Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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An Analytical Analysis of the Fluid Mechanics Involved In PCB Plating
It has been the conventional wisdom of the industry that the predominate board parameter associated with through hole plating is the aspect ratio of the through hole. While this is intuitively
.. weiterlesen
The Advantages of Mildly Alkaline Immersion Silver as a Final Finish for Solderability
The immersion silver process has become the first choice of final finishing for many original equipment manufacturers (OEM) because of its shortened process flow,good conductivity,even depositi
.. weiterlesen
Uninformed Plating of Micro vias and Blind vias
Jobs are becoming more difficult to complete to specifications as the complexity of parts increases. With electronic power components getting more advanced everyday reverse pulse technology is
.. weiterlesen
Direct Plating for Flex and Rigid-Flex Boards
In manufacturing flexible and rigid-flex boards,the metallization step using electroless copper poses a major challenge,namely the leaching of polyimide base material into the plating bath. Lea
.. weiterlesen
The New Lead Free Assembly Rework Solution Using Low Melting Alloys
This paper describes a new lead-free SMT rework process which avoids component overheating,reduces board warpage and cratering,and prevents adjacent components from thermal damage. In the repla
.. weiterlesen
Determining the Reliability of Tacky Fluxes in Varying Soldering Applications
The use of tacky fluxes is common throughout the industry in applications such as ball attach,BGA repair and hand soldering. These applications employ different heating profiles,meaning that th
.. weiterlesen
Lead-free Rework Experiences Using SAC and Sn-Cu Based Alloys
As companies transition over to lead-free assembly a certain amount of hand-soldering and rework will be performed. An article from Tech Search International last year did state that in Asia wh
.. weiterlesen
Effects of BGA Rework Cycles on PCB Assembly Reliability
BGA component removal and replacement are required during product development and repair operations. In general,a single rework on specific location is permitted without causing excessive damag
.. weiterlesen
Novel SACX Solders with Drop Test Performance Outperforming Eutectic Tin-Lead
A family of SACX alloys has been developed with significant improvement in drop test performance on NiAu surface finish. Dopants such as Mn,Bi,Ti,Ce,and to a less extent Y for SAC105 have been
.. weiterlesen
Wafer Bumping Stenciling Techniques with Solder Paste
Wafer bumping using thin electroformed nickel stencils with ultra fine powder solder paste continues to gain popularity as a cost effective alternative to ball drop and electroplated technologi
.. weiterlesen
Thixotropy of Solder Paste Impacts Repeatability and Reproducibility of Rheometric Results
The widespread use of SAC-based (SnAgCu) lead-free solder paste drives the industry toward a smaller process window. This is due to higher reflow temperatures as well as the limited thermal res
.. weiterlesen
Sublimation of Two Dicarboxylic Acids Used in Solder Pastes
Our industry is slowly coming to the realization that many fluxes containing low molecular weight carboxylic acids cannot be adequately tested for surface insulation resistance and electrochemi
.. weiterlesen
Parylene as a Suppressant for Tin Whiskers Growth on Printed Circuit Boards
With the implementation of RoHS directives,pure tin plating is replacing lead in the tin-alloy used in the printed circuit boards and other worldwide electronics. Although use of tin provides a
.. weiterlesen
New Methods to Efficiently Test the Reliability of Plated Vias and to Model Plated Via Life from Laminate Material Data
This paper continues work by Sun Microsystems and the University of Maryland,CALCE[1] to predict plated through via life using laminate material properties,plated copper material properties,and
.. weiterlesen
A DOE to assess PCB fabrication material design and process using IST (Interconnect Stress Testing) to improve fine pitch BGA...
