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Wage and Salary Survey for North American Electronics Assembly Companies Open Until November 1

IPC's biennial wage rate and salary survey for the North American electronics assembly industry is open with a response deadline of November 1. The confidential survey covers compensation for 40 hourly and salaried technical, manufacturing and sales positions at original equipment manufacturers (OEMS) and contract electronics manufacturing services (EMS) companies in North America. It also covers salary budget growth, planned increases for 2020, and employee benefits and policies.

Electronics Industry Executives Meet in DC to Urge Action on Pro-Manufacturing Policies

C-level executives from top electronics companies across the United States – all members of IPC – will gather in Washington, D.C. on May 21-23 for discussions with members of Congress and the Administration on issues that are critical to the future of the electronics industry and U.S. economy. IMPACT Washington, D.C. 2018 is IPC’s premier advocacy event, presenting members with the opportunity to conduct high-level meetings with their elected officials.

Newly Appointed IPC APEX EXPO Technical Program Committee Calls for IPC APEX EXPO 2022 Participation

The newly appointed IPC APEX EXPO Technical Program Committee (TPC) is inviting engineers, researchers, academics, technical experts, and industry leaders to submit technical conference abstracts for IPC APEX EXPO 2022 to be held at the San Diego Convention Center. The technical conference will take place January 25–27, 2022.

IPC and ITI to Host Conference on Critical and Emerging Environmental Product Requirements

PC and the Information Technology Industry Council (ITI) will host a virtual conference, “Critical and Emerging Environmental Product Requirements” on June 29 from 11:00 am to 3:30 pm EDT. The event will explore the latest environmental requirements that impact product design, manufacturing, supply chain management, and technology innovation.

Ventec International Group Awarded IPC-4101/40 Qualified Products Listing Certification

IPC's Validation Services Program has awarded Ventec International Group, a global electronics materials manufacturing company headquartered in Suzhou, China, a second IPC-4101 Qualified Products Listing (QPL). Ventec successfully qualified their products, VT-90H and VT-901, to specification sheet 40 of IPC-4101E, Specification for Base Materials for Rigid and Multilayer Printed Boards

More Than 50 CEOs Urge President Biden and Secretary Raimondo to Take Action to Improve Electronics Manufacturing Ecosystem

More than 50 CEOs urged Commerce Secretary Gina Raimondo to take concrete steps to address challenges confronting the entire U.S. electronics supply chain.   

North American PCB Industry Sales Up 6.0 Percent in April

IPC announced today the April 2021 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.16.

IPC Releases Additional Test Coupons for the IPC-2221B Gerber Coupon Generator

IPC – Association Connecting Electronics Industries® would like to announce the release of additional test coupons for the IPC-2221B Gerber Coupon Generator, an exclusive annual subscription service for IPC member companies. The IPC-2221B Gerber Coupon Generator subscription service is the only service providing new, industry approved test coupons addressing blind, buried, stacked and staggered via structures. The most commonly used coupons for product acceptance are “AB,” “AB/R” and “D” which were introduced in 2016.

Economic Recovery Continues Across the Globe

In this month’s (May 2021) economic outlook report from IPC, you will find U.S. and European data on economic growth, employment, consumer sentiment, manufacturers’ sentiment (PMI), manufacturing capacity utilization and end markets for electronics.

EMS North America Industry Report, April 2021

IPC announced today the April 2021 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.62.

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