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Automated Optical Inspection: Implications on Board Assembly

The International Electronics Manufacturing Initiative (iNEMI) is conducting an industry-wide survey to assess the development of artificial intelligence (AI) and its implementation for automated optical inspection (AOI) in board assembly. 

Does Your Member of Congress Support the Electronics Industry Supply Chain?

IPC is leading the charge and rallying support among our member companies and other industry groups for a bill in the U.S. House of Representatives that would, if enacted, benefit the U.S. printed circuit board (PCB) sector and the broader electronics industry supply chain.

The U.S. Economy Needs the Bipartisan Innovation Act and the PCB Act

The U.S. Economy Needs the Bipartisan Innovation Act and the PCB Act

Advocacy, Standards, Events, and Education – All Highlighted in IPC's New European Subsidiary

John W. Mitchell, IPC president and CEO, announces IPC’s new subsidiary, IPC Electronics Europe GmbH

New IPC Director: Lorena Villanueva Elected as Director of IPC Mexico

Lorena Villanueva has joined IPC as Director of IPC Mexico.

Four Things to Know About IPC’s Recently Released “Quality Benchmarks for the Electronics Assembly Industry”

IPC has recently released “Quality Benchmarks for the Electronics Assembly Industry,” a biennial report that compiles and analyzes survey results from over 50 assembly companies, mostly comprised of contract electronics manufacturing service (EMS) companies and original equipment manufacturers (OEMs).

Beyond Moore’s Law – Enabling Heterogeneous Integration and Next Generation Chiplet Architectures

The Hall of Fame Council, key contributors to IPC, and members from diverse backgrounds in electronics manufacturing provide strong backing and support for the IPC effort, with members of the group committed to helping in several ways.

IPC Analysis Shows Leading Companies Are Intentional About Tracking Environmental and Social Risks

Leading companies in the electronics manufacturing industry are highly intentional about their environmental, social and governance (ESG) priorities, with climate change and energy use among the most closely scrutinized issues, an IPC analysis shows.

Secure your Spot at IPC’s Advanced Packaging Symposium, October 11-12

IPC President and CEO John Mitchell invites you to join us in Washington, D.C. for a two-day meeting focused on the opportunities and challenges for next-generation advanced packaging production, public policy updates, commercial and defense electronics industry drivers, current business environment for IC substrates and component assembly and test manufacturing.

IPC, European Parliament Work to Bolster European Chips Act

Last week, Member of the European Parliament (MEP) Eva Maydell expressed to participants of IPC’s European Executive Forum her commitment to see a European Chips Act that would bolster the entire semiconductor ecosystem, including those segments critical to advanced packaging. 

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