During the development of a new medical imaging system,via quality was identified as a potentially source of infantile failures. Premature via failures were precipitated in a critical 14 layer
.. weiterlesen
Process Development for 01005 Lead-Free Passive Assembly: Stencil Printing
For some years now,an area ratio of 0.66 or greater has been the criterion for stencil apertures to achieve acceptable volume control in the printed solder paste “brick,” for small apertures Me
.. weiterlesen
Mass Reflow Assembly of 01005 Components
As the electronics assembly industry adjusts to building boards with 0201 components,the next level of shrinkage for chip components is just around the corner with the emergence of 01005s. A ke
.. weiterlesen
Optimizing Pallet Materials for Long Life and Ease of Machining
This paper will present seven different materials used for the production of both wave solder and reflow solder pallets. The goal of this study will be for the purpose of depicting machining ca
.. weiterlesen
Liquid Tin Corrosion and Lead Free Wave Soldering
Corrosion of solder pots and solder pot components in wave soldering equipment has been reduced with the introduction of corrosion resistant coatings and improved lead free solder alloys. The l
.. weiterlesen
Lessons Learned About Laminates during Migration to Lead-Free Soldering
This paper provides a high-level overview of many of the key lessons learned thus far in working with PCB fabricators in qualifying laminate/fabrication processes that will yield fundamental pr
.. weiterlesen
Reflow Defects with Lead-Free Soldering Moisture Sensitive Components
Soldering with lead-free solders has become an international standard. A study conducted by the Dresden Technical University and rehm Anlagenbau examines which influences various parameters hav
.. weiterlesen
Effect of Conformal Coating on Tin Whisker Growth
This paper will present the testing performed to date by Lockheed Martin Missiles and Fire Control on Tin Whisker test coupons. Coupons are representative lead materials and are half coated wit
.. weiterlesen
Whisker Penetration into Conformal Coating
Tin whiskers are needle-like crystals of tin growing from pure tin or high-tin alloy surfaces,which may grow long enough to cause electrical shorts. Conformal coatings provide some protection a
.. weiterlesen
Via Hole Filling Technology for High Density,High Aspect Ratio Printed Wiring Boards Using a High Tg,low CTE Plugging Paste
The continued fast pace towards miniaturization is leading circuit board designers to push the envelope on integration density. This trend is driving fabricators to closely look at methods and
.. weiterlesen
Lead Free Assembly Qualification of ALIVH Boards
The migration to lead free reflow is bringing many challenges for the PCB industry. High Tg laminates,stability of materials thru 2X reflows,rework,moisture sensitivity etc. This requires caref
.. weiterlesen
Reliability of Mis-registered HDI Plated Through Holes
Mechanically drilled through holes in PWBs form interconnects between copper layers through the use of copper pads. These pads are larger than the drill diameter to account for such factors as
.. weiterlesen
Determining Area Ratio Rule for Type 4 and Type 5 Solder Paste
Stencil design is one of the key factors in determining how well any particular stencil will print solder paste. Today’s high volume,24 hour a day,seven days a week manufacturing operations req
.. weiterlesen
Process Development and Characterization of the Stencil Printing Process for Small Apertures
The consumer’s interest for smaller,lighter and higher performance electronics products has increased the use of ultra fine pitch packages,such as Flip Chips and Chip Scale Packages,in printed
.. weiterlesen
Investigation into the Mass Imaging aspects of 0.3mm Wafer Level Chip Scale Package solder paste deposition
fast approaching this horizon is the 0.3mm CSP. This device represents a major assembly revolution within the Surface mount assembly (SMT) arena. The implementation of this device will require
.. weiterlesen
Large and Thick Board Lead-Free Wave Soldering Optimization
This paper presents the results of our study on the development and optimization of lead-free wave soldering process for large and thick printed circuit boards (PCB),through multiple designs of
.. weiterlesen
An Analytical Analysis of the Fluid Mechanics Involved In PCB Plating
It has been the conventional wisdom of the industry that the predominate board parameter associated with through hole plating is the aspect ratio of the through hole. While this is intuitively
.. weiterlesen
The Advantages of Mildly Alkaline Immersion Silver as a Final Finish for Solderability
The immersion silver process has become the first choice of final finishing for many original equipment manufacturers (OEM) because of its shortened process flow,good conductivity,even depositi
.. weiterlesen
Uninformed Plating of Micro vias and Blind vias
Jobs are becoming more difficult to complete to specifications as the complexity of parts increases. With electronic power components getting more advanced everyday reverse pulse technology is
.. weiterlesen
Direct Plating for Flex and Rigid-Flex Boards
In manufacturing flexible and rigid-flex boards,the metallization step using electroless copper poses a major challenge,namely the leaching of polyimide base material into the plating bath. Lea
.. weiterlesen
The New Lead Free Assembly Rework Solution Using Low Melting Alloys
This paper describes a new lead-free SMT rework process which avoids component overheating,reduces board warpage and cratering,and prevents adjacent components from thermal damage. In the repla
.. weiterlesen
Determining the Reliability of Tacky Fluxes in Varying Soldering Applications
The use of tacky fluxes is common throughout the industry in applications such as ball attach,BGA repair and hand soldering. These applications employ different heating profiles,meaning that th
.. weiterlesen
Lead-free Rework Experiences Using SAC and Sn-Cu Based Alloys
As companies transition over to lead-free assembly a certain amount of hand-soldering and rework will be performed. An article from Tech Search International last year did state that in Asia wh
.. weiterlesen
Effects of BGA Rework Cycles on PCB Assembly Reliability
BGA component removal and replacement are required during product development and repair operations. In general,a single rework on specific location is permitted without causing excessive damag
.. weiterlesen
Novel SACX Solders with Drop Test Performance Outperforming Eutectic Tin-Lead
A family of SACX alloys has been developed with significant improvement in drop test performance on NiAu surface finish. Dopants such as Mn,Bi,Ti,Ce,and to a less extent Y for SAC105 have been
.. weiterlesen
Wafer Bumping Stenciling Techniques with Solder Paste
Wafer bumping using thin electroformed nickel stencils with ultra fine powder solder paste continues to gain popularity as a cost effective alternative to ball drop and electroplated technologi
.. weiterlesen
Thixotropy of Solder Paste Impacts Repeatability and Reproducibility of Rheometric Results
The widespread use of SAC-based (SnAgCu) lead-free solder paste drives the industry toward a smaller process window. This is due to higher reflow temperatures as well as the limited thermal res
.. weiterlesen
Sublimation of Two Dicarboxylic Acids Used in Solder Pastes
Our industry is slowly coming to the realization that many fluxes containing low molecular weight carboxylic acids cannot be adequately tested for surface insulation resistance and electrochemi
.. weiterlesen
Parylene as a Suppressant for Tin Whiskers Growth on Printed Circuit Boards
With the implementation of RoHS directives,pure tin plating is replacing lead in the tin-alloy used in the printed circuit boards and other worldwide electronics. Although use of tin provides a
.. weiterlesen
New Methods to Efficiently Test the Reliability of Plated Vias and to Model Plated Via Life from Laminate Material Data
This paper continues work by Sun Microsystems and the University of Maryland,CALCE[1] to predict plated through via life using laminate material properties,plated copper material properties,and
.. weiterlesen
A DOE to assess PCB fabrication material design and process using IST (Interconnect Stress Testing) to improve fine pitch BGA...
