Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Bending,Forming and Flexing Printed Circuits
In the printed circuit board industry there are generally two main types of circuit boards; there are rigid printed circuit boards and flexible printed circuit boards. There is a tremendous var
.. weiterlesen
Precision Coating Deposition Techniques for Conformal Coating Applications
Precise control of coating deposition is critical to the application of conformal coatings to selected areas of printed circuit board assemblies. The coating must be applied in a defined patter
.. weiterlesen
The Role of Permeability and Ion Transport In Conformal Coating Protection
The level of protection offered by a range of conformal coatings on electronic assemblies has been evaluated. The role of permeability and ion transport is the primary interest. Testing was car
.. weiterlesen
The Ems Market for Tier II & III Providers
In the global Electronic Manufacturing Services (EMS) market,we constantly hear news of the major ("Big 6") players—Foxconn,Flextronics,Sanmina-SCI,Solectron,Celestica,Jabil—as well as others.
.. weiterlesen
Increasing Profitability through Process Optimization: Better Than Outsourcing
Research has shown that U.S. companies can realize higher profits over outsourcing by putting their houses in order and finetuning their production processes,with automation being a key contrib
.. weiterlesen
BGA Solder Joint Mechanical Risk Assessment during System Level Shock Test
The pressure to reduce overall form-factor size in the high volume chassis desktop market is driving the need to integrate components at the system level. Adding to the challenge of size reduct
.. weiterlesen
THE EFFECT OF FILLING VIA-IN-PAD ON VOIDING RATES IN PWB ASSEMBLY FOR BGA COMPONENTS
The debate on the effect of voiding on BGA reliability has continued for years. Many PWB assemblers strive to minimize voiding,particularly with the advent of lead-free processing and in fine f
.. weiterlesen
Aerospace Response to Lead-free Solder - A Program Manager’s Guide
On July 1,2006,lead and certain other hazardous materials were banned from most forms of new electronic equipment in the countries of the European Union. Although most aerospace products are no
.. weiterlesen
Experience in Processing EEE Components with Pure Electroplated Tin Leads As a
The regulatory measures defined in MIL performance standards that govern production of active and passive electronic components ban the application of pure Sn plated leads for EEE parts. The st
.. weiterlesen
Examination of Common Delamination Resistance Tests for Electrical Grade
The delamination of electrical grade laminates continues to be a vexing problem for the printed circuit board industry. Laminates are commonly tailored to meet specific thickness and dielectric
.. weiterlesen
Lead Free Assembly Impacts on Laminate Material Properties and “Pad Crater” Failures
Printed circuit board (PCB) feature sizes are decreasing to support increasing density thrusts for electronic products and packaging. The transition to lead-free products has changed the stress
.. weiterlesen
Comparative Study of Phosphorus-based Flame Retardants in Halogen-Free Laminates
This paper compares performance of two phosphorus-based flame retardants: poly-(m-phenylene methyl phosphonate) (PPMP) recently introduced to the market and 9,10-dihydro-9-oxa-10-phosphenanthre
.. weiterlesen
VERIFYING MICROVOID ELIMINATION AND PREVENTION VIA AN OPTIMIZED IMMERSION SILVER PROCESS
The Pb-free transition in the electronics industry has seen immersion silver emerge as a leading circuit board finish for RoHS compliant processes and products. It is utilized in a wide cross-s
.. weiterlesen
A STUDY OF PLANAR MICROVOIDING IN Pb-FREE SOLDER JOINTS
Planar microvoids have been observed on second level interconnections between solder metallizations and copper lands on PCB boards with immersion silver surface finish. These planar microvoids
.. weiterlesen
Corrosion Resistance of PWB Final Finishes
As the electronic industry is moving to lead-free PWB final finishes and high density circuit boards,the widely used PWB finish,SnPb HASL,has to be replaced with a lead-free and coplanar PWB fi
.. weiterlesen
Production Test Methodology to Determine High Frequency Signal Loss of PWB
A new low cost,simple and repeatable production test method for measuring signal loss of printed wiring board (PWB) interconnects is discussed. The method uses Time Domain Reflectometry (TDR) t
.. weiterlesen
The Socketless Revolution Larger Probes on Smaller Center Test Targets Application of the Socketless Probe Technology to PCB Manufacturing and...
