IPC announces the release of IPC-8981, Quality and Reliability of E-Textile Wearables. This first-of-its-kind standard sets baselines for testing and classifying e-textile wearables, addressing key challenges in product reliability, performance, and quality assurance. IPC-8981 introduces a common framework for evaluating wearables that integrate electronics directly into textile materials—applications that span healthcare, defense, fitness, and consumer technology.
Employment in the European electronics sector is expected to grow according to a new study by Oxford Economics released today by IPC—Association Connecting Electronics Industries®. Such a trend would exacerbate issues created by an existing shortage of skilled workers according to our members.
IPC announces the promotion of Sanjay Huprikar to chief global officer. This newly created position reflects the association’s forward-looking strategy and industry needs to strengthen the electronics supply chain.
IPC applauds Chairman Jason Smith (R-MO) and the House Ways and Means Committee for advancing legislation that includes several top priorities for U.S. electronics manufacturers.
Electronics suppliers supporting the rapidly growing e-mobility sector are facing a dramatic escalation in environmental and social governance (ESG) compliance expectations. A new white paper from IPC’s e-Mobility Quality and Reliability Advisory Group provides a comprehensive overview of the evolving regulatory landscape and outlines the data infrastructure needed to stay ahead.
The 2025 Electrical Wire Processing Technology Expo (EWPTE), held May 6-8 at Baird Center in Milwaukee, Wis., provided 2,994 attendees the opportunity to meet, network and learn from the industry leading innovators and suppliers. Two hundred and eighteen (218) exhibitors -- marking the largest number of exhibiting companies in the event’s history -- showcased their products and services spanning an expanded 51,500 net square feet of show floor space.
The Global Electronics Association applauds the European Commission on releasing the Chips Act 2.0 as a critical part of the Technological Sovereignty Package. We are proud to have championed this comprehensive approach to the electronics ecosystem over many years, including in our recent industry reports and stakeholder meetings with the European Commission.
The German Electronics Design and Manufacturing Association (FED) and the Global Electronics Association are officially opening the Call for Abstracts for the 3rd Pan-European Electronics Design Conference (PEDC).
The Global Electronics Association announced today the March 2026 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.08.
The Global Electronics Association announced today the May 2026 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.60.