During the development of a new medical imaging system,via quality was identified as a potentially source of infantile failures. Premature via failures were precipitated in a critical 14 layer
.. weiterlesen
Process Development for 01005 Lead-Free Passive Assembly: Stencil Printing
For some years now,an area ratio of 0.66 or greater has been the criterion for stencil apertures to achieve acceptable volume control in the printed solder paste “brick,” for small apertures Me
.. weiterlesen
Mass Reflow Assembly of 01005 Components
As the electronics assembly industry adjusts to building boards with 0201 components,the next level of shrinkage for chip components is just around the corner with the emergence of 01005s. A ke
.. weiterlesen
Optimizing Pallet Materials for Long Life and Ease of Machining
This paper will present seven different materials used for the production of both wave solder and reflow solder pallets. The goal of this study will be for the purpose of depicting machining ca
.. weiterlesen
Liquid Tin Corrosion and Lead Free Wave Soldering
Corrosion of solder pots and solder pot components in wave soldering equipment has been reduced with the introduction of corrosion resistant coatings and improved lead free solder alloys. The l
.. weiterlesen
Lessons Learned About Laminates during Migration to Lead-Free Soldering
This paper provides a high-level overview of many of the key lessons learned thus far in working with PCB fabricators in qualifying laminate/fabrication processes that will yield fundamental pr
.. weiterlesen
Reflow Defects with Lead-Free Soldering Moisture Sensitive Components
Soldering with lead-free solders has become an international standard. A study conducted by the Dresden Technical University and rehm Anlagenbau examines which influences various parameters hav
.. weiterlesen
Effect of Conformal Coating on Tin Whisker Growth
This paper will present the testing performed to date by Lockheed Martin Missiles and Fire Control on Tin Whisker test coupons. Coupons are representative lead materials and are half coated wit
.. weiterlesen
Whisker Penetration into Conformal Coating
Tin whiskers are needle-like crystals of tin growing from pure tin or high-tin alloy surfaces,which may grow long enough to cause electrical shorts. Conformal coatings provide some protection a
.. weiterlesen
Via Hole Filling Technology for High Density,High Aspect Ratio Printed Wiring Boards Using a High Tg,low CTE Plugging Paste
The continued fast pace towards miniaturization is leading circuit board designers to push the envelope on integration density. This trend is driving fabricators to closely look at methods and
.. weiterlesen
Lead Free Assembly Qualification of ALIVH Boards
The migration to lead free reflow is bringing many challenges for the PCB industry. High Tg laminates,stability of materials thru 2X reflows,rework,moisture sensitivity etc. This requires caref
.. weiterlesen
Reliability of Mis-registered HDI Plated Through Holes
Mechanically drilled through holes in PWBs form interconnects between copper layers through the use of copper pads. These pads are larger than the drill diameter to account for such factors as
.. weiterlesen
Determining Area Ratio Rule for Type 4 and Type 5 Solder Paste
Stencil design is one of the key factors in determining how well any particular stencil will print solder paste. Today’s high volume,24 hour a day,seven days a week manufacturing operations req
.. weiterlesen
Process Development and Characterization of the Stencil Printing Process for Small Apertures
The consumer’s interest for smaller,lighter and higher performance electronics products has increased the use of ultra fine pitch packages,such as Flip Chips and Chip Scale Packages,in printed
.. weiterlesen
Investigation into the Mass Imaging aspects of 0.3mm Wafer Level Chip Scale Package solder paste deposition
fast approaching this horizon is the 0.3mm CSP. This device represents a major assembly revolution within the Surface mount assembly (SMT) arena. The implementation of this device will require
.. weiterlesen
Large and Thick Board Lead-Free Wave Soldering Optimization
This paper presents the results of our study on the development and optimization of lead-free wave soldering process for large and thick printed circuit boards (PCB),through multiple designs of
.. weiterlesen