Pursuant to Section 845 of the Fiscal 2019 National Defense Authorization Act (NDAA), the U.S. Department of Defense (DoD) is required to provide an assessment of the defense electronics industrial base to Congress by January 31, 2019.
One of the biggest events to occur in the political and policy world in the last month was, of course, the U.S. midterm elections, in which the Democrats gained almost 40 seats in the House of Representatives while minimizing their losses in the U.S. Senate. The incoming Congress will be younger and more diverse than ever. Several key moderates and senior leaders will be leaving the scene.
The election results are likely to bring even more partisan gridlock to Washington in the months ahead.
The U.S.
The IPC V-TSL-MVIA Weak Interface Microvia Failures Technology Solutions Subcommittee, formed this year, is working to identify the risks, causes, and mitigation of failures due to a weak interface between the plated copper at the bottom of a microvia and the underlying copper surface. The activity grew out of the development of IPC-WP-023, a white paper that cast a light on how a weak microvia interface is a hidden reliability threat.
The subcommittee will hold an open forum for industry to learn about its activities as well as its planned path forward.
In Part 10 of IPC President and CEO John Mitchell’s blog series on workforce issue, John covers gender differences in the workplace.
As I mentioned last week, in Part 5: Demographic Differences, we reviewed two primary topics: generational differences and gender differences.
IPC president and CEO John Mitchell invites you to attend IPC APEX EXPO 2019. From the show floor to the class room and all points in between, IPC APEX EXPO 2019 is THE place to be to learn, network, and conduct business.
https://youtu.be/jlr0XVekkKo
By Chris Jorgensen, director, technology transfer
IPC has received interest from several volunteers in Europe to form an e-textiles standards interest group in Europe. Volunteers from this group would meet to influence IPC standards activities, form working groups to develop new IPC standards and to network under the umbrella of developing standards.
If you would like to be added to the roster for this interest group, so you can stay abreast of its activities, e-mail me at ChrisJorgensen@ipc.org.
The IPC V-TSL-MVIA Weak Interface Microvia Failures Technology Solutions Subcommittee formed in 2018 to identify the need to identify the risks, causes, and mitigation of failures due to a weak interface between the plated copper at the bottom of a microvia and the underlying copper surface.
The subcommittee will hold an open forum during IPC APEX EXPO for industry to discuss this important topic and how industry can come together to address it.
Are you building military boards or circuits for 5G?
by Ken Schramko, senior director, North American government relations
You have probably seen news reports about the various ways that the U.S. Government partial shutdown is affecting "regular people."
So we were wondering: How it is affecting the electronics industry, if at all? How is it affecting your company?
Please help us by taking a minute now to answer an IPC survey on this issue. Your answers will help us understand the situation better and advocate on your behalf.