As technology progresses,electronic components that do bigger and better things are hitting the market. At the same time,the size of the PCB is shrinking. While circuit board designers could re
.. weiterlesen
Reflow Process Control Monitoring,and Data Logging
With the introduction of lead free electronics assembly worldwide,greater concerns are raised over factory control of materials and processes. Due to the mix of both leaded and lead free produc
.. weiterlesen
Laser Cutting - a Novel Method of Depaneling
There are many issues to be considered in the manufacturing of state-of-the-art electronic products. Today's electronic devices,whether based on flexible (FPC) or rigid (PCB) printed circuit bo
.. weiterlesen
Performance of China Alloy SnAgCuCe in Reflow Soldering
Work on assisting China's Ministry of Information Industry (MII) to assess the performance of a solder paste using the China alloy Sn3.0Ag0.5Cu0.019Ce (SACCe) was completed. Two Indium fluxes w
.. weiterlesen
The Lead-Free Wave Solder Process and Its Effect on Laminates
The pressure on manufacturers of electronic devices to continually reduce the cost of products has continued,despite the challenges of higher cost lead-free production. In many cases assemblers
.. weiterlesen
The Lead-Free Wave Solder Process and Its Effect on Laminates
The pressure on manufacturers of electronic devices to continually reduce the cost of products has continued,despite the challenges of higher cost lead-free production. In many cases assemblers
.. weiterlesen
Effects of Reflow Profile and Thermal Shock on Intermetallic Compound Thickness for SnPb and SnAgCu Solder Joints
During the solder reflow processes many reactions occur. There is the reduction of oxides on the metal surfaces,metal dissolution,wetting to different surfaces,and intermetallic compound format
.. weiterlesen
A Method to Evaluate PCBA Suppliers’ Pb Free vs. Leaded Processes for Telecom
The purpose of this program was to evaluate the solder joint reliability,using the IPC-9701 standard as a guideline,of PCBAs that were assembled with conventional leaded and ROHS compliant lead
.. weiterlesen
Durability of Repaired and Aged Lead-free Electronic Assemblies
The reliability of aged and repaired lead-free and mixed lead-free/lead-based solder interconnects is an important issue for electronic equipment manufacturers. As a result of the global transi
.. weiterlesen
Durability of Repaired and Aged Lead-free Electronic Assemblies
The reliability of aged and repaired lead-free and mixed lead-free/lead-based solder interconnects is an important issue for electronic equipment manufacturers. As a result of the global transi
.. weiterlesen
Thin Film Embedded Resistor Processing in Sequential Lamination Printed Circuit
New interconnect technologies continue to shrink feature size,increase routing complexity and component density in multilayer rigid and rigid-flex printed circuits. Printed circuit fabricators
.. weiterlesen
Thin Film Embedded Resistor Processing in Sequential Lamination Printed Circuit
New interconnect technologies continue to shrink feature size,increase routing complexity and component density in multilayer rigid and rigid-flex printed circuits. Printed circuit fabricators
.. weiterlesen
Using Embedded Capacitance to Improve Electrical Performance,Eliminate Capacitors and Reduce Board Size In High Speed Digital and RF Applications
The global electronics industry is exhibiting a widespread and growing interest in the technology of embedded passives. This interest can be attributed to three primary benefits. First,embedded
.. weiterlesen
Development of Novel Thin Material for Decoupling Capacitors Embedded in PWBs
Many techniques have been developed to embed capacitors in printed wiring boards (PWBs) these days. The simplest way may be embedding chip capacitors in PWBs. However,since their thickness is o
.. weiterlesen
Bending,Forming and Flexing Printed Circuits
In the printed circuit board industry there are generally two main types of circuit boards; there are rigid printed circuit boards and flexible printed circuit boards. There is a tremendous var
.. weiterlesen
Precision Coating Deposition Techniques for Conformal Coating Applications
Precise control of coating deposition is critical to the application of conformal coatings to selected areas of printed circuit board assemblies. The coating must be applied in a defined patter
.. weiterlesen
The Role of Permeability and Ion Transport In Conformal Coating Protection
The level of protection offered by a range of conformal coatings on electronic assemblies has been evaluated. The role of permeability and ion transport is the primary interest. Testing was car
.. weiterlesen
The Ems Market for Tier II & III Providers
In the global Electronic Manufacturing Services (EMS) market,we constantly hear news of the major ("Big 6") players—Foxconn,Flextronics,Sanmina-SCI,Solectron,Celestica,Jabil—as well as others.
