate product development timelines.
Additionally, this webinar will explore the potential hurdles of adopting AI technologies in PCB design. Topics will include data preparation, the need for effective collaboration between engineers and AI systems, and the importance of validating AI-driven recommendations. Attendees will also get a glimpse into the future of AI in PCB design, including its role in fully autonomous design systems and its integration with next-generation technologies like augmented reality (AR) and virtual reality (VR).
What Participants Will Learn
1. How AI is transforming the design process in general.
2. The benefits of using AI are in improving efficiency and accuracy.
3. Key features and capabilities of AI-powered tools.
4. Real-world examples of AI solving design challenges.
5. Common challenges when adopting AI technologies.
6. Exciting future possibilities for AI in design and engineering.
IPC Design Day France 2025, IPC Designers Council France, proposed event taking place on April 3-4, 2025 at Hotel Pullman Aeroport Toulouse, France
IPC is teaming up with the U.S. Partnership for Assured Electronics (USPAE) to offer an expert-led discussion on the legal risks related to compliance with the Cybersecurity Maturity Model Certification (CMMC). This discussion will be held on November 19 at 1pm ET and will be led by Eric Crusius, a Partner at Holland & Knight.
IPC booth #A1-465
IPC, in collaboration with ChemFORWARD, welcome a variety of electronics manufacturing companies including electronics cleaning product formulators to attend this webinar to: Understand the utility of IPC-1402 in defining cleaning products and processes, determining impacts to humans and the environment, managing health and safety and physical hazard requirements, and how to verify and assess relevant criteria.
This webinar discusses new methods and techniques that use 3D X-ray microscopy (XRM), nanoscale imaging, and deep learning (DL) to visualize the internal structures and assemblies of electronic devices, e.g., ball grid array components (BGAs), column grid arrays, solder connections, underfill/staking, etc.
Key discussions include:
• Deep Learning Algorithms: These improve the quality of scans by enhancing contrast and reducing noise.
• DeepScout Tool: This tool uses 3D XRM scans from specific areas to train a neural network, allowing for high-resolution images to be created from lower-resolution data over a larger area.
These methods can be used independently or complementary to other multiscale correlative microscopy evaluations, e.g., electron microscopy. They provide valuable insights into electronic packages and integrated circuits, revealing details from large features (hundreds of mm) to microscopic details in electronic components (tens of nm). By using X-ray imaging and machine learning, along with other imaging methods, we can speed up development time, reduce costs, and simplify failure analysis (FA) and quality inspection of printed circuit boards (PCBs) and electronic devices assembled with new emerging technologies.
Design PCB layouts that meet performance requirements, pass validation, and move confidently into manufacturing.