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Devan Iyer, Industry Leader on Chips Packaging Technology, Joins IPC

Devan Iyer, Ph.D., one of the semiconductor industry’s leading technology experts, has joined IPC as its chief strategist for advanced packaging. In this newly created role, Dr. Iyer leads IPC's work with leading electronics companies and governments to identify and deliver news solutions to IPC members and the industry.

North American PCB Industry Sales Down 11.6 Percent in February

IPC announced today the February 2024 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.07.

North American EMS Industry Up 4.1 Percent in February

IPC announced today the February 2024 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.22.

iNEMI/IPC White Paper on Complex Integrated Systems Highlights Future Technology and Manufacturing Ecosystem Needs

iNEMI and IPC have recently published a white paper, “Complex Integrated Systems: The Future of Electronics Manufacturing,” intended to guide and focus cross-industry efforts and partnerships in the necessary research and development, as well as the manufacturing capability scale-up that will be critical to success.

Electronics Industry Sentiment Rises in March

Sentiment among electronics manufacturers remains positive, with demand reaching the highest level in a year, according to IPC’s March Sentiment of the Global Electronics Manufacturing Supply Chain Report.

Canon Taiwan Earns IPC J-STD-001 and IPC-A-610 Qualified Manufacturer’s Listing

IPC’s Validation Services Program has awarded an IPC Qualified Manufacturers Listing (QML) to Canon Taiwan, a leader in the optical industry, producing single-lens reflex/mirrorless digital cameras, camera lenses, accessories and network surveillance monitors.

IPC Releases “J” Revisions to Two Leading Standards for Electronics Assembly

IPC announces the release of revisions for two leading standards for the electronics assembly industry. IPC J-STD-001J, Requirements for Soldered Electrical and Electronic Assemblies is recognized as the sole industry-consensus standard for soldering processes and materials. IPC-A-610J, Acceptability of Electronic Assemblies, is a post-assembly acceptance standard used to ensure electronic assemblies meet acceptance requirements for the electronics industry.

IPC Announces New Board Members at IPC APEX EXPO 2024

At the 67th IPC Annual Meeting on April 9, held in conjunction with IPC APEX EXPO 2024, the IPC Board of Directors announced new officers and new and second-term members. Board officers serve a two-year term, board members serve a four-year term, and the student board member serves a one-year term.

IPC Publishes Comprehensive Strategy to Address Electronics Industry’s Global Workforce Challenge, Calls on Leaders in Government, Business and Education for Support

One of the most difficult and urgent challenges facing the electronics industry is a chronic shortage of adequately skilled workers. Today, IPC unveiled an expansion of its strategy to address the workforce challenges of the U.S. electronics manufacturing industry and called on its more than 3,000 member companies to join in the effort.

IPC Honors Summit Interconnect and Robert Bosch GmbH with Corporate Recognition Awards

IPC presented its highest corporate honors to two IPC member companies, Summit Interconnect and Robert Bosch GmbH during the IPC Annual Meeting/Awards Ceremony at IPC APEX EXPO 2024. The Peter Sarmanian Corporate Recognition Award was presented to Summit Interconnect and the Stan Plzak Corporate Recognition Award was presented to Robert Bosch GmbH.

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