.. weiterlesen
Increasing Profitability through Process Optimization: Better Than Outsourcing
Research has shown that U.S. companies can realize higher profits over outsourcing by putting their houses in order and finetuning their production processes,with automation being a key contrib
.. weiterlesen
BGA Solder Joint Mechanical Risk Assessment during System Level Shock Test
The pressure to reduce overall form-factor size in the high volume chassis desktop market is driving the need to integrate components at the system level. Adding to the challenge of size reduct
.. weiterlesen
THE EFFECT OF FILLING VIA-IN-PAD ON VOIDING RATES IN PWB ASSEMBLY FOR BGA COMPONENTS
The debate on the effect of voiding on BGA reliability has continued for years. Many PWB assemblers strive to minimize voiding,particularly with the advent of lead-free processing and in fine f
.. weiterlesen
Aerospace Response to Lead-free Solder - A Program Manager’s Guide
On July 1,2006,lead and certain other hazardous materials were banned from most forms of new electronic equipment in the countries of the European Union. Although most aerospace products are no
.. weiterlesen
Experience in Processing EEE Components with Pure Electroplated Tin Leads As a
The regulatory measures defined in MIL performance standards that govern production of active and passive electronic components ban the application of pure Sn plated leads for EEE parts. The st
.. weiterlesen
Examination of Common Delamination Resistance Tests for Electrical Grade
The delamination of electrical grade laminates continues to be a vexing problem for the printed circuit board industry. Laminates are commonly tailored to meet specific thickness and dielectric
.. weiterlesen
Lead Free Assembly Impacts on Laminate Material Properties and “Pad Crater” Failures
Printed circuit board (PCB) feature sizes are decreasing to support increasing density thrusts for electronic products and packaging. The transition to lead-free products has changed the stress
.. weiterlesen
Comparative Study of Phosphorus-based Flame Retardants in Halogen-Free Laminates
This paper compares performance of two phosphorus-based flame retardants: poly-(m-phenylene methyl phosphonate) (PPMP) recently introduced to the market and 9,10-dihydro-9-oxa-10-phosphenanthre
.. weiterlesen
VERIFYING MICROVOID ELIMINATION AND PREVENTION VIA AN OPTIMIZED IMMERSION SILVER PROCESS
The Pb-free transition in the electronics industry has seen immersion silver emerge as a leading circuit board finish for RoHS compliant processes and products. It is utilized in a wide cross-s
.. weiterlesen
A STUDY OF PLANAR MICROVOIDING IN Pb-FREE SOLDER JOINTS
Planar microvoids have been observed on second level interconnections between solder metallizations and copper lands on PCB boards with immersion silver surface finish. These planar microvoids
.. weiterlesen
Corrosion Resistance of PWB Final Finishes
As the electronic industry is moving to lead-free PWB final finishes and high density circuit boards,the widely used PWB finish,SnPb HASL,has to be replaced with a lead-free and coplanar PWB fi
.. weiterlesen
Production Test Methodology to Determine High Frequency Signal Loss of PWB
A new low cost,simple and repeatable production test method for measuring signal loss of printed wiring board (PWB) interconnects is discussed. The method uses Time Domain Reflectometry (TDR) t
.. weiterlesen
The Socketless Revolution Larger Probes on Smaller Center Test Targets Application of the Socketless Probe Technology to PCB Manufacturing and...
As technology progresses,electronic components that do bigger and better things are hitting the market. At the same time,the size of the PCB is shrinking. While circuit board designers could re
.. weiterlesen
Reflow Process Control Monitoring,and Data Logging
With the introduction of lead free electronics assembly worldwide,greater concerns are raised over factory control of materials and processes. Due to the mix of both leaded and lead free produc
.. weiterlesen
Laser Cutting - a Novel Method of Depaneling
There are many issues to be considered in the manufacturing of state-of-the-art electronic products. Today's electronic devices,whether based on flexible (FPC) or rigid (PCB) printed circuit bo
.. weiterlesen
Performance of China Alloy SnAgCuCe in Reflow Soldering
Work on assisting China's Ministry of Information Industry (MII) to assess the performance of a solder paste using the China alloy Sn3.0Ag0.5Cu0.019Ce (SACCe) was completed. Two Indium fluxes w
.. weiterlesen
The Lead-Free Wave Solder Process and Its Effect on Laminates
The pressure on manufacturers of electronic devices to continually reduce the cost of products has continued,despite the challenges of higher cost lead-free production. In many cases assemblers
.. weiterlesen
The Lead-Free Wave Solder Process and Its Effect on Laminates
The pressure on manufacturers of electronic devices to continually reduce the cost of products has continued,despite the challenges of higher cost lead-free production. In many cases assemblers
.. weiterlesen
Effects of Reflow Profile and Thermal Shock on Intermetallic Compound Thickness for SnPb and SnAgCu Solder Joints
During the solder reflow processes many reactions occur. There is the reduction of oxides on the metal surfaces,metal dissolution,wetting to different surfaces,and intermetallic compound format
.. weiterlesen
A Method to Evaluate PCBA Suppliers’ Pb Free vs. Leaded Processes for Telecom
The purpose of this program was to evaluate the solder joint reliability,using the IPC-9701 standard as a guideline,of PCBAs that were assembled with conventional leaded and ROHS compliant lead
.. weiterlesen
Durability of Repaired and Aged Lead-free Electronic Assemblies
The reliability of aged and repaired lead-free and mixed lead-free/lead-based solder interconnects is an important issue for electronic equipment manufacturers. As a result of the global transi
.. weiterlesen
Durability of Repaired and Aged Lead-free Electronic Assemblies
The reliability of aged and repaired lead-free and mixed lead-free/lead-based solder interconnects is an important issue for electronic equipment manufacturers. As a result of the global transi
.. weiterlesen
Thin Film Embedded Resistor Processing in Sequential Lamination Printed Circuit
New interconnect technologies continue to shrink feature size,increase routing complexity and component density in multilayer rigid and rigid-flex printed circuits. Printed circuit fabricators
.. weiterlesen
Thin Film Embedded Resistor Processing in Sequential Lamination Printed Circuit
New interconnect technologies continue to shrink feature size,increase routing complexity and component density in multilayer rigid and rigid-flex printed circuits. Printed circuit fabricators
.. weiterlesen
Using Embedded Capacitance to Improve Electrical Performance,Eliminate Capacitors and Reduce Board Size In High Speed Digital and RF Applications
The global electronics industry is exhibiting a widespread and growing interest in the technology of embedded passives. This interest can be attributed to three primary benefits. First,embedded
.. weiterlesen
Development of Novel Thin Material for Decoupling Capacitors Embedded in PWBs
Many techniques have been developed to embed capacitors in printed wiring boards (PWBs) these days. The simplest way may be embedding chip capacitors in PWBs. However,since their thickness is o
.. weiterlesen